User's Manual

10. AUDIO SECTION OVERVIEW ................................................................................................................................ 50
10.1. ELECTRICAL CHARACTERISTICS ............................................................................................................................. 51
10.1.1. Input Lines ..................................................................................................................................................... 51
10.1.2. Output Lines .................................................................................................................................................. 52
11. GENERAL PURPOSE I/O ....................................................................................................................................... 53
11.1. GPIO LOGIC LEVELS ............................................................................................................................................... 54
11.2. USING A GPIO PAD AS INPUT ............................................................................................................................... 55
11.3. USING A GPIO PAD AS OUTPUT ........................................................................................................................... 55
11.4. USING THE RF TRANSMISSION CONTROL GPIO4 .................................................................................................... 55
11.5. USING THE RFTXMON OUTPUT GPIO5 ................................................................................................................ 56
11.6. USING THE ALARM OUTPUT GPIO6 ........................................................................................................................ 56
11.7. USING THE BUZZER OUTPUT GPIO7 ....................................................................................................................... 56
11.8. INDICATION OF NETWORK SERVICE AVAILABILITY .................................................................................................. 57
11.9. RTC BYPASS OUT ................................................................................................................................................... 58
11.10. EXTERNAL SIM HOLDER IMPLEMENTATION ...................................................................................................... 58
12. DAC AND ADC SECTION ....................................................................................................................................... 59
12.1. DAC CONVERTER ................................................................................................................................................... 59
12.1.1. Description .................................................................................................................................................... 59
12.1.2. Enabling DAC ............................................................................................................................................... 60
12.1.3. Low Pass Filter Example ............................................................................................................................... 60
12.2. ADC CONVERTER ................................................................................................................................................... 61
12.2.1. Description .................................................................................................................................................... 61
12.2.2. Using ADC Converter ................................................................................................................................... 61
13. MOUNTING THE GE865 ON YOUR BOARD ........................................................................................................... 62
13.1. GENERAL ................................................................................................................................................................ 62
13.2. MODULE FINISHING & DIMENSIONS ........................................................................................................................ 62
13.3. RECOMMENDED FOOT PRINT FOR THE APPLICATION ................................................................................................ 63
13.4. DEBUG OF THE GE865 IN PRODUCTION ................................................................................................................... 64
13.5. STENCIL .................................................................................................................................................................. 64
13.6. PCB PAD DESIGN .................................................................................................................................................... 65
13.7. SOLDER PASTE ........................................................................................................................................................ 66
13.7.1. GE865 Solder reflow ..................................................................................................................................... 67
14. PACKING SYSTEM ................................................................................................................................................ 69
14.1. PACKING ON TRAY .................................................................................................................................................. 69
14.1.1. Tray detail ..................................................................................................................................................... 70
14.2. PACKAGING ON REEL .............................................................................................................................................. 71
14.2.1. Carrier Tape detail ........................................................................................................................................ 71
14.2.2. Reel detail ...................................................................................................................................................... 72
14.2.3. Packaging detail ............................................................................................................................................ 73
14.3. MOISTURE SENSIBILITY ........................................................................................................................................... 73
15. CONFORMITY ASSESSMENT ISSUES ..................................................................................................................... 74
16. SAFETY RECOMMANDATIONS ............................................................................................................................. 76
17. DOCUMENT HISTORY .......................................................................................................................................... 77