Datasheet

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AV02-1644EN - November 20, 2014
SMT Soldering Prole
Pb free reow soldering Prole
245°C
TIME
TEMPERATURE
6°C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
3°C/SEC. MAX.
3°C/SEC. MAX.
10 - 30 SEC.
150°C
200°C
217°C
(Acc. to J-STD-020C)
Recommended Soldering Pattern (unit: mm)
Tape Specication (unit: mm)
2.6
1.9 x 4 = 7.6
12.8
1.4
Recommended stencil window opening is 80%
Notes:
1. The peak temperature refers to the peak package body temperature.
2. Number of reow process shall be limited to maximum 2 times only.
Cooling process to normal temperature is required between rst and
second soldering process.
32.00 ± 0.3
4.00 ± 0.1
∅1.50
16.00
± 0.1
10.20
± 0.1 1.50
Elongated sprocket hole
∅2.00
4.00
± 0.1
1.75 ± 0.1
28.40 ± 0.1
15.40 ± 0.1
0.30 ± 0.05
+ 0.10
− 0.00
+ 0.10
− 0.00
1.70
+ 0.15
− 0.05