Specifications

Table Of Contents

Cinterion

PLSx3 Hardware Interface Description

3.5 Operating Temperatures

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3.5 Operating Temperatures

Table 22: Board Temperature

3.6 Electrostatic Discharge

The module is not protected against Electrostatic Discharge (ESD) in general. Consequently,

it is subject to ESD handling precautions that typically apply to ESD sensitive components.

Proper ESD handling and packaging procedures must be applied throughout the processing,

handling and operation of any application that incorporates a PLSx3 module.

An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1.

PLSx3 has been tested according to the following standards. Electrostatic values can be gath-

ered from the following table.

Parameter Min Typ Max Unit

Operating temperature range -30 +85 °C

Restricted temperature range

1. Restricted operation allows normal mode data transmissions for limited time until automatic thermal

shutdown takes effect. Within the restricted temperature range (outside the operating temperature

range) the specified electrical characteristics may be in- or decreased.

-40 +95 °C

Automatic shutdown

Temperature measured on PLSx3 board

2. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may oc-

cur. The possible deviation is in the range of TBD

°C at the over temperature limit.

Note: Within the specified operating temperature ranges the board temperature may vary to a

great extent depending on operating mode, used frequency band, radio output power and

current supply voltage.

<-40 +95 °C

Table 23: Electrostatic values

Specification/Requirement Contact discharge Air discharge

ANSI/ESDA/JEDEC JS-001-2017 (Human Body Model)

All LGA pads ±1.0kV (HBM) n.a.

JS-002-2018 (Charged Device Model)

All LGA pads ±250V (CDM) n.a.

ETSI EN 301 489-1/7

BATT+ TBD TBD

Antenna pads TBD ±8kV