Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
EXS62-W/EXS82-W Hardware Interface Description
2 Interface Characteristics
61
t EXS62-W_EXS82-W_HID_v01.200ee 2022-09-07
Public/ Released
Page 16 of 144
2 Interface Characteristics
EXSx2-W is equipped with an SMT application interface that connects to the external applica-
tion. The SMT application interface incorporates the various application interfaces as well as
the RF antenna interface.
2.1 Application Interface
2.1.1 Pad Assignment
The SMT application interface on the EXSx2-W provides connecting pads to integrate the mod-
ule into external applications. Table 1 lists the pads’ assignments. Figure 4 (bottom view) and
Figure 5 (top view) show the connecting pads’ numbering plan.
As a rule all signal pads should be soldered for mechanical stability and heat dissipation.
Signal pads that are not used, i.e., marked as “rfu” (reserved for future use) or “nc” (not con-
nected), need to be soldered, but should not have an electrical connection to the external ap-
plication or GND. Also, pads marked as “rfu” are further qualified as “dnu” (do not use),
indicating that they are currently not supported, but internally connected for possible future us-
age. In addition, pads mentioned in squared brackets (I2CDAT and I2CCLK pads, SPI pads,
as well as shared GPIO pads) are available with the embedded processing option only.
Please note that the reference voltages listed in Table 2 are the values measured directly on
the EXSx2-W module. They do not apply to the accessories connected.
Note: Thales strongly recommends to provide test points for certain signal lines to and from
the module while developing SMT applications – for debug, test and/or trace purposes during
the manufacturing process. In this way it is possible to detect soldering (and other) problems.
Please refer to [5] and [7] for more information on test points and how to implement them. The
signal lines for which test points should be provided for are marked as “Test point recommend-
ed“ in Table 2. Apart from these there should also be a test point be provided for pad 3.