Data Sheet
Table Of Contents
- Overview
- Features
- Applications
- Device Selection Guide
- Package Dimensions
- Absolute Maximum Ratings
- ASCII Character Set
- Recommended Operating Conditions
- Electrical Characteristics
- Optical Characteristics
- AC Timing Characteristics
- AC Timing Frequency Characteristics
- Electrical Description
- Display Internal Block Diagram
- Character RAM
- UDC RAM and UDC Address Register
- Flash RAM
- Control Word Register
- Brightness (Bits 0–2)
- Flash Function (Bit 3)
- Blink Function (Bit 4)
- Current Requirements at Different Brightness Levels (VDD = 5.0V)
- Self-Test Function (Bits 5, 6)
- Clear Function (Bit 7)
- Display Reset
- Mechanical and Electrical Considerations
- Thermal Considerations
- Ground Connections
- Thermal Resistance (θJA) Using Various Amounts of Heatsinking Material
- Soldering and Post Solder Cleaning Instructions for the HDSP-210X/- 211X/250X
- Contrast Enhancement
- Intensity Bin Limits for HDSP-2107
- Intensity Bin Limits for HDSP-211x and HDSP-250x (Except HDSP-2504)
- Intensity Bin Limit for HDSP-2504
- Color Bin Limits
- Packing Information
Broadcom AV02-0629EN
18
HDSP-210x/-211x/-250x Series Data Sheet Eight-Character 5 mm and 7 mm Smart Alphanumeric Displays
Thermal Resistance (θ
JA
) Using Various Amounts of Heatsinking
Material
Soldering and Post Solder Cleaning Instructions for the HDSP-210X/-
211X/250X
The HDSP-210X/-211X/-250X may be hand soldered or wave soldered with SN63 solder. When hand soldering, it is
recommended that an electronically temperature controlled and securely grounded soldering iron be used. For best results,
the iron tip temperature should be set at 315°C (600°F). For wave soldering, a rosin-based RMA flux can be used. The solder
wave temperature should be set at 245°C ±5°C (473°F ±9°F), and the dwell in the wave should be set between 1
1
/
2
to 3
seconds for optimum soldering. The preheat temperature should not exceed 105°C (221°F) as measured on the solder side
of the PCB.
For additional information on soldering and post solder cleaning, see Application Note 1027, Soldering LED Components.
Contrast Enhancement
The objective of contrast enhancement is to provide good readability in a variety of ambient lighting conditions. For
information on contrast enhancement see Application Note 1015, Contrast Enhancement Techniques for LED Displays.
Intensity Bin Limits for HDSP-2107
NOTE: Test conditions as specified in Optical Characteristics.
Heatsinking Metal
sq. in.
With Sockets
Without Filter (Avg.)
Without Sockets
Without Filter (Avg.)
With Sockets per Device
With Filter (Avg.)
Unit
0 313035°C/W
1 312833°C/W
3 302633°C/W
Max. Metal 29 25 32 °C/W
4-Board Avg 30 27 33 °C/W
Bin
Intensity Range (mcd)
Min. Max.
I 5.12 9.01
J 7.68 13.52
K 11.52 20.28
L 17.27 30.42
M 25.39 45.63