CINTERION® BGS12 Hardware Interface Description Version: DocId: 00.915 BGS12_HID_V00.915 M2M.GEMALTO.COM BGS1-E HID_V02.
CINTERION® BGS12 Hardware Interface Description Contents 2 of 109 Page Document Name: Cinterion® BGS12 Hardware Interface Description Version: 00.915 Date: 2019-01-07 DocId: BGS12 HID_V00.915 Status Confidential / Released GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS.
CINTERION® BGS12 Hardware Interface Description Contents 3 of 109 Page Hardware Interface Description ............................................................................................. 1 1 Introduction ................................................................................................................. 9 1.1 Related Documents ............................................................................................ 9 1.2 Terms and Abbreviations....................................
CINTERION® BGS12 Hardware Interface Description Contents 3.7 3.7.1 3.7.2 3.8 3.9 3.10 3.11 4 of 109 Page 3.14 SIM/USIM Interface ............................................................................................ 40 Single SIM/USIM Card Application ..................................................................... 40 Dual SIM/USIM Card Application ........................................................................ 42 Serial Interface ASC0 .................................................
CINTERION® BGS12 Hardware Interface Description Contents 5 of 109 Page 6.2.1 SMT PCB Assembly............................................................................................ 90 6.2.1.1 Land Pattern and Stencil ........................................................................ 90 6.2.1.2 Board Level Characterization ................................................................. 92 6.2.2 Moisture Sensitivity Level .........................................................................
CINTERION® BGS12 Hardware Interface Description Contents 6 of 109 Page Tables Table 1: Directives ............................................................................................................. 12 Table 2: Standards of European type approval .................................................................. 13 Table 3: Requirements of quality........................................................................................
CINTERION® BGS12 Hardware Interface Description Contents 7 of 109 Page Figures Figure 1: BGS12 system overview ..................................................................................... 21 Figure 2: BGS12 block diagram ......................................................................................... 22 Figure 3: Power supply limits during transmit burst ............................................................ 25 Figure 4: Position of reference points BATT+ and GND ..................
CINTERION® BGS12 Hardware Interface Description Contents 8 of 109 Page Figure 51: Recommended design for 150 micron thick stencil (top view) (to be replaced)..91 Figure 52: Reflow Profile .................................................................................................... 93 Figure 53: Carrier tape .......................................................................................................96 Figure 54: Reel direction ..............................................................
CINTERION® BGS12 Hardware Interface Description Contents 9 of 109 Page 1 Introduction This document describes the hardware of the Cinterion® BGS12 module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.
CINTERION® BGS12 Hardware Interface Description Contents 10 of 109 Page Abbreviation Description DAI Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE DCS 1800 Data Communication Equipment (typically modems, e.g.
CINTERION® BGS12 Hardware Interface Description Contents 11 of 109 Page Abbreviation Description MMI Man Machine Interface MO Mobile Originated MS Mobile Station (GSM module), also referred to as TE MSISDN Mobile Station International ISDN number MT Mobile Terminated NTC Negative Temperature Coefficient OEM Original Equipment Manufacturer PA Power Amplifier PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCL Power Contro
CINTERION® BGS12 Hardware Interface Description Contents 12 of 109 Page Abbreviation Description SRAM Static Random Access Memory TA Terminal adapter (e.g. GSM module) TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE Tx Transmit Direction UART Universal asynchronous receiver-transmitter URC Unsolicited Result Code USSD Unstructured Supplementary Service Data VSWR Voltage Standing Wave Ratio 1.3 Regulatory and Type Approval Information 1.3.
CINTERION® BGS12 Hardware Interface Description Contents 13 of 109 Page NOTE: Hereby, Gemalto M2M GmbH declares that this GSM/GPRS Wireless Module (Model No.:BGS12) is in compliance with the essential requirements and other relevant provisions of RED 2014/53/EU. This product can be used across EU member states. The full text of the EU declaration of conformity is available at the following internet address: https://www.gemalto.
CINTERION® BGS12 Hardware Interface Description Contents 14 of 109 Page Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
CINTERION® BGS12 Hardware Interface Description Contents 15 of 109 Page 1.3.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable BGS12 based applications to be evaluated and approved for compliance with national and/or international regulations.
CINTERION® BGS12 Hardware Interface Description Contents 16 of 109 Page 1.3.3 Safety Precautions The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating BGS12. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product.
CINTERION® BGS12 Hardware Interface Description Contents 17 of 109 Page IMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
CINTERION® BGS12 Hardware Interface Description Contents 18 of 109 Page 2 Product Concept 2.1 Key Features at a Glance Feature Implementation General Frequency bands Quad band : GSM 850/900/1800/1900MHz GSM class Small MS Output power (according to Release 99, V5) GSM850 824.2MHz~848.8MHz GSM:31.5±1dBm GPRS:31.5±1dBm PCS1900 1850.2MHz~1909.8MHz GSM:27.5±1dBm GPRS:27.5±1dBm EGSM900:880~915MHz GSM:32.8dBm GPRS:27.3dBm DCS1800：1710MHz~1785MHz GSM:30.4dBm GPRS:24.1dBm 3.4V to 4.
CINTERION® BGS12 Hardware Interface Description Contents Feature 19 of 109 Page Implementation Software AT commands TCP/IP stack Firmware update Hayes 3GPP TS 27.007, TS 27.005, Gemalto M2M Protocols: TCP server/client, UDP, HTTP, FTP Access by AT commands Generic update from host application over ASC1. Interfaces Module interface 3 serial interfaces Audio Surface mount device with solderable connection pads (SMT application interface).
CINTERION® BGS12 Hardware Interface Description Contents Feature 20 of 109 Page Implementation Evaluation kit Phonebook SIM and phone SSL security TLS 1.2 RLS monitoring Jamming detection Evaluation module BGS12 module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75. DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering.
CINTERION® BGS12 Hardware Interface Description Contents 21 of 109 Page 2.2 BGS12 System Overview -6 -2 -1 -1 -1 -2 -1 -2 -8 -2 -4 -5 -1 -1 -1 -1 -1 -1 2-6 Figure 1: BGS12 system overview BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 22 of 109 Page 2.3 Circuit Concept Figure 2 shows a block diagram of the BGS12 module and illustrates the major functional components: Baseband block: • GSM baseband processor and power management • Stacked flash/PSRAM memory • Application interface (SMT with connecting pads) GSM RF section: • RF transceiver (part of baseband processor IC) • RF power amplifier/front-end module inc.
CINTERION® BGS12 Hardware Interface Description Contents 23 of 109 Page 3 Application Interface BGS12 is equipped with an SMT application interface that connects to the external application. The host interface incorporates several subinterfaces described in the following sections: • • • • • • • • • • • • Power supply - see Section 3.2 SIM/USIM interface - see Section 3.7 Serial interface ASC0 - see Section 3.8 Serial interface ASC1 - see Section 3.9 Serial interface ASC2 - see Section 3.
CINTERION® BGS12 Hardware Interface Description Contents 24 of 109 Page 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Normal GSM/GPRS Various power save modes set with AT+CFUN operation SLEEP command. Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too.
CINTERION® BGS12 Hardware Interface Description Contents 25 of 109 Page 3.2 Power Supply BGS12 needs to be connected to a power supply at the SMT application interface - 3 lines each BATT+BB, BATT+RF and GND. BATT+BB is for the general power management and BATT+RF is for the GSM power amplifier supply. The power supply of BGS12 has to be a single voltage source at BATT+BB and BATT+RF. It must be able to provide the peak current during the uplink transmission.
CINTERION® BGS12 Hardware Interface Description Contents 26 of 109 Page 3.2.2 Measuring the Supply Voltage (VBATT+) To measure the supply voltage VBATT+ it is possible to define two reference points GND and BATT+. GND should be the module’s shielding, while BATT+ should be a test pad on the external application the module is mounted on. The external BATT+ reference point has to be connected to and positioned close to the SMT application interface’s BATT+ pads 5 or 53 as shown in Figure 4.
CINTERION® BGS12 Hardware Interface Description Contents 27 of 109 Page When the operating voltage BATT+BB/BATT+RF is applied, BGS12 can be switched on by means of the ON signal. If the operating voltage BATT+BB/BATT+RF is applied while the ON signal is present for at least 2s, the BGS12 will be switched on automatically. The startup time is about 4s.
CINTERION® BGS12 Hardware Interface Description Contents 28 of 109 Page BATT+BB BATT+RF VDDLP ON A high impulse starts the module up EMERG_RST VDIG Figure 6: ON timing If configured to a fixed bit rate (AT+IPR≠0), the module will send the URC “^SYSSTART” which notifies the host application that the first AT command can be sent to the module.
CINTERION® BGS12 Hardware Interface Description Contents 29 of 109 Page Figure 7: Sample circuit to suppress spikes or glitches on ON signal line 3.3.2 Restart BGS12 After startup BGS12 can be restarted as described in the following sections: • Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.3.2.1). • Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.3.2.2) 3.3.2.
CINTERION® BGS12 Hardware Interface Description Contents 30 of 109 Page reset state. The reset state is described in Section 3.3.3 as well as in the figures showing the startup behavior of an interface. After releasing the EMERG_RST line, i.e., with a change of the signal level from low to high, the module restarts. The other signals continue from their reset state as the module was switched on by the ON signal.
CINTERION® BGS12 Hardware Interface Description Contents 31 of 109 Page 2) After reset: BGS12 has finished the reset action and has not entered the firmware initialization state. 3) Firmware initialization: The software has taken the control right of hardware, and begins to initialize the firmware. At reset state is reached with the rising edge of the EMERG_RST signal - either after a normal module startup (see Section 3.3.1.1) or after a reset (see Section 3.3.2.2).
CINTERION® BGS12 Hardware Interface Description Contents Abbreviations used in above Table 7: L = Low level H =High level L/H = Low or High level T = Tristate I = Input O = Output IO=Input or Output 32 of 109 Page OD = Open Drain PD = Pull Down PU = Pull Up 3.3.4 Turn off BGS12 To switch the module off the following procedures may be used: • Software controlled shutdown procedure: See Section 3.3.4.1. Software controlled by sending the AT^SMSO command over the serial application interface.
CINTERION® BGS12 Hardware Interface Description Contents 33 of 109 Page Figure 9: Switch off behavior 3.3.5 Automatic Shutdown Automatic shutdown takes effect if any of the following events occurs: • the BGS12 board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.3.5.1) • undervoltage or overvoltage is detected (see Section 3.3.5.2 and Section 3.3.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with the AT^SMSO command, i.e.
CINTERION® BGS12 Hardware Interface Description Contents 34 of 109 Page Table 8: Temperature dependent behavior Sending temperature alert (15s after BGS12 startup, otherwise only if URC presentation enabled) ^SCTM_B: 1 Board close to overtemperature limit. ^SCTM_B: -1 Board close to undertemperature limit. ^SCTM_B: 0 Board back to non-critical temperature range.
CINTERION® BGS12 Hardware Interface Description Contents 35 of 109 Page 3.4 Power Saving SLEEP mode reduces the functionality of the BGS12 module to a minimum and, thus, minimizes the current consumption to the lowest level. Settings can be made using the AT+CFUN command. For details see below and [1]. SLEEP mode falls into two categories: • NON-CYCLIC SLEEP mode AT+CFUN=0 • CYCLIC SLEEP modes, selectable with AT+CFUN=7 or 9.
CINTERION® BGS12 Hardware Interface Description Contents 36 of 109 Page Table 9 for a summary of all modes. The CYCLIC SLEEP mode is a dynamic process which alternatingly enables and disables the serial interface. By setting/resetting the CTS signal, the module indicates to the application whether or not the UART is active. The timing of CTS is described below. Both the application and the module must be configured to use hardware flow control (RTS/ CTS handshake). The default setting of BGS12 is AT\Q0 (n
CINTERION® BGS12 Hardware Interface Description Contents 37 of 109 Page 3.4.5 Timing of the CTS Signal in CYCLIC SLEEP Modes The CTS signal is enabled in synchrony with the module’s paging cycle. It goes active low each time when the module starts listening to a paging message block from the base station. The timing of the paging cycle varies with the base station. The duration of a paging interval can be calculated from the following formula: 4.
CINTERION® BGS12 Hardware Interface Description Contents 38 of 109 Page Figure 11: Beginning of power saving if CFUN=7 3.4.6 Power Saving in OFF-state When the BGS12 is powered off, and the BATT+BB, BATT+RF lines are supplied, the OFFcurrent can be lesser than 100uA (VBATT+ =4.2V). Detail power off state supply current of IBATT+ is shown in Table 27. If the power-off current is a concern, it is suggested to use a MOSFET as a switch to reduce the 100uA (VBATT+ =4.
CINTERION® BGS12 Hardware Interface Description Contents 39 of 109 Page 3.4.7 Wake up BGS12 from SLEEP Mode A wake-up event is any event that causes the module to draw current. Depending on the selected mode the wake-up event either switches SLEEP mode off and takes BGS12 back to AT+CFUN=1, or activates BGS12 temporarily without leaving the current SLEEP mode. Definitions of the state transitions described in Table 9: Quit = BGS12 exits SLEEP mode and returns to AT+CFUN=1.
CINTERION® BGS12 Hardware Interface Description Contents 40 of 109 Page the module is able to receive data again. This delay depends on the current module activities (e.g. paging cycle) and may be up to 60ms. The ability to receive data is signalized by CTS0 and CTS2. It is therefore recommended to enable RTS/CTS flow control, not only in CYCLIC SLEEP mode, but also in NON-CYCLIC SLEEP mode. 3.
CINTERION® BGS12 Hardware Interface Description Contents 41 of 109 Page Table 11: Signals of the SIM interface (SMT application interface) Signal Description CCCLK Chipcard clock, various clock rates can be set in the baseband processor. The total capacitors on CCCLK should be less than 12pF. Some device which connect with CCCLK, have the equivalent capacitors, such as the ESD component and analogue switch IC.
CINTERION® BGS12 Hardware Interface Description Contents 42 of 109 Page pliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach would be to use a separate SIM card ground connection to shield the CCIO line from the CCCLK line. A GND line may be employed for such a case. Notes: The total capacitors on CCCLK should be less than 12pF.
CINTERION® BGS12 Hardware Interface Description Contents VDIG(2.8V) Voltage domain ASC0 ASC1 Board-to-board connector Module 43 of 109 Page Serial inrterface ASC0 Serial inrterface ASC1 ASC2 Serial inrterface ASC2 GPIOs GPIOs Figure 14: VDIG power supply domain BGS12 is designed for use as a DCE.
CINTERION® BGS12 Hardware Interface Description Contents 44 of 109 Page Features: • Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. • ASC0 is primarily designed for controlling voice calls, GPRS data and for controlling the GSM module with AT commands. • The DTR0 signal will only be polled once per second from the internal firmware of BGS12.
CINTERION® BGS12 Hardware Interface Description Contents 45 of 109 Page For output and input states see Table 7 Figure 16: ASC0 startup behavior Please note that no data must be sent over the ASC0 interface before the interface is active and ready to receive data (see Section 3.3.1.1). BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 46 of 109 Page 3.9 Serial Interface ASC1 BGS12 offers a 2-wire unbalanced, asynchronous modem interface ASC1 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28. The electrical level of the ASC1 interface is set to 2.8V. For electrical characteristics please refer to Table 20. BGS12 is designed for use as a DCE.
CINTERION® BGS12 Hardware Interface Description Contents 47 of 109 Page For output and input states see Table 7 Figure 18: ASC1 startup behavior 3.10 Serial Interface ASC2 BGS12 offers a 4-wire unbalanced, asynchronous modem interface ASC2 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITUT V.28. The electrical level of the ASC2 interface is set to 2.8V. For electrical characteristics please refer to Table 20. BGS12 is designed for use as a DCE.
CINTERION® BGS12 Hardware Interface Description Contents 48 of 109 Page Features • Includes only the data lines TXD2 and RXD2 plus RTS2 and CTS2 for hardware handshake. • On ASC2 no RING line is available. The indication of URCs on the second interface depends on the settings made with the AT^SCFG command. For details refer to [1]. • Configured for 8 data bits, no parity and 1 or 2 stop bits. • ASC2 can be operated at fixed bit rates from 4,800 bps to 230,400 bps. Autobauding is not supported on ASC2.
CINTERION® BGS12 Hardware Interface Description Contents 49 of 109 Page 3.11 Analog Audio Interface BGS12 has an analog audio interface with a balanced analog microphone input and a balanced analog earpiece output. A supply voltage is provided at dedicated pad. BGS12 offers four audio modes which can be selected with the AT^SNFS command. The electrical characteristics of the voice band part vary with the audio mode. For example, sending and receiving amplification, side tone paths, noise suppression etc.
CINTERION® BGS12 Hardware Interface Description Contents 50 of 109 Page Figure 22: Differential Microphone connection Figure 23: Line Input 3.11.2 Loudspeaker Output BGS12 provides a differential loudspeaker output EPP/EPN. If it is used as line output (see Figure 25), the application should provide a capacitor decoupled differential input to eliminate GSM humming. A first order low pass filter above 4 kHz may be useful to improve the outof-band signal attenuation.
CINTERION® BGS12 Hardware Interface Description Contents 51 of 109 Page Figure 24: Differential loudspeaker connection Figure 25: Line output connection BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 52 of 109 Page 3.12 I2S Interface BGS12 offers a I2S interface with 4 lines. These signals are shared with IISDO, IISLRCK, IISDI, IISCLK pads. Normal I2S master mode supports: • 16 bits word, linear. • Mono interface. • Sample:parameter. • I2S runs in normal I2S – long alignment mode. • I2S word alignment signal always runs at the and synchronizes 2 channel (timeslots on word alignment high, word alignment low).
CINTERION® BGS12 Hardware Interface Description Contents 53 of 109 Page When the BGS12 starts up, all GPIO lines states are described in Section 3.3.3. Therefore, it is recommended to connect external pull-up or pull-down resistors to all GPIO lines you want to use as output. The power supply domain voltage level for GPIO5 to GPIO10 is 2.8V. I2CCLK (GPIO9) and I2CDAT (GPIO10) require an external pull-up resistor. The following figure shows the startup behavior of the GPIO interface.
CINTERION® BGS12 Hardware Interface Description Contents 54 of 109 Page 3.14 I2C Interface The signal lines of the I2C interface are shared with the GPIO9 and GPIO10 signal pads. The power supply domain voltage level for 2.8V, the I2C interface pads voltage level (see Figure 14). I2C is a serial data transfer bus. Only normal (100kbps) and fast modes (400kbps) are supported. It consists of two lines, the serial data line I2CDAT (GPIO10) and the serial clock line I2CCLK (GPIO9).
CINTERION® BGS12 Hardware Interface Description Contents 55 of 109 Page Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. The timing of TSU:STO and SHD:STA has deviation from the I2C specification but the I2C interface do work properly with slave devices as verified. The deviation cannot be changed due to limitation on the chipset.
CINTERION® BGS12 Hardware Interface Description Contents 1.8V 2K I2C EEPROM 1 2 3 4 VI2C VCC 8 7 NC SCL 6 A0 A1 A2 GND SDA 5 C300 100n I2CCLK_A I2CDAT_A R302 4K7 Capacitor 56 of 109 Page R301 4K7 VI2C Resistors EEPROM Figure 30: Additional EEPROM to enable usage of I2C interface on DSB75 Furthermore, two jumpers (X171, for pins 7&8, 9&10) must be set in order to connect the module's I2C signals with the memory device's input pins. For details see Figure 31. BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 57 of 109 Page X171 1 2 3 4 5 6 7 8 9 10 11 12 13 14 IGT R100 1K X170 CCVCC CCVPP CCIO CCCLK CCRST GND CCDET1 CCDET2 1 5 VSIM 6 3 2 4 7 8 DCD0 I2CCL I2CCK I2CD I2CD RESE CCIO CCCLK C110 C111 220n 1n CCRST Jumper settings Figure 31: Jumper settings to enable usage of I2C interface on DSB75 BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 58 of 109 Page 3.15 Jamming Indicator The GPIO6 interface line can be configured as a jamming indicator by AT command. When possible jamming is detected by the module, GPIO6 is set to high level. This state lasts as long as possible jamming is detected. By default, the jamming indicator feature is disabled. It has to be enabled using the AT command AT^SCFG "MEopMode/JamDet/If". For details see [1]. 3.
CINTERION® BGS12 Hardware Interface Description Contents 59 of 109 Page The behavior of the RING0 line varies with the type of event: • When a voice call comes in the RING0 line goes low for 1s and high for another 4s. Every 5 seconds the ring string is generated and sent over the RXD0 line. If there is a call in progress and call waiting is activated for a connected handset device, the RING0 line switches to ground in order to generate acoustic signals that indicate the waiting call.
CINTERION® BGS12 Hardware Interface Description Contents 60 of 109 Page low state or high impedance state. The sample power indication circuit illustrated in Figure 36 denotes the module’s active state with a low signal and the module’s Power Down mode with a high signal or high impedance state. Figure 36: Power indication circuit BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 61 of 109 Page 3.19 Fast Shutdown BGS12 provides a dedicated fast shutdown signal. The FAST_SHTDWN line is an active low control signal and it is recommended to be applied for at least 10 milliseconds. If unused this pin can be left open because of a configured internal pull-up resistor. By default, the fast shutdown feature is disabled. It has to be enabled using the AT command AT^SCFG "MEShutdown/Fso". For details see [1].
CINTERION® BGS12 Hardware Interface Description Contents 62 of 109 Page 4 Antenna Interface The RF interface has an impedance of 50Ω. BGS12 is capable of sustaining a total mismatch at the antenna lines without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression.
CINTERION® BGS12 Hardware Interface Description Contents 63 of 109 Page The distance between the antenna RF_OUT pad (#59) and its neighboring GND pads (#58, #60) has been optimized for best possible impedance. On the application PCB, special attention should be paid to these 3 pads, in order to prevent mismatch. The wiring of the antenna connection line, starting from the antenna pad to the application antenna should result in a 50Ω line impedance.
CINTERION® BGS12 Hardware Interface Description Contents 4.2.1.2 64 of 109 Page Micro-Stripline This section gives two line arrangement examples for micro-stripline. Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 40: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 65 of 109 Page Application board Ground line Antenna line Ground line Figure 41: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 66 of 109 Page Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 42: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 67 of 109 Page Application board Ground line Antenna line Ground line Figure 43: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 68 of 109 Page 4.2.2 Routing Example 4.2.2.1 Interface to RF Connector Figure 44 shows the connection of the module‘s antenna pad with an application PCB‘s coaxial antenna connector. Please note that the BGS12 bottom plane appears mirrored, since it is viewed from BGS12 top side. By definition the top of customer's board shall mate with the bottom of the BGS12 module. Figure 44: Pouting to application‘s RF connector - top view BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 69 of 109 Page 5 Electrical Reliability and Radio Characteristics 5.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 17 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to BGS12. Table 17: Absolute maximum ratings Parameter Min Max Unit Supply voltage BATT+BB, BATT+RF -0.3 +5 V Voltage at all digital lines in Power Down mode -0.3 +0.
CINTERION® BGS12 Hardware Interface Description Contents 70 of 109 Page See also Section 3.3.5.1 for information about the NTC for on-board temperature measurement, automatic thermal shutdown and alert messages. Note that within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and current supply voltage. 5.
CINTERION® BGS12 Hardware Interface Description Contents 71 of 109 Page 5.4 Pad Assignment and Signal Description The SMT application interface on the BGS12 provides connecting pads to integrate the module into external applications. Figure 45 shows the connecting pads’ numbering plan, the following Table 20 lists the pads’ assignments. Figure 45: Numbering plan for connecting pads (bottom view) BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 72 of 109 Page Table 20: Pad assignments Pad no. Signal name Pad no. Signal name Pad no.
CINTERION® BGS12 Hardware Interface Description Contents Table 21: Electrical description of application interface Function Signal IO Signal form and level Power supply I BATT+BB BATT+RF Power External supply voltage GND VDIG O Ignition ON I Emergency shutdown EMERG_ RST I VImax = 4.35V VInorm = 3.8V VImin = 3.2V1 during Tx burst on board C I C=0 2.1A C=2200uF 0.92A C=4400uF 0.
CINTERION® BGS12 Hardware Interface Description Contents SIM card detection CCIN I VIHmin = 1.96V VIHmax= 3.1V VILmax = 0.84V 74 of 109 Page CCIN = High, SIM card inserted. If unused keep line open. 1. The module operates within a voltage level range from 3.4V up to 4.2V without restrictions. It is suggested to supply 3.4V to 4.35V on module. Please add at least 3700uF capacitor to VBAT signal line against GSM burst current while 3.2V to 3.4V supply for BGS12 module. BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents Table 22: Electrical description of application interface Function Signal IO Signal form and level CCRST O 75 of 109 Page Comment VOLmax = 0.30V VOHmin = 2.40V VOHmax = 3.2V VILmax = 0.60V VIHmin=1.95V VIHmax = 3.2V CCIO I/O 3V SIM Card Interface CCCLK CCVCC CCRST VOLmax = 0.30V VOHmin = 2.40V VOHmax = 3.2V O VOLmax = 0.30V VOHmin = 2.40V VOHmax = 3.2V O VOmin = 2.59V VOtyp = 3.00V VOmax = 3.2V IOmax = 150mA O VOLmax = 0.
CINTERION® BGS12 Hardware Interface Description Contents Table 23: Electrical description of application interface Function Signal IO Signal form and level Serial Interface ASC0 Serial Interface ASC1 Serial Interface ASC2 RXD0 O TXD0 I CTS0 O RTS0 I RING0 O DTR0 I DSR0 O DCD0 RXD1 O O TXD1 I RXD2 O TXD2 I RTS2 I CTS2 O VOLmax = 0.19V VOHmin = 2.78V VOHmax = 3.1V I2CCLK O I2CDAT IO Comment If unused keep line open. VILmax = 0.84V VIHmin = 1.96V VIHmax = 3.3V VOLmax = 0.
CINTERION® BGS12 Hardware Interface Description Contents Table 25: Electrical description of application interface Function Signal IO Signal form and level GPIO interface GPIO5 IO GPIO6 IO GPIO7 IO GPIO8 GPIO10, i.e., I2CDAT IO IO GPIO9, IO i.e., I2CCLK VOLmax = 0.19V VOHmin = 1.5V VOHmax = 2.05V VILmax = 0.57V VIHmin = 1.53V VIHmax = 2.05V Input, Open Drain Output (no Pull up) VILmax = 0.84V VIHmin = 1.96V VIHmax = 3.1V 77 of 109 Page Comment If unused keep line open.
CINTERION® BGS12 Hardware Interface Description Contents Table 26: Electrical description of application interface Function Signal IO Signal form and level Analog audio interfac e VMIC O VOtyp = 1.8V Imax =0.5 mA 78 of 109 Page Comment Microphone supply for customer feeding circuits If unused keep line open. EPP O EPN O MICP I MICN I Differential, max 1.3Vrms at 32 load 0.95kHz sine wave ZItyp = 2k Vinmax = 0.
CINTERION® BGS12 Hardware Interface Description Contents 79 of 109 Page 5.5 Power Supply Ratings Table 27: Power supply ratings1 Parameter Description Conditions BATT+BB BATT+RF IVDDLP IBATT+ Supply voltage Voltage must stay within the min/ max values, including voltage drop, ripple and spikes. Voltage drop during transmit burst OFF state supply current Normal condition, power control level for Pout max Average supply current RTC backup @ BATT+ = 0V @ VDDLP = 3.3V @ VDDLP = 3.0V @ VDDLP = 2.
CINTERION® BGS12 Hardware Interface Description Contents 80 of 109 Page DATA mode GPRS 3 TX, 2Rx GSM 8502 EGSM 9002 DCS 18003 PCS 19003 DATA mode GPRS 2 Tx, 3 Rx GSM 8502 EGSM 9002 DCS 18003 PCS 19003 Table 28:Power supply ratings1 Parameter Description Conditions IBATT+ Peak supply Power Control Level GSM 8502 current EGSM 9002 (during DCS 18003 transmission PCS 19003 slot every 4.6ms) OFF state Power Down mode supply @ BATT+ =3.8V current mA 318.4 320.2 238.8 212.7 mA 283.1 284.2 210.8 186.
CINTERION® BGS12 Hardware Interface Description Contents 81 of 109 Page 5.6 Electrical Characteristics of the Voiceband Part 5.6.1 Setting Audio Parameters by AT Commands The audio modes 1 to 3 can be adjusted according to the parameters listed below. Each audio mode is assigned a separate set of parameters. Table 29: Audio parameters adjustable by AT command Parameter Influence to Range Gain Calculation 3dB steps inBbcGain MICP/MICN analog amplifier gain 0...8 of baseband controller before ADC 0...
CINTERION® BGS12 Hardware Interface Description Contents 82 of 109 Page 5.6.2 Audio Programming Model The audio programming model shows how the signal path can be influenced by varying the AT command parameters. The parameters and can be set with AT^SNFI. All the other parameters are adjusted with AT^SNFO. Figure 46: Audio programming model BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 83 of 109 Page 5.6.3 Characteristics of Audio Modes The electrical characteristics of the voiceband part depend on the current audio mode set with the AT^SNFS command. Table 30: Voiceband characteristics (typical) Audio mode no. 1 2 AT^SNFS= 3 Name User Handset Basic Handsfree Headset Purpose DSB with individual handset Car Kit Headset Gain setting via AT command.
CINTERION® BGS12 Hardware Interface Description Contents 84 of 109 Page 5.6.4 Voiceband Receive Path Test conditions: • The values specified below were tested to 0.95kHz and 0dB gain stage, unless otherwise stated. Table 31: Voiceband receive path Parameter Min Typ Max Unit Test condition/remark 32Ohm, 1.
CINTERION® BGS12 Hardware Interface Description Contents 85 of 109 Page 5.6.5 Voiceband Transmit Path Test conditions: • The values specified below were tested to 0.95kHz and 0dB gain stage, unless otherwise stated. Table 32: Voiceband transmit path Parameter Min Typ Input voltage (peak to peak) MICP to MICN Max Unit Test condition/Remark 0.
CINTERION® BGS12 Hardware Interface Description Contents 86 of 109 Page 5.7 Antenna Interface Specification Measurement conditions: Tamb= 25°C, VBATT+ nom = 4.1V.
CINTERION® BGS12 Hardware Interface Description Contents 87 of 109 Page 5.8 Electrostatic Discharge The GSM module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a BGS12 module.
CINTERION® BGS12 Hardware Interface Description Contents 88 of 109 Page 6 Mechanics, Mounting and Packaging The following sections describe the mechanical dimensions of BGS12 and give recommendation for integrating BGS12 into the host application. Also, a number of files containing product model data in STEP format as well as Gerber data for the external application footprint are attached to this PDF. Please open the attachments navigation panel to view and save these files. 6.
CINTERION® BGS12 Hardware Interface Description Contents 89 of 109 Page Figure 48: Dimensions of BGS12 (all dimensions in mm) BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 90 of 109 Page 6.2 Mounting BGS12 onto the Application Platform This section describes how to mount BGS12 onto the PCBs (=printed circuit boards), including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [3]. 6.2.1 SMT PCB Assembly 6.2.1.
CINTERION® BGS12 Hardware Interface Description Contents 91 of 109 Page Note that depending on coplanarity or other properties of the external PCB, it could be that all of the central ground pads may have to be soldered. Figure 50: Recommended design for 120 micron thick stencil (top view) Figure 51: Recommended design for 150 micron thick stencil (top view) BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 6.2.1.2 92 of 109 Page Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT process. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling.
CINTERION® BGS12 Hardware Interface Description Contents 93 of 109 Page 6.2.3 Soldering Conditions and Temperature 6.2.3.1 Reflow Profile Figure 52: Reflow Profile Table 35: Reflow temperature ratings Profile Feature Pb-Free Assembly Initial temperature (TI) Average temperature slope (TI to TSmin) 25 °C 0.5-2.0 °C /second Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) 150°C 210°C 90-120 seconds Average ramp up rate (TSmax to TP) 3K/second max.
CINTERION® BGS12 Hardware Interface Description Contents 6.2.3.2 94 of 109 Page Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module: • A maximum module temperature of 245°C. This specifies the temperature as measured at the module’s top side. • A maximum duration of 30 seconds at this temperature.
CINTERION® BGS12 Hardware Interface Description Contents 6.2.4.2 95 of 109 Page Processing Life BGS12 must be soldered to an application within 72 hours after opening the MBB (=moisture barrier bag) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%. 6.2.4.
CINTERION® BGS12 Hardware Interface Description Contents 96 of 109 Page 6.3.1.1 Orientation Figure 53: Carrier tape Figure 54: Reel direction BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 97 of 109 Page Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 55: Barcode label on tape reel 6.3.2 Shipping Materials BGS12 is distributed in tape and reel carriers.
CINTERION® BGS12 Hardware Interface Description Contents 98 of 109 Page The label shown in Figure 57 summarizes requirements regarding moisture sensitivity, including shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. Figure 57: Moisture Sensitivity Label MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag.
CINTERION® BGS12 Hardware Interface Description Contents 99 of 109 Page Figure 58: Humidity Indicator Card – HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. 6.3.2.2 Transportation Box Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains 4 reels with 500 modules each. BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 100 of 109 Page 7 Sample Application Figure 59 shows a typical example of how to integrate a BGS12 module with an application. Usage of the various host interfaces depends on the desired features of the application. The audio interface demonstrates the balanced connection of microphone and earpiece. This solution is particularly well suited for internal transducers.
CINTERION® BGS12 Hardware Interface Description Contents 101 of 109 Page Figure 59: Schematic diagram of BGS12 sample application BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 102 of 109 Page 7.1 Blocking against RF on Interface Lines To reduce EMI issues there are serial resistors implemented on the module for the ignition, UART0, UART1 and UART2 lines (cp. Section 5.8). There are 560Ohm serial resist- ors on UART0, UART1 andUART2 lines. However, all other signal lines have no EMI measures on the module and there are no blocking measures at the module’s interface to an external applica- tion.
CINTERION® BGS12 Hardware Interface Description Contents 103 of 109 Page The following table lists for each signal line at the SMT application interface the EMI measures that may be implemented. Table 37: EMI measures on the application interface Signal name EMI measures Remark A CCIN B C D x E x CCRST x x x CCIO x x x CCCLK x x x The external capacitor should be not higher than 30pF on CCIO and CCRST signal rail.
CINTERION® BGS12 Hardware Interface Description Contents 104 of 109 Page 8 Reference Approval 8.1 Reference Equipment for Type Approval The Gemalto M2M reference setup submitted to type approve BGS12 is shown in the following figure: Figure 61: Reference equipment for Type Approva BGS12 HID_V00.
CINTERION® BGS12 Hardware Interface Description Contents 105 of 109 Page 9 Appendix 9.
CINTERION® BGS12 Hardware Interface Description Contents Table 39: Molex sales contacts (subject to change) Molex Molex Deutschland GmbH For further information please Felix-Wankel-Str. 11 click: http://www.molex.com 4078 Heilbronn-Biberach Germany Molex China Distributors Beijing, Room 1319, Tower B, COFCO No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +49-7066-9555 0 Fax: +49-7066-9555 29 Email: mxgermany@molex.com Molex Singapore Pte. Ltd.
CINTERION® BGS12 Hardware Interface Description Contents 107 of 109 Page 9.2 FCC statement FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
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of 109 About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2011 annual revenues of €2 billion and more than 10,000 employees operating out of 74 offices and 14 Research & Development centers, located in 43 countries. We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasingly want the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere - in ways that are enjoyable and safe.
