Specifications

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Wi-Fi Module

Features

125MHz ARM Cortex M4 MCU

256KB SRAM/2MB FLASH

Support AES，MD5，SHA1

Support XIP

Working voltage: DC 3.3V

Wi-Fi related features

Support 802.11 b/g/n with 20M

and 40M bandwidth

 Support station and soft AP

 Support SmartConfig and AP

configuration

Support WEP/WPA2

Support multiple cloud services

 Integrated balun/PA/LNA

 TCP/IP stack optimized for IoT

application

 PCB antenna

Peripheral

2x UART

2x I2C

 1x SPI

 5x PWM

 Up to 10x GPIOs

 Working temperature: -10℃ to +80℃

 Stamp style SMD for surface mounting

production

Applications

Smart transportation

Smart home / appliances

Instruments

Health care

Industrial automation

Intelligent security

Smart energy

Model

Antenna type

Note

BL3332-P

PCB antenna

Default

Embedded

Version：1.2 Release date： May 13, 2019

BL3332-P

Summary of content (23 pages)

PAGE 1
BL3332-P Version：1.2 Embedded Release date： May 13, 2019 Wi-Fi Module  Working temperature: -10℃ to +80℃ Features  125MHz ARM Cortex M4 MCU Stamp style SMD for surface mounting production 256KB SRAM/2MB FLASH Support AES，MD5，SHA1 Support XIP Applications Working voltage: DC 3.3V Smart transportation Wi-Fi related features Smart home / appliances Support 802.
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-1- Content 1. Overview ............................................................................................................................ - 2 2. Basic Specifications ............................................................................................................ - 2 2.1. Power Consumption ................................................................................................... - 2 2.2. Working Environment .....................................................................
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-2- 1. Overview BL3332-P is a cost-effective embedded Wi-Fi module designed by BroadLink, which integrates an ARM Cortex-M4F processor speed up to 125MHz, 256KB SRAM and 2MB flash with 3.3V single power supply. The module integrates radio transceiver, MAC, baseband, all Wi-Fi protocols, configurations and network stack. It can be widely used in applications like smart home devices, remote monitoring devices and medical care instruments. 2. Basic Specifications 2.1.
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-311g @14dBm 54Mbps pulse current @TX 340 mA 11n @14dBm 65Mbps 2.2. Working Environment Please refer to Table 2 for working environment data. Table 2 BL3332-P Working Environment Data Symbol Description Min. Max. Units Ts Storage temperature -40 125 ℃ TA Ambient operating temperature -10 80 ℃ Vdd Supply voltage 3.0 3.6 V Vio Voltage on IO pin 0 3.3 V 3. Radio Specifications 3.1. Basic Radio Specification Please refer to Table 3 for radio specification.
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-4External: Not supported 802.11b<-88dBm@11Mbps 802.11g<-75dBm@54Mbps Receiving sensitivity 802.11n/HT20<-72dBm@MCS7 802.11n/HT40<-69dBm@MCS7 Stack IPv4, TCP/UDP/FTP/HTTP/HTTPS/TLS/mDNS Data rate (max) 11M@802.11b, 54M@802.11g, MCS7@802.11n Encryption standard: Open/WEP-Open/WPA/WPA2 Security Encryption algorithm: WEP64/WEP128/TKIP/AES Network types STA/AP/STA+AP/WIFI Direct 3.2. Radio Performance 3.2.1. IEEE 802.11b Table 4 Basic specifications under IEEE802.
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-5Table 6 Receiving performance under IEEE802.11b RX Characteristics Min Typical Max. Unit Minimum Input Level (FER≦8%) -88 dBm Maximum Input Level (FER≦8%) -10 dBm . 11Mbps Input Level Sensitivity 3.2.2. IEEE 802.11g Table 7 Basic specifications under IEEE802.11g ITEM Specification Modulation Type OFDM Frequency range 2412MHz~2462MHz Channel CH1 to CH11 Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps Table 8 Transmitting performance under IEEE802.11g TX Characteristics Min.
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-6dBm -20 Maximum Input Level (FER≦10%) 3.2.3 IEEE802.11n IEEE802.11n 20MHz bandwidth mode Table 10Basic specifications under IEEE802.11n with 20MHz ITEM Specification Modulation Type OFDM Frequency range 2412MHz~2462MHz Channel CH1 to CH11 Data rate MCS0/1/2/3/4/5/6/7 Table 11 Transmitting performance under IEEE802.11n with 20MHz TX Characteristics Min. Typical 13.5 Power@HT20, MCS7 Frequency Error Max.
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-7IEEE802.11n 40MHz bandwidth mode Table 13Basic specifications under IEEE802.11n with 40MHz ITEM Specification Modulation Type OFDM Frequency range 2422MHz~2452MHz Channel CH3 to CH9 Data rate MCS0/1/2/3/4/5/6/7 Table 14 Transmitting performance under IEEE802.11n with 40MHz TX Characteristics Min. Typical 14 Power@HT40, MCS7 Frequency Error Max. Unit dBm -10 EVM@HT40, MCS7 +10 ppm -33 dB Transmit spectrum mask Pass Table 15 Receiving performance under IEEE802.
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-8- Table 16 Actual power for EIRP, TRP and TIS Testing equipment Testing item Mode Speed Channel Power/dBm 1 11b 11M 6 13 EIRP 1 11g 6M 6 13 CMW500 1 TRP 11g 6M 6 13 1 TIS 11g 54M 6 13 <20 <20 <20 <20 <20 <20 ≥12 ≥12 ≥12 ≤-72 ≤-72 ≤-72
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-9- 4. BL3332-P Hardware Information 4.1. PIN Sequence Please refer to Fig 1 for the pin sequence. Fig 1 BL3332-P pin sequence 4.2. PIN Definitions Please refer to Table17 for the pin definitions. Table17 Pin BL3332-P pin definitions Interface Description Type 1 GND GND POWER 2 VDD 3.
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- 10 3 4 5 NRST HW reset I TX0 UART0 TX O SPI_MOSI SPI interface GPIOA23 Support PWM0 I/O RX0 UART0 RX I SPI_CLK SPI interface GPIOA18 I/O TX2 UART2 TX O GPIOA30 Support PWM3 I/O I2C0_SDA I2C interface RX2 UART2 RX I GPIO29 Support PWM4 I/O I2C_SCL I2C interface RX2 UART2 RX I GPIO29 Support PWM4 I/O I2C_SCL I2C interface TX2 UART2 TX O GPIOA30 Support PWM3 I/O 9 I2C0_SDA I2C interface 10 GPIOA5 Support PWM4 I/O GPIOA14 Support PWM0 I/O 6 7 8 1
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- 11 16 ADCIN 17 18 I/O I2C0_SCL I2C interface SPI_MISO SPI interface GPIOA22 Support PWM5 I/O I2C0_SDA I2C interface I/O SPI_CS SPI interface GPIOA19 I/O I/O Note: 1. In default, UART0 is used for bypass communication and UART2 is used for output of debugging information. Please refer to the description in DC Characteristics for UART output current level. 2. NRST is hardware reset for the module and will be effective with VIL.
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- 12 according to the IO state. 4.3. PCB Antenna Please refer to Fig 2 for PCB antenna. Fig 2 BL3332-P Antenna layout The module support PCB antenna in 2.4G~2.5G frequency with S11 port less than -10dB and max gain of 1.5dB at 2.45GHz, as shown in Fig 3.
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- 13 - Please refer to Fig 4 for real testing environment for module antenna. Fig 4 Antenna testing environment The testing was performed according to the following standards in Table 18.
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- 14 Please refer to Table 19 for the actual performance of module antenna. Table 19 Actual gain and efficiency of antenna Frequency / MHz 2410~2480 Max gain / dBi 0.6~1.9 Efficiency / % ＞48 The following precautions should be considered during designing with PCB antenna: Do not place any electrical components or grounding in antenna area on main board and it’s better to leave this area blank on PCB.
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- 15 Fig 5 BL3332-P Recommended PCB layout 4.4. Mechanical Dimensions Please refer to Fig 6 for the dimensions of module. Fig 6 BL3332-P Dimensions Note: Dimensions (17.7±0.2) mm * (30±0.2) mm * (3.8)mm (with shielding case) 4.5.
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- 16 - Fig 7 BL3332-P Recommended pad size 4.6. Certifications 1. Compliant and certified with SRRC standard (CMIIT ID: 2017DP6839). 2. Compliant with requirement of RoHS 2.0. 3. Compliant with requirement of REACH. 4.7. Label Fig 8 BL3332-P label content Please refer to Fig 8 for the content description on label.
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- 17 Model: ******* : Module model CMIIT ID: ********* : SRRC ID SN: 00ACA3FE75D7 : Module unique MAC address Code: 888888888888888: BroadLink internal code Ver: ********* : Firmware version The QR code contains information including but not limited to: FCC ID: 2ATEV-BL3332-P IC: 25062-BL3332P Manufacturer: Hangzhou BroadLink Technology Co., Ltd. Building C, 57 Jiang’er Road, Binjiang District, Hangzhou, Zhejiang, P.R.China 4.8.
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- 18 - (Unit: mm) 4.9. Packaging BL3332-P is packed in reel with 850 pcs/reel 5. Reference Design 5.1. UART Interface Design For devices with 3.3V power supply, you can directly connect the device UART port with module UART port according to the illustration in Fig 12. Fig 12 Circuit diagram (3.3V) If your device is powered by 5V, you can refer to the circuit shown in Fig 13 or design your own circuit for power conversion. The value of resistor can be adjusted according to actual circuit design.
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- 19 - 5.2. Power Supply Requirement If an LDO is used to supply the module with 3.3V power, C1 capacitor can be considered to be used with 10u-22u; If a DCDC is used to supply 3.3V power, C1 capacitor can be considered to be used with 22uF. It is recommended to supply the module with power higher than 400mA to ensure enough power supply to the module and avoid power down during data transmission. The module is designed with 2x 3.3V pins. You can power the module with either pin or both pins.
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- 20 - 2.2 List of applicable FCC rules FCC Part 15.247 2.6 RF exposure considerations This equipment complies with the FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and any part of your body. 2.8 Label and compliance information FCC ID label on the final system must be labeled with “Contains FCC ID: 2ATEV-BL3369T-P” or “Contains transmitter module FCC ID: 2ATEV-BL3369T-P”. 2.
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- 21 - Note 4: The module operated only with the antenna which it is authorized. The host product shall be properly labelled to identify the modules within the host product.
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- 22 - Copyrights It is prohibited to use or copy all or any part of contents in this manual without prior permission, especially applicable for trademarks, models, part numbers and figures. Contact Us Ms Zhou Hangzhou BroadLink Technology Co., Ltd. Add: Building C, 57 Jiang’er Road, Binjiang District, Hangzhou, P.R.China Postcode: 310052 Tel: +86-571-85071744-8010 Email: bingqi.zhou@broadlink.com.