Specifications

Cinterion
®
ALAS5V Hardware Interface Description
2.1 Application Interface
67
 ALAS5V_HID_v00.030a 2019-03-20
Confidential / Preliminary
Page 20 of 124
Figure 4: ALAS5V top view: Pad assignments
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2
T
GND GND
PCIE_
TX_N
PCIE_
TX_P
GND
PCIE_
RX_N
PCIE_
RX_P
GND RXD2 GPIO15 TXD2 FwSwap rfu
(dnu)
rfu
(dnu)
GND
R
GPIO16
(Interrupt)
GND GND PCIE_
CLK_
REQ
GND GND PCIE_
HOST_
RST
PCIE_
HOST_
WAKE
RXD1 TXD1 CTS1 RTS1 PWR_
IND
P
GND VUSB_
IN
PCIE_
CLK_N
PCIE_-
CLK_P
EMMC_
CLK
EMMC_
D3
EMMC_
CMD
EMMC_
D7
MCLK rfu
(FSC1)
rfu
(BCLK1)
rfu
(DOUT1)
rfu
(DIN1)
GPIO5
(Inter-
rupt)
BATT+_
RF
BATT+_
RF
GND
N
GND CCIN1 CCIN2 GND GND
EMMC_
D0
EMMC_
D2
EMMC_
D5
EMMC_
D4
GND BCLK2 DIN2 DOUT2 FSC2 GND GND GND GND
M
GPIO8
(Interrupt)
CCCLK1 CCCLK2 USB_DN USB_DP GPIO22
EMMC_
D1
EMMC_
D6
rfu
(dnu)
rfu
(dnu)
I2CCLK1 I2CDAT1 JTAG_
WD_
DISABLE
GPIO17 GND GND GND GND GND
L
GPIO4 CCRST1 CCVCC2 GND GND EMMC_
PWR
rfu
(nc)
rfu
(nc)
EMMC_
DETECT
rfu
(dnu)
GND GND GND
ANT_
MAIN
K
rfu
(dnu)
CCVCC1 CCRST2
USB_
SSRX_N
USB_
SSRX_P
rfu
(dnu)
GND GND GND GND
J
RING0 CCIO1 CCIO2 GND GND rfu
(dnu)
GND GND GND GND
H
rfu
(BATT_
ID)
TXD0 GPIO6
(Inter-
rupt)
USB_
SSTX_N
USB_
SSTX_P
GND GND GND GND GND
G
RTS0 CTS0 DCD0 /
Down-
load
GND GND rfu
(dnu)
GND GND GND GND
F
BATT+ DTR0 RXD0 DSR0 EMERG
_OFF
GND
rfu
(nc)
rfu
(nc)
rfu
(dnu)
rfu
(dnu)
GND GND GND
ANT_
DRX_
MIMO
E
BATT+ rfu
(dnu)
VEXT rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
JTAG_
PS_
HOLD
GPIO12 GPIO13 GPIO14 GPIO7
(Inter-
rupt)
GPIO1 /
DR_SYNC
rfu
(dnu)
GND GND GND GND GND
D
IGT JTAG_
TDO
JTAG_
SRST
JTAG_
TDI
JTAG_
TRST
JTAG_
TMS
GNSS_
EN
GPIO11 ADC2_
IN
ADC1_
IN
ADC5_IN ADC4_IN rfu
(nc)
GND GND GND GND
C
GND JTAG_
TCK
GPIO3
(Interrupt)
GND GND GND GND GND GND GND GND GND GND GND GND GND GND
B
rfu
(dnu)
GND GND GND GND GND GND GND GND GND GND GND GND GND
rfu
(dnu)
A
GND ANT_
GNSS_
DC
GND
ANT_
GNSS
GND GND GND
rfu
(nc)
GND GND GND
rfu
(nc)
GND GND GND
rfu: Reserved for future use (may be connected to external application
(nc): Internally not connected (may be arbitrarily connected to external GND)
(dnu): Do not use (should not be connected to external application)
Circle marks round shaped pads designed for improved impedance.
Orange: Keep out areas on external application’s PCB.
Round shaped: No solder pads, should therefore not be soldered. No fur-
ther tracks on PCB’s first layer.