Datasheet

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HSMx-C680

Right Angle Surface Mount ChipLEDs

Data Sheet

Description

The HSMx-C680 series of chip-type LEDs are designed to

illuminate at a right angle to the direction of mounting.

When mounted on a PC board, these devices will emit

light in a direction parallel to the board.

The small 3.0 x 1.0 x 2.0mm footprint of the HSMx-C680

is designed for applications where space is limited. These

devices are available in four colors and use untinted, non-

diﬀused optics.

The HSMx-C680 series of parts are compatible with IR

reﬂow soldering process only.

Package Dimensions

Features

• Right Angle Mounting

• Compatible with IR Reﬂow Soldering Process

• Available in a Wide Variety of Colors

• Available in 8 mm Tape on 178mm (7”) Diameter Reels

Applications

• LCD backlighting

• Keypad Side/Backlighting

• Light Piping

• Right Angle Indicator

Device Selection Guide

Part Number Parts per Reel Color

HSMA-C680 3000 AlInGaP Amber

HSMC-C680 3000 AlInGaP Red

HSMG-C680 3000 GaP Green

HSMH-C680 3000 AS AlGaAs Red

HSML-C680 3000 AlInGaP Orange

HSMS-C680 3000 GaP High Eﬃciency Red, HER

HSMY-C680 3000 GaP Yellow

CAUTION: HSMx-C680 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appro-

priate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

POLARITY MARK

TO REINFORCE SOLDERING

ANODE

(CATHODE FOR

HSMH-C680)

3.0

1.0

0.3 0.3

1.0

2.0

0.88

0.250.25

R 0.45

CATHODE

(ANODE FOR

HSMH-C680)

2.0

ANODECATHODE

(NON-PIN CONNECTION)

Summary of content (8 pages)

PAGE 1
HSMx-C680 Right Angle Surface Mount ChipLEDs Data Sheet Description Features The HSMx-C680 series of chip-type LEDs are designed to illuminate at a right angle to the direction of mounting. When mounted on a PC board, these devices will emit light in a direction parallel to the board. • Right Angle Mounting The small 3.0 x 1.0 x 2.0mm footprint of the HSMx-C680 is designed for applications where space is limited. These devices are available in four colors and use untinted, nondiffused optics.
PAGE 2
Absolute Maximum Ratings at TA = 25°C Parameter AlInGaP GaP AS AlGaAs Units DC Forward Current 30 25 25 mA Power Dissipation 72 65 65 mW Reverse Voltage (IR = 100mA) 5 5 5 V LED Junction Temperature 95 95 95 °C Operating Temperature Range -40 to 85°C Storage Temperature Range -40 to 85 °C Soldering Temperature See reflow soldering profile (Figure 6 & 7) Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) [1] @ IF = 20mA Reverse Breakdown VR (Volts) @ IR = 100mA
PAGE 3
Color Bin Limits [1] GaP HER AlIn GaP Amber Bin ID Dominant Wavelength (nm) Minimum Maximum A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Tolerance : ±1nm AlInGaP Red Bin ID - Dominant Wavelength (nm) Minimum Maximum 620.0 635.0 Bin ID - Dominant Wavelength (nm) Minimum Maximum 620.0 635.0 Tolerance : ± 1nm GaP Yellow Bin ID Dominant Wavelength (nm) Minimum Maximum A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.
PAGE 4
1.0 1.0 0.9 0.7 RELATIVE INTENSITY 0.8 RELATIVE INTENSITY 0.9 AlInGaP Orange AlInGaP Amber 0.6 AlInGaP Red 0.5 0.4 0.3 0.8 0.7 0.6 0.3 0.1 0.1 530 580 630 680 WAVELENGTH - nm 730 AS AlGaAs 0.4 0.2 480 GaP Green 0.5 0.2 0.0 0.0 380 780 GaP HER GaP Yellow 430 480 530 580 630 WAVELENGTH - nm 680 730 780 Figure 1. Relative intensity vs. wavelength..
PAGE 5
30 30 25 FORWARD CURRENT – mA MAXIMUM FORWARD CURRENT - mA 35 25 20 AlInGaP 15 10 5 0 0 20 40 60 80 AMBIENT TEMPERATURE - °C 20 15 10 5 0 100 0 20 60 40 80 100 AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature. 10 - 30 SEC. TEMPERATURE TEMPERATURE 10 SEC. MAX. 230 C MAX. 4 C/SEC. MAX. 140-160 C –3 C/SEC. MAX. 4 C/SEC. MAX. OVER 2 MIN. TIME Figure 5.. Recommended reflow soldering profile. 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX.
PAGE 6
USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 9. Reel dimensions. 6 6 PS 5.0 ± 0.5 (0.197 ± 0.
PAGE 7
4.00 ± 0.10 (0.157 ± 0.004) 1.50 + 0.100 Ø (0.059 + 0.004) 1.20 CATHODE 0.20 1.75 ± 0.10 (0.069 ± 0.004) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE) DIM. B (SEE TABLE) 8.00 ± 0.30 (0.315 ± 0.012) USER FEED DIRECTION Ø1.1 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) TABLE 1 DIM. A DIM. B DIM. C PART NUMBER ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C680 3.35 (0.132) 2.30 (0.091) 1.20 (0.047) DIMENSIONS IN MILLIMETERS (INCHES) Figure 10.
PAGE 8
Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.