User's Manual

13.4. Debug of the GE865 in production
To test and debug the mounting of the GE865, we strongly recommend to foreseen test pads on
the host PCB, in order to check the connection between the GE865 itself and the application and
to test the performance of the module connecting it with an external computer. Depending by the
customer application, these pads include, but are not limited to the following signals:
 TXD
 RXD
 ON/OFF
 RESET
 GND
 VBATT
 TX_AUX
 RX_AUX
 PWRMON
 SERVICE
13.5. Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.