Datasheet
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AV02-1643EN - July 30, 2014
SMT Soldering Prole
Pb free reow soldering Prole
245°C
TIME
TEMPERATURE
6°C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
3°C/SEC. MAX.
3°C/SEC. MAX.
10 - 30 SEC.
150°C
200°C
217°C
(Acc. to J-STD-020C)
Recommended Soldering Pattern (unit: mm)
Tape Specication (unit: mm)
32
+ 0.3
− 0.3
14.2±0.1
1.75±0.1
24±0.1
15.3±0.1
2±0.1 4±0.1
SECTION A-A
SECTION B-B
A AA B
B
20±0.1
R0.75
0.2±0.05
4.1±0.1
0.35±0.05
3
2.54 x 4 = 10.16
12
2
Recommended stencil window opening is 80%
Notes:
1. The peak temperature refers to the peak package body temperature.
2. Number of reow process shall be limited to maximum 2 times only.
Cooling process to normal temperature is required between rst and
second soldering process.