Install guide

CalAmp | LenderOutlook Device Install Guide
Page 2 MBUD-0266v1.1
1.2 LMU-XXX HANDLING PRECAUTIONS
Electrostatic Discharge (ESD)
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two
objects at different electrical potentials caused by direct contact or induced by an electrostatic field. The
term is usually used in the electronics and other industries to describe momentary unwanted currents
that may cause damage to electronic equipment.
ESD Handling Precautions
ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small
working station or a large manufacturing area. The main principle of an EPA is that there are no highly
charging materials in the vicinity of ESD sensitive electronics, all conductive materials are grounded,
workers are grounded, and charge build-up on ESD sensitive electronics is prevented. International
standards are used to define typical EPA and can be obtained for example from International Electro-
technical Commission (IEC) or American National Standards Institute (ANSI).
This ESD classification of the sub assembly will be defined for the most sensitive component, therefore
the following classifications apply:
 Class 1B – Human Model (< 1 kV)
 Class M1 – Machine Model (< 100V)
When handling the LMU-XXX’s main-board (i.e. sub assembly) by itself or in a partial housing proper ESD
precautions should be taken. The handler should be in an ESD safe area and be properly grounded.
GPS Ceramic Patch Handling
When handling the sub assembly it may be natural to pick it up by sides and make contact with the
antenna boards. In an uncontrolled ESD environment, contact with the center pin of ceramic patch
antenna can create a path for electrostatic discharge directly to the GPS Module. The GPS Module is
very sensitive to ESD and can be damaged and rendered non-functional at low levels of ESD.
One should avoid contact with the center pin of the patch during handling. The Factory will be placing a
protective layer of Kapton® tape over the patch element to eliminate this ESD path.
Packaging
Anytime the sub assembly is shipped and it is not fully packaged in its final housing it must be sealed in
an ESD safe bag.