User's Manual

MeshConnect™ Sub-G Module Series
Page 6
ABSOLUTE MAXIMUM RATINGS
Description
MeshConnect™ Sub-G Module
Unit
Min Max
Power Supply Voltage (VDD) -0.3 3.6 VDC
Voltage on any I/O Line -0.3 VDD + 0.3 VDC
RF Input Power –
10
dBm
Storage Temperature Range -40 125 °C
Reow Soldering Temperature – 260 °C
Note: Module has built in TX disabling feature when VCC = 3.6VDC.
Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description
MeshConnect™ Sub-G Module
Unit
Min Typ Max
Power Supply Voltage (V
DD)
1.8/2.7*
3.3 3.5 V
Frequency Range (ZICM0868P0) 865
–
870
MHz
Frequency Range (ZICM0900P2) 902 – 928 MHz
Ambient Temperature Range -40 25 85 °C
Note: * 2.7v is the min voltage if an additional memory IC was ordered.
DC CHARACTERISTICS (@ 25°C, VDD = 3.5V, ZICM0868P0 TX power max)
Description
MeshConnect™ Sub-G Module
Unit
Min Typ Max
Transmit Mode Current (@ 13dBm) – 42 – mA
Receive Mode Current – 24 – mA
Sleep Mode Current – 1.2 – µA
DC CHARACTERISTICS (@ 25°C, VDD = 3.5V, ZCM0900P2 TX power max)
Description
MeshConnect™ Sub-G Module
Unit
Min Typ Max
Transmit Mode Current(@ 20dBm)
–
97
– mA
Receive Mode Current –
24
– mA
Sleep Mode Current –
1.2
– µA