Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.1.1 Pad Assignment
- 2.1.2 Signal Properties
- 2.1.3 USB Interface
- 2.1.4 Serial Interface ASC0
- 2.1.5 Serial Interface ASC1
- 2.1.6 Inter-Integrated Circuit Interface
- 2.1.7 UICC/SIM/USIM Interface
- 2.1.8 Enhanced ESD Protection for SIM Interfaces
- 2.1.9 Digital Audio Interface
- 2.1.10 Analog-to-Digital Converter (ADC)
- 2.1.11 RTC Backup
- 2.1.12 GPIO Interface
- 2.1.13 Control Signals
- 2.1.14 JTAG Interface
- 2.1.15 eMMC Interface
- 2.2 GSM/UMTS/LTE Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 2.1 Application Interface
- 3 GNSS Interface
- 4 Operating Characteristics
- 5 Mechanical Dimensions and Mounting
- 6 Regulatory and Type Approval Information
- 7 Document Information
- 8 Appendix
Cinterion
®
ALAS5V Hardware Interface Description
1.2 Key Features at a Glance
16
ALAS5V_HID_v00.030a 2019-03-20
Confidential / Preliminary
Page 10 of 124
UMTS features
3GPP Release 8 PS data rate – 384 kbps DL / 384 kbps UL
TD-SCDMA features
3GPP Release 4 2.8 Mbps DL / 2.2Mbps UL
GSM / GPRS / EGPRS features
Data transfer GPRS:
• Multislot Class 12
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS:
• Multislot Class 12
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• SRB loopback and test mode B
• 8-bit, 11-bit RACH
• 1 phase/2 phase access procedures
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
SMS Point-to-point MT and MO, Cell broadcast,
Text and PDU mode
Software
AT commands Hayes, 3GPP TS 27.007 and 27.005, and proprietary Gemalto M2M com-
mands
SIM Application Toolkit SAT Release 99, letter classes b, c, e with BIP and RunAT support
Firmware update Firmware update supported
GNSS Features
Protocol NMEA
Modes Standalone GNSS (GPS, GLONASS, Beidou, Galileo)
Integrated gpsOne 9HT support (GPS, GLONASS, Beidou, Galileo)
QZSS and SBAS support
General Power saving modes
DC feed bridge and control of power supply for active antenna via GPIO
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [3]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equip-
ment.
Feature Implementation