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VSKD91.., VSKC91.., VSKJ91.., VSKE91..
VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series ADD-A-PAK Generation VII Power Modules Standard Diodes, 100 A Vishay Semiconductors ELECTRICAL SPECIFICATIONS VOLTAGE RATINGS TYPE NUMBER VOLTAGE CODE VRRM, MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE V VRSM, MAXIMUM NON-REPETITIVE PEAK REVERSE VOLTAGE V 04 400 500 06 600 700 VSK.
VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series ADD-A-PAK Generation VII Vishay Semiconductors Power Modules Standard Diodes, 100 A THERMAL AND MECHANICAL SPECIFICATIONS PARAMETER SYMBOL Junction and storage temperature range TEST CONDITIONS TJ, TStg VALUES UNITS - 40 to 150 °C Maximum internal thermal resistance, junction to case per leg RthJC DC operation 0.22 Typical thermal resistance, case to heatsink per module RthCS Mounting surface flat, smooth and greased 0.
VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series ADD-A-PAK Generation VII Power Modules Standard Diodes, 100 A 150 Maximum average forward power loss (W) Maximum allowable case temperature (°C) Vishay Semiconductors RthJC (DC) = 0.22°C/W 140 130 120 180° 120° 90° 60° 30° 110 100 0 20 40 60 80 100 200 180° 120° 90° 60° 30° 180 160 140 120 DC 100 RMS limit 80 60 40 20 Per leg, Tj = 150°C 0 120 0 Average forward current (A) 60 80 100 120 140 160 Fig.
VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series ADD-A-PAK Generation VII Vishay Semiconductors Power Modules Standard Diodes, 100 A Maximum total forward power loss (W) 200 180 0 160 0 RthSA = 0.1 °C/W 0.3 °C/W 0.5 °C/W 0.7 °C/W 1 °C/W 1.5 °C/W 3 °C/W 0 140 180° (Sine) 120 DC 0 100 0 80 0 60 0 40 VSK.91 Series Per leg Tj = 150°C 20 0 0 0 0 20 40 60 0 20 80 100 120 140 160 Total RMS output current (A) 40 60 80 100 120 140 160 Maximum allowable ambient temperature (°C) Fig.
VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series ADD-A-PAK Generation VII Power Modules Standard Diodes, 100 A Vishay Semiconductors Instantaneous forward current (A) 1000 Per leg 100 10 Tj = 150°C Tj = 25°C 1 0 0.5 1.0 1.5 2.0 2.5 3.0 Instantaneous forward voltage (V) Transient thermal impedance Z thJC (°C/W) Fig. 10 - Forward Voltage Characteristics 1 Steady state value RthJC = 0.22 °C/W (DC operation) 0.1 Per leg 0.01 0.001 0.01 0.1 1 10 Square wave pulse duration (s) Fig.
VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series ADD-A-PAK Generation VII Vishay Semiconductors Power Modules Standard Diodes, 100 A CIRCUIT CONFIGURATION CIRCUIT DESCRIPTION CIRCUIT CONFIGURATION CODE CIRCUIT DRAWING VSKD... ~ + (1) Two diodes doubler circuit (2) (3) D 3 2 1 VSKC... + - Two diodes common cathodes (2) (1) (3) C 3 2 1 VSKJ... Two diodes common anodes + + (2) (1) (3) J 2 3 1 VSKE...
Outline Dimensions Vishay Semiconductors ADD-A-PAK Generation VII - Diode DIMENSIONS in millimeters (inches) 29 ± 0.5 (1 ± 0.020) 30 ± 0.5 (1.18 ± 0.020) 35 REF. 18 (0.7) REF. 24 ± 0.5 (1 ± 0.020) 6.7 ± 0.3 (0.26 ± 0.012) Viti M5 x 0.8 Screws M5 x 0.8 Document Number: 95369 Revision: 11-Nov-08 7 6 4 5 3 2 1 6.3 ± 0.2 (0.248 ± 0.008) 22.6 ± 0.2 (0.89 ± 0.008) 80 ± 0.3 (3.15 ± 0.012) 15 ± 0.5 (0.59 ± 0.020) 20 ± 0.5 (0.79 ± 0.020) 20 ± 0.5 (0.79 ± 0.020) 92 ± 0.75 (3.6 ± 0.
Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.
V I S H AY H I G H POW E R P R O D U C T S Modules Application Note Mounting Instructions for ADD-A-PAK Generation VII Generation VII ADD-A-PAK (AAP) power modules combine the excellent thermal performance enabled by a direct bonded copper (Al2O3) substrate, superior mechanical ruggedness, and an environmentally friendly manufacturing process that eliminates the use of hard molds, thus reducing direct stresses on the leads.
Application Note Vishay High Power Products Mounting Instructions for ADD-A-PAK Generation VII Next, make a uniform coating on the heatsink mounting surfaces and module substrate with a good quality thermal compound. Screen printing of the compound is recommended, as well as direct application through a roller or spatula. The datasheet values for thermal resistance assume a uniform layer of thermal compound with a maximum thickness of 0.08 mm.
