Specifications

Cinterion
®
ALAS5V Hardware Interface Description
5.2 Mounting ALAS5V onto the Application Platform
107

ALAS5V_HID_v00.030a 2019-03-20
Confidential / Preliminary
Page 102 of 124
5.2.3.2 Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
• A maximum module temperature of 245°C. This specifies the temperature as measured at
the module’s top side.
• A maximum duration of 30 seconds at this temperature.
• Ramp-down rate from T
P
to 200°C should be controlled in order to reduce thermally induced
stress during the solder solidification phase (see Table 28 - limited ramp-down rate). There-
fore, a cool-down step in the oven’s temperature program between 200°C and 180°C
should be considered. For more information on reflow profiles and their optimization see [3].
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
ALAS5V is specified for one soldering cycle only. Once ALAS5V is removed from the applica-
tion, the module will very likely be destroyed and cannot be soldered onto another application.
Table 28: Reflow temperature recommendations
1
1. Please note that the listed reflow profile features and ratings are based on the joint industry standard
IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more information on re-
flow profiles and their optimization please refer to [3].
Profile Feature Pb-Free Assembly
Preheat & Soak
Temperature Minimum (T
Smin
)
Temperature Maximum (T
Smax
)
Time (t
Smin
to t
Smax
) (t
S
)
150°C
200°C
60-120 seconds
Average ramp up rate (T
L
to T
P
) 3K/second max.
2
2. Temperatures measured on shielding at each corner. See also [3].
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
217°C
60-90 seconds
Peak package body temperature (T
P
)245°C +0/-5°C
Time (t
P
) within 5 °C of the peak package body
temperature (T
P
)
30 seconds max.
Average ramp-down rate
- Limited ramp-down rate between 225°C and 200°C
6K/second max.
2
3K/second max.
2
Time 25°C to maximum temperature 8 minutes max.
1
4
2
3
Module
Temperature sensors (1-4)