Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Antenna Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
PLSx3 Hardware Interface Description
4.2 Mounting PLSx3 onto the Application Platform
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t PLSx3_HID_v01.003 2021-03-12
Public / Released
Page 91 of 121
4.2.3.2 Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
• A maximum module temperature of 245°C. This specifies the temperature as measured at
the module’s top side.
• A maximum duration of 30 seconds at this temperature.
• Ramp-down rate from T
P
to 200°C should be controlled in order to reduce thermally induced
stress during the solder solidification phase (see Table 23 - limited ramp-down rate). There-
fore, a cool-down step in the oven’s temperature program between 200°C and 180°C
should be considered.
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
PLSx3 is specified for one soldering cycle only. Once PLSx3 is removed from the application,
the module will very likely be destroyed and cannot be soldered onto another application.
2. Temperatures measured on shielding at each corner. See also [3].
1
4
2
3
Module
Temperature sensors (1-4)