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FUJITSU SEMICONDUCTOR CONFIDENTIAL

MB96630 Series

DS704-00012-1v0-E

 PACKAGE DIMENSION

80-pin plastic LQFP Lead pitch 0.50 mm

Package width ×

package length

12 mm × 12 mm

Lead shape Gullwing

Sealing method Plastic mold

Mounting height

1.70 mm Max

Weight 0.47 g

Code

(Reference)

P-LFQFP80-12×12-0.50

80-pin plastic LQFP

(FPT-80P-M21)

2006-2010 FUJITSU SEMICONDUCTOR LIMITED F80035S-c-2-4

1 20

60 41

INDEX

12.00±0.10(.472±.004)SQ

14.00±0.20(.551±.008)SQ

0.50(.020)

0.20±0.05

(.008±.002)

0.08(.003)

0.145±0.055

(.006±.002)

0.08(.003)

"A"

0°~8°

.059–.004

+.008

–0.10

+0.20

1.50

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.10±0.05

(.004±.002)

(Stand off)

0.25(.010)

Details of "A" part

LEAD No.

(Mounting height)

Dimensions in mm (inches).

Note: The values in parentheses are reference values

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

Please check the latest package dimension at the following URL.

http://edevice.fujitsu.com/package/en-search/