Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.1.1 Pad Assignment
- 2.1.2 Signal Properties
- 2.1.3 USB Interface
- 2.1.4 Serial Interface ASC0
- 2.1.5 Serial Interface ASC1
- 2.1.6 Inter-Integrated Circuit Interface
- 2.1.7 UICC/SIM/USIM Interface
- 2.1.8 Enhanced ESD Protection for SIM Interfaces
- 2.1.9 Digital Audio Interface
- 2.1.10 Analog-to-Digital Converter (ADC)
- 2.1.11 RTC Backup
- 2.1.12 GPIO Interface
- 2.1.13 Control Signals
- 2.1.14 JTAG Interface
- 2.1.15 eMMC Interface
- 2.2 GSM/UMTS/LTE Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 2.1 Application Interface
- 3 GNSS Interface
- 4 Operating Characteristics
- 5 Mechanical Dimensions and Mounting
- 6 Regulatory and Type Approval Information
- 7 Document Information
- 8 Appendix
Cinterion
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ALAS5V Hardware Interface Description
5.2 Mounting ALAS5V onto the Application Platform
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ALAS5V_HID_v00.030a 2019-03-20
Confidential / Preliminary
Page 104 of 124
5.2.4.3 Baking
Baking conditions are specified on the moisture sensitivity label attached to each MBB:
• It is not necessary to bake ALAS5V, if the conditions specified in Section 5.2.4.1 and Sec-
tion 5.2.4.2 were not exceeded.
• It is necessary to bake ALAS5V, if any condition specified in Section 5.2.4.1 and Section
5.2.4.2 was exceeded.
If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.
Devices should not be baked in tape and reel carriers at any temperature.
5.2.4.4 Electrostatic Discharge
Electrostatic discharge (ESD) may lead to irreversible damage for the module. It is therefore
advisable to develop measures and methods to counter ESD and to use these to control the
electrostatic environment at manufacturing sites.
Please refer to Section 4.6 for further information on electrostatic discharge.