Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
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ELS81-US Hardware Interface Description
4.2 Mounting ELS81-US onto the Application Platform
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els81-us_hid_v01.004 2017-09-27
Confidential / Preliminary
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4.2 Mounting ELS81-US onto the Application Platform
This section describes how to mount ELS81-US onto the PCBs, including land pattern and
stencil design, board-level characterization, soldering conditions, durability and mechanical
handling. For more information on issues related to SMT module integration see also [3].
Note: To avoid short circuits between signal tracks on an external application's PCB and vari-
ous markings at the bottom side of the module, it is recommended not to route the signal tracks
on the top layer of an external PCB directly under the module, or at least to ensure that signal
track routes are sufficiently covered with solder resist.
4.2.1 SMT PCB Assembly
4.2.1.1 Land Pattern and Stencil
The land pattern and stencil design as shown below is based on Gemalto characterizations for
lead-free solder paste on a four-layer test PCB and a respectively 110 µm and 150 µm thick
stencil.
The land pattern given in Figure 44 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 2.1.1).
Figure 44: Land pattern (top view)
The stencil design illustrated in Figure 45 and Figure 46 is recommended by Gemalto M2M as
a result of extensive tests with Gemalto M2M Daisy Chain modules.