User's Manual

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Table Of Contents

This document is subject to change without notice.

Document No: 0020-00-07-00-000 (Issue A)

Date Published: September 11, 2017

DESCRIPTION

The ZB3212F6R4SP2 ZigBee, Thread, Bluetooth Smart Mini Modules

feature the Silicon Labs EFR32MG12 single chip transceiver. These

devices are footprint-compatible with CEL’s existing line of ZigBee-,

Thread-, and Bluetooth-based modules, allowing for fast and simple

performance upgrades via drop-in compatible hardware.

The ZB3212F6R4SP2 Mini Modules are fully certified standalone

solutions for designers looking to take advantage of the robustness of

the Silicon Labs EmberZNet PRO™ stack while having the flexibility

to interface to Bluetooth Smart-enabled devices previously deployed

in the field. These modules eliminate design risk and significantly

reduce time-to-market for a multitude of IoT applications.

These EFR32-based devices are compatible with Silicon Labs’

Simplicity Studio development environment which includes an eclipse-

based IDE, documentation, debug, energy management tools, and

flashing tools. Simplicity Studio supports a multitude of sample

applications for many common uses of the ERF32, accelerating the

development proof-of-concept designs and demos.

KEY FEATURES

•

Multi-Protocol Support in a Single Device:

ZigBee 3.0, Thread, Bluetooth Smart 5.0

•

Enhanced Memory

1MB Flash

256kB SRAM

•

Up to 24 Analog/Digital GPIOs, including SPI,

USART, I2C, 12b ADC, iDAC, Comparators and

Timers

•

Radiated Output power up to 20dBm

•

Two Antenna Configurations

Integrated PCB Trace Antenna

External Antenna Connections via 50

Ω

Castellation Port for development

•

Mini Footprint: 0.940” x 0.655” (23.9 x 16.6mm)

•

Footprint-compatible with CEL's Bluetooth, ZigBee,

and Thread Module Family, Allowing for Fast and

Simple Performance Upgrades

•

ZB3212F6R4SP2-1 Variant FCC, IC, Certified* for

Usage Throughout North America and Canada

* Official FCC & IC certifications are in process and

pending final approval by the respective

governmental bodies.

APPLICATIONS

•

Connected Home & Appliances

•

Building Control & Automation

•

Lighting

•

Security

•

Wireless Sensor Networks

•

Wireless Audio & Video

•

Remote Health and Wellness Monitoring

•

General IoT Wireless Networking

Zigbee

/Thread

/Bluetooth

Smart Mini Module

ZB3212F6R4SP2-1, ZB3212F6R4SP2-1

Silicon Labs Mighty Gecko-Based

Module

PRELIMINARY DATASHEET

Embedded Multi-Protocol IOT Module

Summary of content (13 pages)

PAGE 1
PRELIMINARY DATASHEET Zigbee®/Thread®/Bluetooth® Smart Mini Module ZB3212F6R4SP2-1, ZB3212F6R4SP2-1C Silicon Labs Mighty Gecko-Based Module Embedded Multi-Protocol IOT Module DESCRIPTION The ZB3212F6R4SP2 ZigBee, Thread, Bluetooth Smart Mini Modules feature the Silicon Labs EFR32MG12 single chip transceiver. These devices are footprint-compatible with CEL’s existing line of ZigBee-, Thread-, and Bluetooth-based modules, allowing for fast and simple performance upgrades via drop-in compatible hardware.
PAGE 2
PRELIMINARY DATASHEET ZB3212F6R4SP2 TABLE OF CONTENTS DESCRIPTION ...................................................................................................................................... 1 KEY FEATURES ..................................................................................................................................... 1 TABLE OF CONTENTS ........................................................................................................................... 2 BLOCK DIAGRAM.
PAGE 3
PRELIMINARY DATASHEET ZB3212F6R4SP2 BLOCK DIAGRAM Cortet Module VCC GND SPI I2C TIMER USART ADC GPIO 2405 – 2480 M Hz EFR32MG12P432F1024GM48 ARM Cortex M4 Radio Transceiver LPF Antenna Match DEBUG Edge Castellation 38.
PAGE 4
PRELIMINARY DATASHEET ZB3212F6R4SP2 ANTENNA The Cortet Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna certified for FCC & IC requirements. An optional configuration which uses a castellation pin on the module allows the user to connect to an external antenna however this implementation would require certification by the end user and may not use the CEL FCC ID number on the label. The PCB antenna employs a topology that is compact and highly efficient.
PAGE 5
PRELIMINARY DATASHEET ZB3212F6R4SP2 DC CHARACTERISTICS (@ 3.3VDC and 25°C unless otherwise specified) Item Condition Tx Mode: 2.4 GHz 19.5 Tx Mode: 2.4 GHz 10 dBm1 dBm1 Tx Mode: 2.4 GHz 0 dBm1 Rx mode Sleep Modes Min Nom Max Unit Continuously Modulated Carrier 120 mA Continuously Modulated Carrier 55 mA Continuously Modulated Carrier 18 mA 802.15.4 12 mA Bluetooth Smart 12 mA EM1 all peripherals disabled 65 µA/MHz EM2 deep sleep mode 2.8 µA EM3 stop mode 2.
PAGE 6
PRELIMINARY DATASHEET I/O PIN ASSIGNMENTS Refer to the STM32 datasheet for pin functionality details. Module Pin Number Pin Name 1, 2, 12, 31, 33 GND 3 PA0 4 Reset 5 PA1 6 PA2 7 PA3 8 PA5/US0_SCLK/CTS 9 PB11/US0_CS/RTS 10 PB12/US1_TX 11 PB13/Wake/US1_RX/I2C0_SDA 13 VCC 14 PC6/I2C0_SCL/US1_CLK 15 PC7/US1_CS 16 PC8 17 PC9 Notes Input power to the module.
PAGE 7
PRELIMINARY DATASHEET ZB3212F6R4SP2 CEL MINI MODULE COMPATIBILITY The geometry of the land pattern and location of the RF castellations is identical to CEL’s ZICM35x family of ZigBee/Thread and B1010 Bluetooth Smart Mini Modules.
PAGE 8
PRELIMINARY DATASHEET MODULE LAND FOOTPRINT This document is subject to change without notice.
PAGE 9
PRELIMINARY DATASHEET ZB3212F6R4SP2 PROCESSING Recommended Reflow Profile Parameter Values Ramp Up Rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TLiquidus 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp Down Rate 6ºC/sec max Pb-Free Solder Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning a
PAGE 10
PRELIMINARY DATASHEET ZB3212F6R4SP2 Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711). Rework The Cortet module can be unsoldered from the host board.
PAGE 11
PRELIMINARY DATASHEET ZB3212F6R4SP2 AGENCY CERTIFICATIONS NOTE: Certifications are in process and pending final approval FCC Compliance Statement Part 15.19, Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS Standards. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation.
PAGE 12
PRELIMINARY DATASHEET ZB3212F6R4SP2 SHIPMENT, HANDLING AND STORAGE Shipment The Cortet modules are delivered in reels of 600 units. The reel diameter is 12.992 inches (330mm). Handling The Cortet modules are designed and packaged to be processed in an automated assembly line. Warning The Cortet modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The Cortet modules are moisture-sensitive devices.
PAGE 13
PRELIMINARY DATASHEET ZB3212F6R4SP2 REVISION HISTORY Previous Versions 0020-00-07-00-000 (Issue A) September 2017 Changes to Current Version Initial Preliminary Data Sheet Page(s) N/A DISCLAIMER The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL Data Sheets or Data Books, etc., for the most up-to-date specifications of CEL products.