User's Manual

Chapter 1 – Universal Socket Connectivity
Multi-Tech Systems, Inc. Universal Socket Hardware Guide for Developers (S000342D) 30
Restriction of the Use of Harzardous
Substances (RoHS)
Certificate of Compliance
2002/95/EC
Multi-Tech Systems Inc. confirms that MTxxxxSMI now complies with the chemical concentration limitations set
forth in the directive 2002/95/EC of the European Parliament (Restriction Of the use of certain Hazardous
Substances in electrical and electronic equipment - RoHS)
MTxxxxSMI does not contain the following banned chemicals:
Lead, [Pb] > 1000 PPM
Mercury, [Hg] > 1000 PPM
Hexavalent Chromium, [Cr+6] > 1000 PPM
Cadmium, [Cd] > 100 PPM
Polybrominated Biphenyl, [PBB] > 1000 PPM
Polybrominated Diphenyl Ether, [PBDE] > 1000 PPM
Moisture Sensitivity Level (MSL) =1
Tin Whisker Growth = None detected
Maximum Soldering temperature = 260C (wave only)
Notes:
1. Lead usage in some components is exempted by the following RoHS annex; therefore, higher lead
concentration would be found in some modules (>1000ppm).
• Lead in high melting temperature type solders (i.e., tin-lead solder alloys containing more than 85%
lead).
• Lead in electronic ceramic parts (e.g., piezoelectronic devices).
2. Moisture Sensitivity Level (MSL) – Analysis is based on the components/material used on the board.
3. Tin Whisker Study was done per NEMI guidelines (Elevated temperature cycle of 60°C and non-condensing
relative humidity of 87% exposed to this environment for 1000 hours).