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VSKDS409/150 www.vishay.
VSKDS409/150 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL TEST CONDITIONS VALUES Maximum average forward current IF(AV) 50 % duty cycle at TC = 105 °C, rectangular waveform 200 Maximum peak one cycle non-repetitive surge current IFSM Non-repetitive avalanche energy EAS TJ = 25 °C, IAS = 1.8 A, L = 10 mH 15 mJ Repetitive avalanche current IAR Current decaying linearly to zero in 1 μs Frequency limited by TJ maximum VA = 1.
VSKDS409/150 Vishay Semiconductors 1000 1000 IR - Reverse Current (mA) IF - Instantaneous Forward Current (A) www.vishay.com 100 TJ = 175 °C TJ = 125 °C TJ = 25 °C 10 1 0.0 100 TJ = 150 °C 10 TJ = 125 °C TJ = 100 °C 1 TJ = 75 °C 0.1 TJ = 50 °C 0.01 TJ = 25 °C 0.001 0.5 1.0 1.5 2.0 0 VFM - Forward Voltage Drop (V) 94649_01 TJ = 175 °C 25 75 100 125 150 VR - Reverse Voltage (V) 94649_02 Fig. 1 - Maximum Forward Voltage Drop Characteristics (Per Leg) 50 Fig.
VSKDS409/150 Vishay Semiconductors 180 300 160 140 DC 120 100 80 60 Square wave (D = 0.50) 80 % rated VR applied 40 20 250 Average Power Loss (W) Allowable Case Temperature (°C) www.vishay.com 150 RMS limit 100 DC 50 See note (1) 0 0 0 94649_05 D = 0.75 D = 0.50 D = 0.33 D = 0.25 D = 0.20 200 100 200 300 400 0 500 IF(AV) - Average Forward Current (A) 94649_06 IFSM - Non-Repetitive Surge Current (A) Fig. 5 - Maximum Allowable Case Temperature vs.
VSKDS409/150 www.vishay.
VISHAY SEMICONDUCTORS Modules Application Note Mounting Instructions for ADD-A-PAK Generation VII Generation VII ADD-A-PAK (AAP) power modules combine the excellent thermal performance enabled by a direct bonded copper (Al2O3) substrate, superior mechanical ruggedness, and an environmentally friendly manufacturing process that eliminates the use of hard molds, thus reducing direct stresses on the leads. To prevent axial pull-out, the electrical terminals are co-molded to the module housing.
Application Note Vishay Semiconductors Mounting Instructions for ADD-A-PAK Generation VII Next, make a uniform coating on the heatsink mounting surfaces and module substrate with a good quality thermal compound. Screen printing of the compound is recommended, as well as direct application through a roller or spatula. The datasheet values for thermal resistance assume a uniform layer of thermal compound with a maximum thickness of 0.08 mm. The thermal conductivity of the compound should be no less than 0.
Outline Dimensions Vishay Semiconductors ADD-A-PAK Generation VII - Diode DIMENSIONS in millimeters (inches) 29 ± 0.5 (1 ± 0.020) 30 ± 0.5 (1.18 ± 0.020) 35 REF. 18 (0.7) REF. 24 ± 0.5 (1 ± 0.020) 6.7 ± 0.3 (0.26 ± 0.012) Viti M5 x 0.8 Screws M5 x 0.8 Document Number: 95369 Revision: 11-Nov-08 7 6 4 5 3 2 1 6.3 ± 0.2 (0.248 ± 0.008) 22.6 ± 0.2 (0.89 ± 0.008) 80 ± 0.3 (3.15 ± 0.012) 15 ± 0.5 (0.59 ± 0.020) 20 ± 0.5 (0.79 ± 0.020) 20 ± 0.5 (0.79 ± 0.020) 92 ± 0.75 (3.6 ± 0.
Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.
