Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
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PLSx3 Hardware Interface Description
2 Interface Characteristics
60
t PLSx3_HID_v01.003 2021-03-12
Public / Released
Page 17 of 121
2 Interface Characteristics
PLSx3 is equipped with an SMT application interface that connects to the external application.
The SMT application interface incorporates the various application interfaces as well as the RF
antenna interface.
2.1 Application Interface
2.1.1 Pad Assignment
The SMT application interface on the PLSx3 provides land grid array pads to integrate the mod-
ule into external applications. Table 2 lists the pad assignment. Figure 3 shows the pin mapping
on the LGA footprint.
Please note that a number of connecting pads are marked as reserved for future use (rfu) and
further qualified as either (dnu), (GND) or (nc):
• Pads marked "rfu" and qualified as "dnu" (do not use) shall be soldered but electrically not
connected.
• Pads marked "rfu" and qualified as "nc" (not connected) are internally not connected with
PLSx3 modules, but shall be soldered.
Thales strongly recommends to solder all connecting pads for mechanical stability and heat
dissipation.