User`s manual

BDM-610000082 Rev A Chapter 1: Introduction 5
Board Features
• AMD Fusion G-Series FT1 Processor:
–AMD64 technology
– ACPI-compliant, including support for processor performance (P-states) and sleep states
including S0, S3, S4, and S5
– Thermal Throttling reduces clock speed to prevent thermal runaway (dual-core only)
– Supports AMD Virtualization™ technology
–40 nm process
• AMD G-Series A55E Platform Controller Hub
• 2GBytes BGA DDR3 SDRAM
– Single-channel memory interface
– 800 MT/s (400MHz) Data Rate
– Surface Mounted for maximum reliability
• Stackable 156-pin PCIe/104 Type 2 bus on top
– x1 PCI Express Gen 2.0 Links (up to 5.0 GT/s per lane)
–Two SATA 2.0
– Two USB 2.0
• Stackable 156-pin PCIe/104 Type 2 bus on bottom
– Four PCI Express x1 Links
–Two SATA 2.0
– Two USB 2.0
• Advanced Thermal Management
– Thermal Monitor throttles processor and memory to prevent thermal runaway
– Passive Heastink
– Passive Structural Heatsink & Heatpipes in IDAN and HiDAN System Configurations
• Advanced Programmable Interrupt Controller (APIC)
– 24 interrupt channels with APIC enabled (15 in legacy PIC mode)
– High Precision Event Timer
• Advanced Configuration and Power Interface (ACPI)
– ACPI 3.0 Compliant
– Supported power down modes: S3 (Suspend to RAM), S4 (Hibernate), and S5 (Soft-Off)
– Wake events include:
• USB event (device insertion, keyboard keystroke, etc.)
• Real Time Clock alarm or timeout
Part Number Cores Core
Frequency
Boost
Frequency
L1 Cache
(data)
L1 Cache
(instruction)
L2 Cache
CMX34GSS615 One 615 MHz — 32 KByte 32 KByte 512 KByte
CMX34GSD1000 Two 1.0 GHz 1333 MHz
1
1. For CPU boost, only one processor of the dual-core will have boost enabled
32 KByte
2
2. Discreet L1 and L2 cache structures for each core
32 KByte
2
512 KByte
2