Datasheet

4
HCPL-817-300E
Solder Reow Temperature Prole
Absolute Maximum Ratings (T
A
= 25˚C)
Storage Temperature, T
S
–55˚C to +125˚C
Operating Temperature, T
A
–30˚C to +100˚C
Lead Solder Temperature, max. 260˚C for 10 s
(1.6 mm below seating plane)
Average Forward Current, I
F
50 mA
Reverse Input Voltage, V
R
6 V
Input Power Dissipation, P
I
70 mW
Collector Current, I
C
50 mA
Collector-Emitter Voltage, V
CEO
70 V
Emitter-Collector Voltage, V
ECO
6 V
Collector Power Dissipation 150 mW
Total Power Dissipation 200 mW
Isolation Voltage, V
iso
(AC for 1 minute, R.H. = 40 ~ 60%) 5000 Vrms
6.5 ± 0.5
(0.256)
DIMENSIONS IN MILLIMETERS AND (INCHES)
4.6 ± 0.5
(0.181)
2.54 ± 0.25
(0.1)
3.5 ± 0.5
(0.138)
7.62 ± 0.3
(0.3)
0.26
(0.010)
10.16 ± 0.3
(0.4)
1.2 ± 0.1
(0.047)
0.35 ± 0.25
(0.014)
1.0 ± 0.25
(0.039)
A 817
Y W W
DATE CODE
RANK
LEAD FREE
ANODE
Note: Non-halide ux should be used.
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25
°
C
150°C
200°C
250
°
C
260°C (Peak Temperature)
217
°
C
Time (sec)
Temperature (
°
C)
1) One-time soldering reow is recommended
within the condition of temperature and time
prole shown.
2) When using another soldering method such
as infrared ray lamp, the temperature may
rise partially in the mold of thedevice. Keep
the temperature on the package of the device
within the condition of (1) above.