Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
ELS81-US Hardware Interface Description
Tables
118
els81-us_hid_v01.004 2017-09-27
Confidential / Preliminary
Page 6 of 107
Tables
Table 1: Pad assignments............................................................................................ 16
Table 2: Signal properties ............................................................................................ 17
Table 3: Absolute maximum ratings............................................................................. 23
Table 4: Signals of the SIM interface (SMT application interface) ............................... 30
Table 5: GPIO lines and possible alternative assignment............................................ 34
Table 6: Host wakeup lines.......................................................................................... 40
Table 7: Return loss in the active band........................................................................ 42
Table 8: RF Antenna interface UMTS/LTE (at operating temperature range) ............. 42
Table 9: Overview of operating modes ........................................................................ 54
Table 10: Signal states................................................................................................... 61
Table 11: Temperature dependent behavior.................................................................. 64
Table 12: Voltage supply ratings.................................................................................... 69
Table 13: Current consumption ratings (typical ratings to be confirmed)....................... 70
Table 14: Board temperature ......................................................................................... 73
Table 15: Electrostatic values ........................................................................................ 74
Table 16: EMI measures on the application interface.................................................... 76
Table 17: Summary of reliability test conditions............................................................. 77
Table 18: Reflow temperature ratings............................................................................ 84
Table 19: Storage conditions ......................................................................................... 85
Table 20: Directives ....................................................................................................... 93
Table 21: Standards of North American type approval .................................................. 93
Table 22: Standards of European type approval............................................................ 93
Table 23: Requirements of quality ................................................................................. 94
Table 24: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 94
Table 25: Toxic or hazardous substances or elements with defined
concentration limits ........................................................................................ 95
Table 26: List of parts and accessories........................................................................ 105
Table 27: Molex sales contacts (subject to change) .................................................... 106