User's Manual
Table Of Contents
- General
- Module introduction
- Hardware description
- Approvals
- CE Approvals(ETSI)
- FCC Approvals
- ATEX Approvals
- Module Pinout
- Hardware Description
- Hardware Diagram
- Interface characteristics
- Absolute Maximum Ratings
- Environmental characteristics
- Recommended operating conditions
- DC Electrical Characteristics
- Digital IO Specifications
- AC Electrical Characteristics
- Physical Dimensions and Footprint
- Physical Dimensions
- Recommended Footprint
- Soldering Temperature Time Profile (for reflow so
- Recommended temperature time profile for lead-fre
- Reliability Test
- Application Precautions
- Safety precautions
- Engineering design and using precautions
- Storage conditions
- Packaging
- Carrier tape
- Reel
- Ordering Information
- Drawing of Product Label
- Disclaimer
- RoHS Declaration
- Data Sheet Status
- Reference Documents
- Contact Information
SZU06C1 Product Manual
SZU06C1 PM(Rev 2.0)
18
10 Soldering Temperature Time Profile (for reflow
soldering)
10.1 Recommended temperature time profile for lead-free solder
Fig. 10-1 SZU06C1 Temperature Profile for Lead-free Solder
Notes:
Preheat: The recommended temperature climbing speed shall be 2℃/s and not exceed
2.5℃/s at the preheat area.
Cooling: The recommended temperature descent speed shall be 3℃/s and not exceed 4℃/s
at the cooling area.
Maximum Reflow Cycles of the module: twice
The module must not be placed at the bottom of PCB board for
reflow soldering (if the module is placed at the bottom of PCB board
for reflow soldering, device inside the module will drop off due to
gravity).