User guide

www.vishay.com For technical questions, contact: die-wafer@vishay.com
Document Number: 93896
2 Revision: 28-Mar-08
VS250SG12HCB
Vishay High Power Products
Phase Control Thyristors
ORDERING INFORMATION TABLE
Device code
1
2
3
4
5
6
7
- Vishay HPP device
- Chip dimension in mils
- Type of device: S = Solderable SCR
- Passivation process: G = Glassivated MESA
- Voltage code x 100 = V
RRM
- Metallization: H = Silver (anode) - silver (cathode)
- CB = Probed uncut die (wafer in box)
None = Probed die in chip carrier
5132467
VS 250 S G 12 H CB
LINKS TO RELATED DOCUMENTS
Dimensions http://www.vishay.com/doc?95159