User's Manual
MeshConnect™ Sub-G Module Series
Page 6
ABSOLUTE MAXIMUM RATINGS
Description
MeshConnect™ Sub-G Module
Unit
Min Max
Power Supply Voltage (VDD) -0.3 3.6 VDC
Voltage on any I/O Line -0.3 VDD + 0.3 VDC
RF Input Power –
10
dBm
Storage Temperature Range -40 125 °C
Reow Soldering Temperature – 260 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED (OPERATING CONDITIONS)
Description
MeshConnect™ Sub-G Module
Unit
Min Typ Max
Power Supply Voltage (VDD)
1.8/2.7*
3.3 3.6 V
Input Frequency
863
–
870
MHz
Input Frequency 902 – 928 MHz
Ambient Temperature Range -40 25 85 °C
Note: * 2.7v is the min voltage if an additional memory IC was placed on the module.
DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP2 TX power max)
Description
MeshConnect™ Sub-G Module
Unit
Min Typ Max
Transmit Mode Current –
90
– mA
Receive Mode Current –
24
– mA
Sleep Mode Current –
TBD
– µA
DC CHARACTERISTICS (@ 25°C, VDD = 3.6V, ZICM0xxxP0 TX power max)
Description
MeshConnect™ Sub-G Module
Unit
Min Typ Max
Transmit Mode Current – 35 – mA
Receive Mode Current – 24 – mA
Sleep Mode Current – TBD – µA