Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
PLSx3 Hardware Interface Description
4.2 Mounting PLSx3 onto the Application Platform
99
t PLSx3_HID_v01.003 2021-03-12
Public / Released
Page 90 of 121
4.2.3 Soldering Conditions and Temperature
4.2.3.1 Reflow Profile
Figure 36: Reflow Profile
Table 23: Reflow temperature ratings
1
1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-
dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline.
Profile Feature Pb-Free Assembly
Preheat & Soak
Temperature Minimum (T
Smin
)
Temperature Maximum (T
Smax
)
Time (t
Smin
to t
Smax
) (t
S
)
150°C
200°C
60-120 seconds
Average ramp up rate (T
L
to T
P
) 3K/second max.
2
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
217°C
50-90 seconds
Peak package body temperature (T
P
)245°C ±5°C
Time (t
P
) within 5 °C of the peak package body tem-
perature (T
P
)
30 seconds max.
Average ramp-down rate
- Limited ramp-down rate between 225°C and 200°C
6K/second max.
2
3K/second max.
2
Time 25°C to maximum temperature 8 minutes max.
T
L
T
P
t
P
t
L
t
S
Preheat
t to maximum
Time
Temperature
T
Smin
T
Smax