Hardware manual

34
FUJITSU SEMICONDUCTOR CONFIDENTIAL
MB96630 Series
DS704-00012-1v0-E
• Sample recommended circuits:
V
CC
R
+B input (0V to 16V)
Limiting
resistance
Protective diode
P-ch
N-ch
*5: The maximum permitted power dissipation depends on the ambient temperature, the air flow velocity and the
thermal conductance of the package on the PCB.
The actual power dissipation depends on the customer application and can be calculated as follows:
P
D
= P
IO
+ P
INT
P
IO
= Σ (V
OL
× I
OL
+ V
OH
× I
OH
) (I/O load power dissipation, sum is performed on all I/O ports)
P
INT
= V
CC
× (I
CC
+ I
A
) (internal power dissipation)
I
CC
is the total core current consumption into V
CC
as described in the “DC characteristics” and depends on the
selected operation mode and clock frequency and the usage of functions like Flash programming.
I
A
is the analog current consumption into AV
CC
.
*6: Worst case value for a package mounted on single layer PCB at specified T
A
without air flow.
*7: Write/erase to a large sector in flash memory is warranted with T
A
≤ + 105°C.
<WARNING>
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature,
etc.) in excess of absolute maximum ratings. Do not exceed these ratings.