Specifications

Table Of Contents
Cinterion
®
PLSx3 Hardware Interface Description
4.2 Mounting PLSx3 onto the Application Platform
99
t PLSx3_HID_v01.003 2021-03-12
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4.2.3 Soldering Conditions and Temperature
4.2.3.1 Reflow Profile
Figure 36: Reflow Profile
Table 23: Reflow temperature ratings
1
1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-
dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline.
Profile Feature Pb-Free Assembly
Preheat & Soak
Temperature Minimum (T
Smin
)
Temperature Maximum (T
Smax
)
Time (t
Smin
to t
Smax
) (t
S
)
150°C
200°C
60-120 seconds
Average ramp up rate (T
L
to T
P
) 3K/second max.
2
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
217°C
50-90 seconds
Peak package body temperature (T
P
)245°C ±5°C
Time (t
P
) within 5 °C of the peak package body tem-
perature (T
P
)
30 seconds max.
Average ramp-down rate
- Limited ramp-down rate between 225°C and 200°C
6K/second max.
2
3K/second max.
2
Time 25°C to maximum temperature 8 minutes max.
T
L
T
P
t
P
t
L
t
S
Preheat
t to maximum
Time
Temperature
T
Smin
T
Smax