Specifications

B. Connector pinouts
B.1 Headboard
The laser head interface board provides connection breakout to the
laserdiode,TEC,sensor,piezoactuators,andlaserheadinterlock.
Italsoincludesasolid-stateprotectionrelayandpassiveprotection
filters,alaser-onLED indicator,andanSMA connectionfordirect
diodecurrentmodulation. TheconnectionsaremadewithHirose
DF59 “swing-lock” wire-to-board connectors.
For highbandwidth RF modulationthediodeshouldbedirectlysol-
deredtoaspecialinterconnectassembly availablefromMOGLabs.
Noprovisionismadeforopticalpowercontrolormeasurementfor
diodes that have an internal photodiode.
Figure B.1: MOGLabsCEL laserheadboard showingconnectorsforlaser
diode, piezoactuator,temperature sensors,TECand head enclosureinter-
lock.
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