Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
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PLSx3 Hardware Interface Description
4.2 Mounting PLSx3 onto the Application Platform
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4.2.1.2 Board Level Characterization
Board level characterization issues should also be taken into account if devising an SMT pro-
cess.
Characterization tests should attempt to optimize the SMT process with regard to board level
reliability. This can be done by performing the following physical tests on sample boards: Peel
test, bend test, tensile pull test, drop shock test and temperature cycling.
It is recommended to characterize land patterns before an actual PCB production, taking indi-
vidual processes, materials, equipment, stencil design, and reflow profile into account. For land
and stencil pattern design recommendations see also Section 4.2.1.1. Optimizing the solder
stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-
der voids, and to increase board level reliability.
Generally, solder paste manufacturer recommendations for screen printing process parame-
ters and reflow profile conditions should be followed. Maximum ratings are described in Section
4.2.3.
4.2.2 Moisture Sensitivity Level
PLSx3 comprises components that are susceptible to damage induced by absorbed moisture.
Thales’s PLSx3 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan-
dard for moisture sensitive surface mount devices and is classified as MSL 4.
For additional moisture sensitivity level (MSL) related information see Section 4.2.4 and Sec-
tion 4.3.2.