Datasheet

6
Absolute Maximum Ratings
Parameter
AlGaAs Red
HLCP-X100
Series
HER
HLMP-2300/
2600/29XX
Series
Yellow
HLMP-2400/
2700/2950
Series
Green
HLMP-2500/
2800/2965
Series
Average Power Dissipated per LED Chip 37 mW
[1]
135 mW
[2]
85 mW
[3]
135 mW
[2]
Peak Forward Current per LED Chip 45 mA
[4]
90 mA
[5]
60 mA
[5]
90 mA
[5]
Average Forward Current per LED Chip 15 mA 25 mA 20 mA 25 mA
DC Forward Current per LED Chip 15 mA
[1]
30 mA
[2]
25 mA
[3]
30 mA
[2]
Reverse Voltage per LED Chip 5 V 6 V
[6]
Operating Temperature Range –20°C to +100°C
[7]
–40°C to +85°C –20°C to +85°C
Storage Temperature Range –40°C to +85°C
Wave Soldering Temperature
1.6 mm (1/16 inch) below Body
250°C for 3 seconds
Notes:
1. Derate above 87°C at 1.7 mW/°C per LED chip. For DC operation, derate above 91°C at 0.8 mA/°C.
2. Derate above 25°C at 1.8 mW/°C per LED chip. For DC operation, derate above 50°C at 0.5 mA/°C.
3. Derate above 50°C at 1.8 mW/°C per LED chip. For DC operation, derate above 60°C at 0.5 mA/°C.
4. See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.
5. See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.
6. Does not apply to bicolor parts.
7. For operation below –20°C, contact your local Avago sales representative.
Electrical/Optical Characteristics at T
A
= 25°C
AlGaAs Red HLCP-X100 Series
Parameter HLCP- Symbol Min. Typ. Max. Units Test Conditions
Luminous Intensity
per Lighting Emitting
Area
[1]
A100/D100/E100 I
V
3 7.5 mcd I
F
= 3 mA
B100/C100/F100/G100 6 15 mcd
H100 12 30 mcd
Peak Wavelength l
PEAK
645 nm
Dominant Wavelength
[2]
l
d
637 nm
Forward Voltage per LED V
F
1.8 2.2 V I
F
= 20 mA
Reverse Breakdown Voltage per LED V
R
5 15 V I
R
= 100 µA
Thermal Resistance LED Junction-to-Pin Rq
J-PIN
250 °C/W/
LED