EG95 Hardware Design
LTE Standard Module Series EG95 Hardware Design Contents About the Document ..................................................................................................................................... 2 Contents.......................................................................................................................................................... 5 Table Index ..........................................................................................................................
LTE Standard Module Series EG95 Hardware Design 3.15. 3.16. 3.17. 3.18. STATUS...................................................................................................................................... 50 ADC Interface ............................................................................................................................ 51 Behaviors of RI ..........................................................................................................................
LTE Standard Module Series EG95 Hardware Design 1 Introduction This document defines the EG95 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG95 module. Associated with application note and user guide, customers can use EG95 module to design and set up mobile applications easily.
LTE Standard Module Series EG95 Hardware Design 1.1. Safety Information The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EG95 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product.
LTE Standard Module Series EG95 Hardware Design 2 Product Concept 2.1. General Description EG95 module is an embedded 4G wireless communication module with receive diversity. It supports LTE-FDD/WCDMA/GSM wireless communication, and provides data connectivity on LTE-FDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice functionality 1) to meet customers’ specific application demands. EG95 contains 4 variants: EG95-E, EG95-NA, EG95-EX 2) and EG95-NAX 2).
LTE Standard Module Series EG95 Hardware Design With a compact profile of 29.0mm × 25.0mm × 2.3mm, EG95 can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG95 is an SMD type module which can be embedded into applications through its 106 LGA pads. EG95 is integrated with internet service protocols like TCP, UDP and PPP.
LTE Standard Module Series EG95 Hardware Design Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.
LTE Standard Module Series EG95 Hardware Design 1.8V operation voltage with clock rates up to 50MHz. Rx-diversity Support LTE/WCDMA Rx-diversity GNSS Features Gen8C Lite of Qualcomm Protocol: NMEA 0183 AT Commands Compliant with 3GPP TS 27.007, 27.
LTE Standard Module Series EG95 Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EG95 and illustrates the major functional parts. ⚫ ⚫ ⚫ ⚫ ⚫ Power management Baseband DDR+NAND flash Radio frequency Peripheral interfaces ANT_GNSS 1) ANT_DIV ANT_MAIN PAM SAW Duplexer Switch LNA SAW VBAT_RF PA SAW PRx GPS DRx Tx NAND DDR2 SDRAM Transceiver IQ VBAT_BB PMIC Control Control PWRKEY Baseband RESET_N STATUS 19.
LTE Standard Module Series EG95 Hardware Design 2.4. Evaluation Board we provides a complete set of evaluation tools to facilitate the use and testing of EG95 module. The evaluation tool kit includes the evaluation board (UMTS<E EVB), USB data cable, earphone, antenna and other peripherals. For more details, please refer to document [7].
LTE Standard Module Series EG95 Hardware Design 3 Application Interfaces 3.1. General Description EG95 is equipped with 62-pin 1.1mm pitch SMT pads and 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms.
LTE Standard Module Series EG95 Hardware Design 3.2. Pin Assignment GND NC VBAT_RF VBAT_RF GND GND RESERVED (Pin 56 on EG95-E) ANT_DIV (EG95-NA/-EX/-NAX) NC GND GND ANT_MAIN GND GND The following figure shows the pin assignment of EG95 module.
LTE Standard Module Series EG95 Hardware Design NOTES 1. 2. 3. 4. 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. Keep all RESERVED pins and unused pins unconnected. GND pads should be connected to ground in the design. Please note that the definition of pin 49 and 56 are different among EG95-E and EG95-NA/-EX/-NAX. For more details, please refer to Table 4. 3.3. Pin Description The following tables show the pin definition and description of EG95.
LTE Standard Module Series EG95 Hardware Design module’s RF part VDD_EXT 29 GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 PO Provide 1.8V for external circuit Vmin=3.3V Vnorm=3.8V Vnorm=1.8V IOmax=50mA sufficient current up to 1.8A in a burst transmission. Power supply for external GPIO’s pull up circuits. If unused, keep it open. Ground Power-on/off Pin Name PWRKEY RESET_N Pin No. 15 17 I/O DC Characteristics Comment VH=0.8V The output voltage is 0.
LTE Standard Module Series EG95 Hardware Design USB_DP USB_DM 9 10 IO USB differential data bus (+) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. IO USB differential data bus (-) Compliant with USB 2.0 standard specification. Require differential impedance of 90Ω. I/O Description DC Characteristics Comment (U)SIM Interfaces Pin Name USIM_GND Pin No. Connect to ground of (U)SIM card connector. Specified ground for (U)SIM card 47 For 1.
LTE Standard Module Series EG95 Hardware Design USIM1_RST USIM1_ PRESENCE 44 42 DO DI Reset signal of (U)SIM card (U)SIM card insertion detection For 1.8V (U)SIM: VOLmax=0.45V VOHmin=1.35V For 3.0V (U)SIM: VOLmax=0.45V VOHmin=2.55V VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V For 1.8V (U)SIM: Vmax=1.9V Vmin=1.
LTE Standard Module Series EG95 Hardware Design USIM2_ PRESENCE 83 DI (U)SIM card insertion detection VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. I/O Description DC Characteristics Comment DO Ring indicator VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Data carrier detection VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. Clear to send VOLmax=0.45V VOHmin=1.35V 1.8V power domain.
LTE Standard Module Series EG95 Hardware Design VIHmax=2.0V PCM Interface Pin Name PCM_DIN PCM_DOUT PCM_SYNC PCM_CLK Pin No. 6 7 5 4 I/O DI DO IO IO Description DC Characteristics Comment PCM data input VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. If unused, keep it open. PCM data output VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. PCM data frame synchronization signal VOLmax=0.45V VOHmin=1.35V VILmin=-0.3V VILmax=0.6V VIHmin=1.
LTE Standard Module Series EG95 Hardware Design ADC0 General purpose analog to digital converter Voltage range: 0.3V to VBAT_BB If unused, keep it open. I/O Description DC Characteristics Comment DO Clock signal of SPI interface VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. DO Master output slave input of SPI interface VOLmax=0.45V VOHmin=1.35V 1.8V power domain. If unused, keep it open. 28 DI Master input slave output of SPI interface VILmin=-0.3V VILmax=0.
LTE Standard Module Series EG95 Hardware Design USB_BOOT 75 DI Force the module to enter emergency download mode VILmin=-0.3V VILmax=0.6V VIHmin=1.2V VIHmax=2.0V 1.8V power domain. It is recommended to reserve the test points. I/O Description DC Characteristics Comment RESERVED Pins Pin Name Pin No. 1,2, 11~14, 16, 51, 57, 63~66, 76~78, 88, 92~99 NC RESERVED 18, 25, 56 NC Keep these pins unconnected. Reserved Keep these pins unconnected. Pin 56 is only reserved on EG95-E. NOTES 1. 2.
LTE Standard Module Series EG95 Hardware Design Sleep Mode In this mode, the current consumption of the module will be reduced to the minimal level. During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally. Power Down Mode In this mode, the power management unit shuts down the power supply. Software is not active. The serial interface is not accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains applied. 3.5.
LTE Standard Module Series EG95 Hardware Design 3.5.1.2. USB Application with USB Remote Wakeup Function If the host supports USB suspend/resume and remote wakeup functions, the following three preconditions must be met to let the module enter sleep mode. ⚫ ⚫ ⚫ Execute AT+QSCLK=1 command to enable sleep mode. Ensure the DTR is held at high level or keep it open. The host’s USB bus, which is connected with the module’s USB interface, enters suspend state.
LTE Standard Module Series EG95 Hardware Design Module Host VDD USB_VBUS USB_DP USB_DP USB_DM USB_DM AP_READY GPIO RI EINT GND GND Figure 5: Sleep Mode Application with RI ⚫ ⚫ Sending data to EG95 through USB will wake up the module. When module has a URC to report, RI signal will wake up the host. 3.5.1.4.
LTE Standard Module Series EG95 Hardware Design NOTE Please pay attention to the level match shown in dotted line between the module and the host. Please refer to document [1] for more details about EG95 power management application. 3.5.2. Airplane Mode When the module enters airplane mode, the RF function does not work, and all AT commands correlative with RF function will be inaccessible. This mode can be set via the following ways. Hardware: The W_DISABLE# pin is pulled up by default.
LTE Standard Module Series EG95 Hardware Design Table 6: Pin Definition of VBAT and GND Pin Name Pin No. Description Min. Typ. Max. Unit VBAT_RF 52, 53 Power supply for module’s RF part. 3.3 3.8 4.3 V VBAT_BB 32, 33 Power supply for module’s baseband part. 3.3 3.8 4.3 V GND 3, 31, 48, 50, 54, 55, 58, 59, 61, 62, 67~74, 79~82, 89~91, 100~106 Ground - 0 - V 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V.
LTE Standard Module Series EG95 Hardware Design VBAT VBAT_RF VBAT_BB + + D1 100nF WS4.5D3HV 100uF C4 C3 C2 C1 33pF 10pF C5 100uF C6 C7 C8 100nF 33pF 10pF Module Figure 8: Star Structure of Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2A at least.
LTE Standard Module Series EG95 Hardware Design 3.6.4. Monitor the Power Supply AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to document [2]. 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name PWRKEY Pin No. 15 Description Turn on/off the module DC Characteristics Comment VH=0.8V The output voltage is 0.
LTE Standard Module Series EG95 Hardware Design S1 PWRKEY TVS Close to S1 Figure 11: Turn on the Module Using Button The power-on scenario is illustrated in the following figure. NOTE 1 VBAT ≥500ms V H =0.8V PWRKEY VIL≤0.5V About 100ms VDD_EXT ≥100ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit.
LTE Standard Module Series EG95 Hardware Design NOTES 1. 2. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. PWRKEY can be pulled down directly to GND with a recommended 10KΩ resistor if module needs to be powered on automatically and shutdown is not needed. 3.7.2. Turn off Module Either of the following methods can be used to turn off the module: ⚫ ⚫ Normal power-off procedure: Turn off the module using the PWRKEY pin.
LTE Standard Module Series EG95 Hardware Design NOTES 1. 2. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off. When turning off module with AT command, please keep PWRKEY at high level after the execution of power-off command. Otherwise the module will be turned on again after successful turn-off. 3.8.
LTE Standard Module Series EG95 Hardware Design S2 RESET_N TVS Close to S2 Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. VBAT ≤ 460ms ≥ 150ms VIH ≥ 1.3V RESET_N VIL ≤ 0.5V Module Status Running Resetting Restart Figure 16: Timing of Resetting Module NOTES 1. 2. Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9.
LTE Standard Module Series EG95 Hardware Design Table 9: Pin Definition of (U)SIM Interfaces Pin Name Pin No. I/O Description Comment Either 1.8V or 3.0V is supported by the module automatically.
LTE Standard Module Series EG95 Hardware Design VDD_EXT USIM_VDD 51K 15K 100nF USIM_GND Module USIM_VDD USIM_RST 0R USIM_CLK USIM_PRESENCE 0R USIM_DATA 0R (U)SIM Card Connector VCC RST CLK 33pF GND VPP IO GND 33pF 33pF GND GND Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected.
LTE Standard Module Series EG95 Hardware Design ⚫ ⚫ ⚫ ⚫ Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB, USIM_GND can be connected to PCB ground directly. To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and shield them with surrounded ground.
LTE Standard Module Series EG95 Hardware Design Test Points Minimize these stubs Module VDD R3 NM_0R R4 NM_0R MCU ESD Array USB_VBUS L1 USB_DM USB_DM USB_DP USB_DP Close to Module GND GND Figure 19: Reference Circuit of USB Interface A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission.
LTE Standard Module Series EG95 Hardware Design ⚫ The debug UART interface supports 115200bps baud rate. It is used for Linux console and log output. The following tables show the pin definition of the two UART interfaces. Table 11: Pin Definition of Main UART Interfaces Pin Name Pin No.
LTE Standard Module Series EG95 Hardware Design The module provides 1.8V UART interfaces. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. 0.1uF 10K VDD_EXT VCCA VCCB VDD_MCU 0.
LTE Standard Module Series EG95 Hardware Design NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12.
LTE Standard Module Series EG95 Hardware Design 125us 1 PCM_CLK 2 31 32 PCM_SYNC MSB LSB MSB LSB PCM_DOUT PCM_DIN Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. I/O Description Comment PCM_DIN 6 DI PCM data input 1.8V power domain PCM_DOUT 7 DO PCM data output 1.
LTE Standard Module Series EG95 Hardware Design MICBIAS BCLK PCM_SYNC LRCK PCM_DOUT DAC PCM_DIN ADC I2C_SCL SCL I2C_SDA SDA INP INN BIAS PCM_CLK Module 4.7K 4.7K LOUTP LOUTN Codec 1.8V Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES 1. 2. It is recommended to reserve an RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for PCM_CLK. EG95 works as a master device pertaining to I2C interface. 3.13. SPI Interface SPI interface of EG95 acts as the master only.
LTE Standard Module Series EG95 Hardware Design SPI_CLK SPI_CLK SPI_MOSI SPI_MOSI SPI_MISO SPI_MISO Module Peripherals Figure 25: Reference Circuit of SPI Interface with Peripherals NOTES 1. 2. SPI interface is not supported on ThreadX modules. The module provides 1.8V SPI interface. A level translator should be used between the module and the host if customer’s application is equipped with a 3.3V processor or device interface. 3.14.
LTE Standard Module Series EG95 Hardware Design A reference circuit is shown in the following figure. VBAT Module 2.2K NETLIGHT 4.7K 47K Figure 26: Reference Circuit of Network Status Indicator 3.15. STATUS The STATUS pin is set as the module’s operation status indicator. It will output high level when the module is powered on. The following table describes the pin definition of STATUS. Table 18: Pin Definition of STATUS Pin Name Pin No.
LTE Standard Module Series EG95 Hardware Design 3.16. ADC Interface The module provides one analog-to-digital converter (ADC) interface. AT+QADC=0 command can be used to read the voltage value on ADC0 pin. For more details about the command, please refer to document [2]. In order to improve the accuracy of ADC voltage values, the traces of ADC should be surrounded by ground. Table 19: Pin Definition of ADC Interface Pin Name Pin No.
LTE Standard Module Series EG95 Hardware Design NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. The default behaviors of the RI are shown as below. Table 21: Default Behaviors of RI State Response Idle RI keeps at high level URC RI outputs 120ms low pulse when a new URC returns 3.18. USB_BOOT Interface EG95 provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.
LTE Standard Module Series EG95 Hardware Design Module VDD_EXT Test point USB_BOOT 4.7K Close to test point TVS Figure 28: Reference Circuit of USB_BOOT Interface NOTE 1 VBAT ≥500ms VH=0.8V PWRKEY VIL≤0.5V About 100ms VDD_EXT USB_BOOT can be pul led up to 1.8V before VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is powered on. USB_BOOT RESET_N Figure 29: Timing Sequence for Entering Emergency Download Mode NOTES 1. 2.
LTE Standard Module Series EG95 Hardware Design 4 GNSS Receiver 4.1. General Description EG95 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG95 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default. By default, EG95 GNSS engine is switched off. It has to be switched on via AT command.
LTE Standard Module Series EG95 Hardware Design Accuracy (GNSS) @open sky XTRA enabled 3.4 s CEP-50 Autonomous @open sky <2.5 m NOTES 1. 2. 3. Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.
LTE Standard Module Series EG95 Hardware Design 5 Antenna Interfaces EG95 antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG95-NA/-EX/-NAX. The impedance of the antenna port is 50Ω. 5.1. Main/Rx-diversity Antenna Interfaces 5.1.1.
LTE Standard Module Series EG95 Hardware Design WCDMA B4 1710~1755 2110~2155 MHz WCDMA B5 824~849 869~894 MHz WCDMA B8 880~915 925~960 MHz LTE-FDD B1 1920~1980 2110~2170 MHz LTE-FDD B2 1850~1910 1930~1990 MHz LTE-FDD B3 1710~1785 1805~1880 MHz LTE-FDD B4 1710~1755 2110~2155 MHz LTE-FDD B5 824~849 869~894 MHz LTE-FDD B7 2500~2570 2620~2690 MHz LTE-FDD B8 880~915 925~960 MHz LTE-FDD B12 699~716 729~746 MHz LTE-FDD B13 777~787 746~756 MHz LTE-FDD B20 832~862 7
LTE Standard Module Series EG95 Hardware Design Main antenna Module R1 0R ANT_MAIN C1 C2 NM NM Diversity antenna R2 0R ANT_DIV C3 C4 NM NM Figure 30: Reference Circuit of RF Antenna Interface NOTES 1. 2. 3. Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. ANT_DIV function is enabled by default. AT+QCFG="diversity",0 command can be used to disable receive diversity.
LTE Standard Module Series EG95 Hardware Design Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) EG95_Hardware_Design
LTE Standard Module Series EG95 Hardware Design In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫ ⚫ ⚫ ⚫ ⚫ Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω. The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
LTE Standard Module Series EG95 Hardware Design A reference design of GNSS antenna is shown as below. VDD 0.1uF 10R Module GNSS Antenna 47nH 100pF 0R ANT_GNSS NM NM Figure 35: Reference Circuit of GNSS Antenna NOTES 1. 2. An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3. Antenna Installation 5.3.1.
LTE Standard Module Series EG95 Hardware Design Max input power: 50W Input impedance: 50Ω Cable insertion loss: < 1dB (EGSM900, WCDMA B5/B8, LTE-FDD B5/B8/B12/B13/B20/B26/B28) Cable insertion loss: < 1.5dB (DCS1800, WCDMA B1/B2/B4, LTE-FDD B1/B2/B3/B4/B25) Cable insertion loss: < 2dB (LTE-FDD B7) NOTE 1) It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. 5.3.2.
LTE Standard Module Series EG95 Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 37: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com.
LTE Standard Module Series EG95 Hardware Design 6 Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter Min. Max. Unit VBAT_RF/VBAT_BB -0.3 4.7 V USB_VBUS -0.3 5.5 V Peak Current of VBAT_BB 0 0.8 A Peak Current of VBAT_RF 0 1.8 A Voltage at Digital Pins -0.3 2.3 V 6.2.
LTE Standard Module Series EG95 Hardware Design Voltage drop during burst transmission Maximum power control level on EGSM900 IVBAT Peak supply current (during transmission slot) Maximum power control level on EGSM900 USB_VBUS USB connection detection 3.0 400 mV 1.8 2.0 A 5.0 5.25 V 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table. Table 31: Operation and Storage Temperatures Parameter Min. Typ. Max.
LTE Standard Module Series EG95 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 32: EG95-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 15 uA AT+CFUN=0 (USB disconnected) 1.3 mA GSM DRX=2 (USB disconnected) 2.3 mA GSM DRX=5 (USB suspended) 2.0 mA GSM DRX=9 (USB disconnected) 1.6 mA WCDMA PF=64 (USB disconnected) 1.8 mA WCDMA PF=64 (USB suspended) 2.1 mA WCDMA PF=512 (USB disconnected) 1.
LTE Standard Module Series EG95 Hardware Design EDGE data transfer WCDMA data transfer LTE data transfer GSM voice call EG95_Hardware_Design EGSM900 1DL/4UL @29.45dBm 631 mA DCS1800 4DL/1UL @29.14dBm 177 mA DCS1800 3DL/2UL @29.07dBm 290 mA DCS1800 2DL/3UL @28.97dBm 406 mA DCS1800 1DL/4UL @28.88dBm 517 mA EGSM900 4DL/1UL PCL=8 @26.88dBm 167 mA EGSM900 3DL/2UL PCL=8 @26.84dBm 278 mA EGSM900 2DL/3UL PCL=8 @26.76dBm 385 mA EGSM900 1DL/4UL PCL=8 @26.
LTE Standard Module Series EG95 Hardware Design WCDMA voice call WCDMA B1 @22.91dBm 632 mA WCDMA B8 @23.14dBm 546 mA Table 33: EG95-NA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 13 uA AT+CFUN=0 (USB disconnected) 1.0 mA WCDMA PF=64 (USB disconnected) 2.2 mA WCDMA PF=64 (USB suspended) 2.5 mA WCDMA PF=512 (USB disconnected) 1.4 mA LTE-FDD PF=64 (USB disconnected) 2.6 mA LTE-FDD PF=64 (USB suspended) 2.
LTE Standard Module Series EG95 Hardware Design WCDMA voice call LTE-FDD B5 CH2525 @23.39 dBm 601 mA LTE-FDD B12 CH5060 @23.16 dBm 650 mA LTE-FDD B13 CH5230 @23.36 dBm 602 mA WCDMA B2 CH9938 @23.34 dBm 627 mA WCDMA B4 CH1537 @23.47 dBm 591 mA WCDMA B5 CH4357 @ 23.37 dBm 536 mA Table 34: EG95-EX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 15 uA AT+CFUN=0 (USB disconnected) 1.3 mA GSM DRX=2 (USB disconnected) 2.
LTE Standard Module Series EG95 Hardware Design GPRS data transfer EDGE data transfer WCDMA data transfer LTE data transfer EG95_Hardware_Design LTE-FDD PF=64 (USB connected) 31.0 mA EGSM900 4DL/1UL @33.06dBm 247.9 mA EGSM900 3DL/2UL @32.93dBm 450.8 mA EGSM900 2DL/3UL @31.1dBm 536.4 mA EGSM900 1DL/4UL @29.78dBm 618 mA DCS1800 4DL/1UL @29.3dBm 144 mA DCS1800 3DL/2UL @29.3dBm 253.4 mA DCS1800 2DL/3UL @29.21dBm 355.4 mA DCS1800 1DL/4UL @29.07dBm 455.
LTE Standard Module Series EG95 Hardware Design GSM voice call WCDMA voice call LTE-FDD B20 @23.21dBm 646 mA LTE-FDD B28 @22.76dBm 661 mA EGSM900 PCL=5 @32.36dBm 259 mA DCS1800 PCL=0 @29.5dBm 149 mA WCDMA B1 @23.4dBm 494 mA WCDMA B8 @23.6dBm 608 mA Table 35: EG95-NAX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down 11 uA AT+CFUN=0 (USB disconnected) 1.1 mA WCDMA PF=64 (USB disconnected) 2.0 mA WCDMA PF=64 (USB suspend) 2.
LTE Standard Module Series EG95 Hardware Design LTE data transfer WCDMA voice call WCDMA B5 HSDPA @22.39dBm 502 mA WCDMA B5 HSUPA @22.12dBm 509 mA LTE-FDD B2 @23.07dBm 691 mA LTE-FDD B4 @23.09dBm 713 mA LTE-FDD B5 @23.31dBm 580 mA LTE-FDD B12 @23.30dBm 627 mA LTE-FDD B13 @23.32dBm 619 mA LTE-FDD B25 @23.03dBm 693 mA LTE-FDD B26 @22.97dBm 628 mA WCDMA B2 @22.89dBm 591 mA WCDMA B4 @22.76dBm 577 mA WCDMA B5 @23.
LTE Standard Module Series EG95 Hardware Design Table 37: RF Output Power Frequency Max. Min. EGSM900 33dBm±2dB 5dBm±5dB DCS1800 30dBm±2dB 0dBm±5dB EGSM900 (8-PSK) 27dBm±3dB 5dBm±5dB DCS1800 (8-PSK) 26dBm±3dB 0dBm±5dB WCDMA B1/B2/B4/B5/B8 24dBm+1/-3dB <-49dBm LTE-FDD B1/B2/B3/B4/B5/B7/ B8/B12/B13/B20/B25/B26/B28 23dBm±2dB <-39dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.
LTE Standard Module Series EG95 Hardware Design LTE-FDD B8 (10MHz) -97.1dBm -99.1dBm -101.2dBm -93.3dBm LTE-FDD B20 (10MHz) -97dBm -99dBm -101.3dBm -93.3dBm LTE-FDD B28A (10MHz) -98.3dBm -99dBm -101.4dBm -94.8dBm Table 39: EG95-NA Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2 -110dBm -110dBm -112.5dBm -104.7dBm WCDMA B4 -110dBm -110dBm -112.5dBm -106.7dBm WCDMA B5 -111dBm -111dBm -113dBm -104.
LTE Standard Module Series EG95 Hardware Design LTE-FDD B20 (10MHz) -97dBm -97.5dBm -102.2dBm -93.3dBm LTE-FDD B28 (10MHz) -98.2dBm -99.5dBm -102dBm -94.8dBm 3GPP Table 41: EG95-NAX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO WCDMA B2 -110dBm -110dBm -112.5dBm -104.7dBm WCDMA B4 -110dBm -110dBm -112.5dBm -106.7dBm WCDMA B5 -111dBm -111dBm -113dBm -104.7dBm LTE-FDD B2 (10MHz) -98dBm -99dBm -102.2dBm -94.3dBm LTE-FDD B4 (10MHz) -97.8dBm -99.
LTE Standard Module Series EG95 Hardware Design Table 42: Electrostatic Discharge Characteristics (25ºC, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ±5 ±10 KV All Antenna Interfaces ±4 ±8 KV Other Interfaces ±0.5 ±1 KV 6.8.
LTE Standard Module Series EG95 Hardware Design EG95 Module Heatsink Heatsink Thermal Pad Application Board Shielding Cover Application Board Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module) Thermal Pad EG95 Module Thermal Pad Heatsink Heatsink Application Board Shielding Cover Application Board Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTES 1. 2.
LTE Standard Module Series EG95 Hardware Design 7 Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are ±0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 25±0.15 29±0.15 Pin 1 Figure 41: Module Top and Side Dimensions EG95_Hardware_Design 2.30±0.
LTE Standard Module Series EG95 Hardware Design Figure 42: Module Bottom Dimensions (Top View) EG95_Hardware_Design
LTE Standard Module Series EG95 Hardware Design 7.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) NOTE For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB.
LTE Standard Module Series EG95 Hardware Design 7.3. Top and Bottom Views of the Module Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are renderings of EG95.
LTE Standard Module Series EG95 Hardware Design 8 Storage, Manufacturing and Packaging 8.1. Storage EG95 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: ⚫ ⚫ Mounted within 168 hours at the factory environment of ≤30ºC/60%RH. Stored at <10%RH. 3.
LTE Standard Module Series EG95 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.15mm~0.18mm. For more details, please refer to document [4].
1.1. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only.
If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. For this device, OEM integrators must be provided with labeling instructions of finished products. Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs: A certified modular has the option to use a permanently affixed label, or an electronic label.
included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
