User's Manual
Table Of Contents
- General
- Module introduction
- Hardware description
- Approvals
- CE Approvals (ETSI)
- FCC Approvals
- ATEX Approvals
- Module Pinout
- Hardware Description
- Hardware Diagram
- Interface characteristics
- Absolute Maximum Ratings
- Environmental characteristics
- Recommended operating conditions
- DC Electrical Characteristics
- Digital IO Specifications
- AC Electrical Characteristics
- Physical Dimensions and Footprint
- Physical Dimensions
- Recommended Footprint
- Soldering Temperature Time Profile (for reflow so
- Recommended temperature time profile for lead-fre
- Reliability Test
- Application Precautions
- Safety precautions
- Engineering design and using precautions
- Storage conditions
- Packaging
- Carrier tape
- Reel
- Ordering Information
- Drawing of Product Label
- Disclaimer
- RoHS Declaration
- Data Sheet Status
- Reference Documents
- Contact Information
SZU06C2 Product Manual
SZU06C2 PM(Rev 2.0)
17
9.2
Recommended Footprint
Fig. 9-2 Recommended Footprint of SZU06C2
Notes:
1. When the surface mounted SZU06C2 ZigBee wireless communication module is used, it
is suggested that the bonding pad shall be 1mm wide and 1.2mm high.
2. L=25mm.
3. You must ensure that the corresponding PCB of “keep-out area” part in Fig. 3- 1shall have
no any device, running line or applied copper.
4. You must also ensure that there is no exposed copper on your layout which may contact
with the underside of the module.
5. To get the best RF performance, it is recommended that each GND pin shall be
connected to a complete ground level.
6. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductivity in the ground path.