Datasheet

5
Intensity Bin Limit (mcd)
Blue
Iv Bin Category Min Max
L 3.401 5.400
M 5.401 8.600
N 8.601 13.700
Tolerance +/-15%
Note:
1. Bin categories are established for classication of products. Products
may not be available in all categories. Please contact your Avago
representative for information on currently available bins.
SMT Soldering Prole
Pb free reow soldering Prole
Recommended soldering pattern (unit: mm)
250°C
TIME
TEMPERATURE
6°C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
3
°C/SEC. MAX.
3
°C/SEC. MAX.
10 - 30 SEC.
150
°C
200
°C
217
°C
(Acc. to J-STD-020C)
3
1.27 x 5 = 6.35
7.8
0.8
Recommended stencil window opening is 80%
Notes:
1. The peak temperature refers to the peak package body temperature.
2. Number of reow process shall be limited to maximum 2 times only.
Cooling process to normal temperature is required between rst and
second soldering process.