Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.1.1 Pad Assignment
- 2.1.2 Signal Properties
- 2.1.3 USB Interface
- 2.1.4 Serial Interface ASC0
- 2.1.5 Serial Interface ASC1
- 2.1.6 Inter-Integrated Circuit Interface
- 2.1.7 UICC/SIM/USIM Interface
- 2.1.8 Enhanced ESD Protection for SIM Interfaces
- 2.1.9 Digital Audio Interface
- 2.1.10 Analog-to-Digital Converter (ADC)
- 2.1.11 RTC Backup
- 2.1.12 GPIO Interface
- 2.1.13 Control Signals
- 2.1.14 JTAG Interface
- 2.1.15 eMMC Interface
- 2.2 GSM/UMTS/LTE Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 2.1 Application Interface
- 3 GNSS Interface
- 4 Operating Characteristics
- 5 Mechanical Dimensions and Mounting
- 6 Regulatory and Type Approval Information
- 7 Document Information
- 8 Appendix
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ALAS5V Hardware Interface Description
5.2 Mounting ALAS5V onto the Application Platform
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ALAS5V_HID_v00.030a 2019-03-20
Confidential / Preliminary
Page 99 of 124
5.2 Mounting ALAS5V onto the Application Platform
This section describes how to mount ALAS5V onto the PCBs, including land pattern and stencil
design, board-level characterization, soldering conditions, durability and mechanical handling.
For more information on issues related to SMT module integration see also [3].
Note: Gemalto strongly recommends to solder all connecting pads for mechanical stability and
heat dissipation. Not only must all supply pads and signals be connected appropriately, but all
pads denoted as “Do not use“ should also be soldered (but not electrically connected). Note
also that in order to avoid short circuits between signal tracks on an external application's PCB
and various markings at the bottom side of the module, it is recommended not to route the sig-
nal tracks on the top layer of an external PCB directly under the module, or at least to ensure
that signal track routes are sufficiently covered with solder resist.
5.2.1 SMT PCB Assembly
5.2.1.1 Land Pattern and Stencil
The land pattern and stencil design as shown below is based on Gemalto M2M characteriza-
tions for lead-free solder paste on a four-layer test PCB and a 110 micron-thick stencil.
The land pattern given in Figure 42 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 2.1.1). Besides these pads there are ground areas
on the module's bottom side that must not be soldered, e.g., the position marker. To prevent
short circuits, it has to be ensured that there are no wires on the external application side that
may connect to these module ground areas.
Figure 42: Land pattern (top layer)
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