User's Manual

This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
9
PRELIMINARY DATASHEET
ZB3212F6R4SP2
PROCESSING
Recommended Reflow Profile
Parameter Values
Ramp Up Rate (from T
soakmax
to T
peak
)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
60-120 sec
T
Liquidus
217ºC
Time above T
Liquidus
60-150 sec
T
peak
250ºC
Time within 5º of T
peak
20-30 sec
Time from 25º to T
peak
8 min max
Ramp Down Rate
6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note:
The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the
appropriate IPC Specification. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic
Assemblies document.
Cleaning
In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily removed with
any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits
between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two
housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.