Specifications

LV5692P, LV5693P Application Note

http://onsemi.com

HZIP15J Heat sink attachment

Heat sinks are used to lower the semiconductor device junction temperature by leading the head

generated by the device to the outer environment and dissipating that heat.

ａ．Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks,

solder must not be applied to the heat sink or tabs.

ｂ．Heat sink attachment

・Use flat-head screws to attach heat sinks.

・Use also washer to protect the package.

・Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .

・If tapping screws are used, do not use screws with a diameter larger

than the holes in the semiconductor device itself.

・Do not make gap, dust, or other contaminants to get between the

semiconductor device and the tab or heat sink.

・take care a position of via hole.

・Do not allow dirt, dust, or other contaminants to get between the

semiconductor device and the tab or heat sink.

・Verify that there are no press burrs or screw-hole burrs on the heat sink.

・Warping in heat sinks and printed circuit boards must be no

more than 0.05 mm between screw holes, for either concave

or convex warping.

・Twisting must be limited to under 0.05 mm.

・Heat sink and semiconductor device are mounted in parallel.

Take care of electric or compressed air drivers

・The speed of these torque wrenches should never exceed 700 rpm,

and should typically be about 400 rpm.

gap

Heat sink

via hole

Binding-head

machine-screw

Countersunk head

machine screw