Specifications

Table Of Contents
Cinterion
®
PLSx3 Hardware Interface Description
3.5 Operating Temperatures
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3.5 Operating Temperatures
Table 21: Board Temperature
3.6 Electrostatic Discharge
The module is not protected against Electrostatic Discharge (ESD) in general. Consequently,
it is subject to ESD handling precautions that typically apply to ESD sensitive components.
Proper ESD handling and packaging procedures must be applied throughout the processing,
handling and operation of any application that incorporates a PLSx3 module.
An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1.
PLSx3 has been tested according to the following standards. Electrostatic values can be gath-
ered from the following table.
Parameter Min Typ Max Unit
Operating temperature range -30 +85 °C
Restricted temperature range
1
1. Restricted operation allows normal mode data transmissions for limited time until automatic thermal
shutdown takes effect. Within the restricted temperature range (outside the operating temperature
range) the specified electrical characteristics may be in- or decreased.
-40 +95 °C
Automatic shutdown
2
Temperature measured on PLSx3 board
2. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may oc-
cur. The possible deviation is in the range of TBD
°C at the over temperature limit.
Note: Within the specified operating temperature ranges the board temperature may vary to a
great extent depending on operating mode, used frequency band, radio output power and
current supply voltage.
<-40 +95 °C
Table 22: Electrostatic values
Specification/Requirement Contact discharge Air discharge
ANSI/ESDA/JEDEC JS-001-2017 (Human Body Model)
All LGA pads ±1.0kV (HBM) n.a.
JS-002-2018 (Charged Device Model)
All LGA pads ±250V (CDM) n.a.
ETSI EN 301 489-1/7
BATT+ TBD TBD
Antenna pads TBD ±8kV