Specifications

CINTERION
®
BGS12 Hardware Interface Description
Contents
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Page
BGS12 HID_V00.915
Confidential / Released
2019
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6.2.1.2
Board Level Characterization
Board level characterization issues should also be taken into account if devising an SMT
process.
Characterization tests should attempt to optimize the SMT process with regard to board level
reliability. This can be done by performing the following physical tests on sample boards: Peel
test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount
checks are described in [3].
It is recommended to characterize land patterns before an actual PCB production, taking
individual processes, materials, equipment, stencil design, and reflow profile into account. For
land and stencil pattern design recommendations see also Section 6.2.1.1. Optimizing the
solder stencil pattern design and print process is necessary to ensure print uniformity, to de-
crease solder voids, and to increase board level reliability.
Daisy chain modules for SMT characterization are available on request. For details refer to
[3].
Generally, solder paste manufacturer recommendations for screen printing process para-
meters and reflow profile conditions should be followed. Maximum ratings are described in
Section 6.2.3.
6.2.2 Moisture Sensitivity Level
BGS12 comprises components that are susceptible to damage induced by absorbed
moisture.
Gemalto M2M’s BGS12module complies with the latest revision of the IPC/JEDEC J-STD-
020 Standard for moisture sensitive surface mount devices and is classified as MSL 4.
For additional MSL (=moisture sensitivity level) related information see Section 6.2.4 and
Section 6.3.2.