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Cinterion

TX62/TX82

Hardware Interface Description

Version: 01.000

DocId: TX62-W_TX62-W-x_TX82-W_HID_v01.000

Summary of content (154 pages)

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Cinterion® TX62/TX82 Hardware Interface Description Version: DocId: 01.000 TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 2 of 154 Document Name: Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Version: 01.000 Date: 2021-10-05 DocId: TX62-W_TX62-W-x_TX82-W_HID_v01.000 Status Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 3 of 154 Contents 154 Contents 1 Introduction ................................................................................................................. 9 1.1 Product Variants ................................................................................................ 9 1.2 Key Features at a Glance ................................................................................ 10 1.3 TX62/TX82 System Overview................
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 4 of 154 Contents 154 3 Operating Characteristics ........................................................................................ 70 3.1 Operating Modes ............................................................................................. 70 3.2 Power Up/Power Down Scenarios ................................................................... 71 3.2.1 Turn on TX62/TX82 ....................................................
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 5 of 154 Contents 154 4 Mechanical Dimensions, Mounting and Packaging............................................. 111 4.1 Mechanical Dimensions of TX62-W ............................................................... 111 4.2 Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C ................... 113 4.3 Mounting TX62/TX82 onto the Application Platform ...................................... 115 4.3.1 SMT PCB Assembly ...............
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 6 of 154 Tables 154 Tables Table 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23: Table 24: Table 25: Table 26: Table 27: Table 28: Table 29: Table 30: Table 31: Table 32: Table 33: Table 34: Table 35: Table 36: Table 37: Table 38: Table 39: Table 40: Table 41: Table 42: Tab
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 7 of 154 Figures 154 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Fig
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 8 of 154 Figures 154 Figure 48: Figure 49: Figure 50: Figure 51: Figure 52: Figure 53: Figure 54: Figure 55: Figure 56: Figure 57: Figure 58: Figure 59: Figure 60: Figure 61: Figure 62: Figure 63: Figure 64: Figure 65: Figure 66: Figure 67: Figure 68: Figure 69: Figure 70: Figure 71: Figure 72: Figure 73: Figure 74: Figure 75: Figure 76: t Power supply limits during transmit burst.....................................................
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 9 of 154 1 Introduction 19 1 Introduction This document1 describes the hardware of the Cinterion® TX62/TX82 module variants optimized for global coverage as they support a comprehensive set of bands required for global deployment. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 10 of 154 1.2 Key Features at a Glance 19 1.2 Key Features at a Glance Feature Implementation General Frequency bands (see Section 2.2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 11 of 154 1.2 Key Features at a Glance 19 Feature Implementation Power supply (see Section 2.1.2 and Section 3.4) TX82-W: - LTE and GSM: 3.1V to 4.6V - LTE with GSM deactivated: 2.8V to 4.6V TX62-W: - LTE: 2.55V to 4.8V TX62-W-B: - LTE: 2.5V to 4.5V TX62-W-C: - LTE: 3.2V to 4.2V Operating temperature (board temperature) (see Section 3.5) Normal operation: -30°C to +85°C Extended operation: -40°C to +90°C Physical (see Section 4.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 12 of 154 1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 13 of 154 1.2 Key Features at a Glance 19 Feature Implementation 2 serial interfaces (see Section 2.1.4 and Section 2.1.5) ASC0: • 8-wire modem interface with status and control lines, unbalanced, asynchronous • Adjustable baud rates: 300bps to 921,600bps • Supports RTS0/CTS0 hardware flow control (as configuration option).
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 14 of 154 1.2 Key Features at a Glance 19 Feature Implementation Special features Approval (see Section 5) RED, CE, FCC, ISED, UL, RoHS, and REACH compliant GCF, PTCRB Phonebook SIM and phone ® Cinterion IoT Suite services (Optionally) supports an IoT Suite client based on the LWM2M protocol.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 15 of 154 1.3 TX62/TX82 System Overview 19 1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 16 of 154 1.4 Circuit Concept 19 1.4 Circuit Concept Figure 2, Figure 3, Figure 4 and Figure 5 show block diagrams for the TX62/TX82 module variants, and illustrate the major functional components: LGA Pads Antenna LGA Pads BATT+_RF Power Supply GPIO HWID’s BATT+ EN IN RF Part USB_VDDA _3P3 GPIO’s REFE 2_CLK_DATA 2 GSMPA +ASM SDR_ TX_ MB_ GSM SDR_ ASM _AN T 8 4 3 Serial (ASC0) Serial (ASC1/GPIO) USB 2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 17 of 154 1.4 Circuit Concept 19 LGA Pads Power Supply GPIO HWID’s BATT+ Antenna LGA Pads EN IN RF Part Coupler USB_VDDA _3P3 8 4 3 GPIO’s 3 RF Transceiver LTE PA+ASM 4 GPDATA STMR_SYNC GSM/CatM1/CatNB Baseband controller with integrated memory 6 2 4 TX_PA1(LTE_LB) RF RF_CLK1 GNSS Power Supply USIM CCIN GPIO (not shared) I2 C SPI (GPIO) PS_HOLD 19.2MHz Interrupt Reset SDR_GNSS GNSS SAW filter 32.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 18 of 154 1.4 Circuit Concept 19 LGA Pads BATT+_RF Power Supply GPIO HWID’s BATT+ EN IN RF Part USB_VDDA _3P3 GPIO’s REFE 2_CLK_DATA Antenna LGA Pads OUT LDO 4 SDR_ TX_ MB_ L TE GPDATA STMR_SYNC SDR _RX_ L TE RF Transceiver USIM CCIN FST_SHDN STATUS (GPIO) SUSPEND_MON SIM_SWITCH (GPIO) GSM/CatM1/CatNB Baseband controller with integrated memory Power Supply GPIO (not shared) I2 C SPI (GPIO) 7 2 4 PS_HOLD 19.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 19 of 154 1.4 Circuit Concept 19 LGA Pads Power Supply BATT_RF GPIO HWIDs BATT+ EN IN RF Part LDO GPIO s REFE 2_CLK_DATA ASC0 ASC1 USB 2.0 3 USIM CCIN FAST_SHDN STATUS (GPIO) SUSPEND_MON SIM_SWITCH (GPIO) REFE 1...
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 20 of 154 2 Interface Characteristics 69 2 Interface Characteristics TX62/TX82 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 21 of 154 2.1 Application Interface 69 Table 2: Overview: Pad assignments common to TX62/TX821 2 Pad no.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 22 of 154 2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 23 of 154 2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 24 of 154 2.1 Application Interface 69 2.1.2 Signal Properties Table 3: Signal properties Function Signal name IO Signal form and level Comment Power supply BATT+BB BATT+RF I Normal voltage range: Lines of BATT+ and GND must be connected in parallel for supply purposes because higher peak currents may occur. TX82-W (LTE and GSM): VImin = 3.1 V...VImax = 4.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 25 of 154 2.1 Application Interface 69 Table 3: Signal properties Function Signal name IO Signal form and level Comment External supply voltage V180 O Normal operation: VOnorm = 1.80V ±2% IOmax = 10mA V180 has to be used for the power indication circuit. SLEEP mode Operation: VOSleep = 1.80V ±3.7% IOmax = 10mA V180 can also be used to supply level shifters at the interfaces.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 26 of 154 2.1 Application Interface 69 Table 3: Signal properties Function Signal name IO Signal form and level Comment Emergency reset EMERG_RST I RI  1k, CI  1nF (internal low pass filter) VIHmin = 1.3V VILmax = 0.5V at ~1µA This line must be driven low by an open drain or open collector driver connected to GND. ¯¯|___|¯¯ low impulse width > 800ms If unused keep lines open. Test point recommended.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 27 of 154 2.1 Application Interface 69 Table 3: Signal properties Function Signal name IO Signal form and level Comment SIM card detection CCIN I Internal pull down resistor: 100k RI  110k CCIN = High, SIM card inserted. VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V If unused keep line open. 1.8V SIM Card Interface CCVCC O VOmin = 1.5V VOtyp = 1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 28 of 154 2.1 Application Interface 69 Table 3: Signal properties Function Signal name IO Signal form and level Comment 1.8V eUICC interface CC2_VPP -- Used for single wire protocol (SWP NFC) in MFF-XS eUICC. SWP NFC is currently not supported and deactivated for the eUICC.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 29 of 154 2.1 Application Interface 69 Table 3: Signal properties Function 2 IC Signal name IO Signal form and level I2CDAT I/O No internal pull up resistors I2CCLK O VOLmax = 0.45V at Imax = -4.5mA VOHmax = 1.95V VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V Comment If unused keep lines open. Compatible with I2C Bus Specification Version 5.0. Multimaster is not supported.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 30 of 154 2.1 Application Interface 69 2.1.2.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 4 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to TX62/TX82. Table 4: Absolute maximum ratings Parameter Min Max Unit Supply voltage BATT+BB (no service) -0.5 +6.0 V Supply voltage BATT+RF (not available with TX62-W) (TX82-W; no service) -0.5 +6.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 31 of 154 2.1 Application Interface 69 2.1.3 USB Interface TX62/TX82 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only. The USB part (driver and transceiver) is supplied by means of BATT+.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 32 of 154 2.1 Application Interface 69 2.1.4 Serial Interface ASC0 TX62/TX82 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 33 of 154 2.1 Application Interface 69 The following figure shows the startup behavior of the asynchronous serial interface ASC0.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 34 of 154 2.1 Application Interface 69 2.1.5 Serial Interface ASC1 TX62/TX82 provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 35 of 154 2.1 Application Interface 69 The following figure shows the startup behavior of the asynchronous serial interface ASC1. Power supply active Start up Reset state Firmware initialization Command interface initialization Interface active ON VCORE V180 EMERG_RST TXD1 PD RXD1 PD RTS1 PD CTS1 PD PD PD Dotted lines indicate possible alternative signal states - depending on externally provided signal states.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 36 of 154 2.1 Application Interface 69 2.1.6 UICC/SIM/USIM Interface TX62/TX82 has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 1.8V SIM cards.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 37 of 154 2.1 Application Interface 69 The figure below shows a circuit to connect an external SIM card holder.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 38 of 154 2.1 Application Interface 69 2.1.6.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes (e.g., NUP4114) to the SIM interface lines as shown in the example given in Figure 14. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: ± 4kV, air discharge: ± 8kV.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 39 of 154 2.1 Application Interface 69 2.1.7 eUICC Interface As an option TX62/TX82 supports an eUICC in MFF-XS format. This MFF-XS eUICC is located under the shielding, is only connected to specific module pads, and has no physical connections with other circuits inside the module.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 40 of 154 2.1 Application Interface 69 The below Figure 16 shows a direct connection of the internal eUICC to the module’s SIM interface lines. Module Baseband controller VSIM CCIO CCRST CCCLK CCIO pull up resistor and VSIM capacitor 2.2µF Are mounted on the module CC2_VPP CC2_VCC CC2_IO eUICC CCIN CC2_RST CC2_CLK Figure 16: eUICC interface without SIM switch t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 41 of 154 2.1 Application Interface 69 2.1.8 GPIO TX82-W, TX62-W-B and TX62-W-C have 7 GPIOs (GPIO6-7,20-23,25) and TX62-W has 6 GPIOs (GPIO7,20-23,25) for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. The configuration is non-volatile and available after module restart. The IO port driver has to be opened before using and configuring GPIOs.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 42 of 154 2.1 Application Interface 69 2.1.8.1 GPIOs Available with Embedded Processing Option The embedded processing option of TX62/TX82 provides a GPIO interface with 13 configurable GPIO lines. Some GPIO lines are shared with other interfaces or functions, and are shown in the following table with their default assignments being marked green.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 43 of 154 2.1 Application Interface 69 2.1.9 I2C Interface The embedded processing option of TX62/TX82 provides an inter-integrated circuit interface. I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 44 of 154 2.1 Application Interface 69 2.1.10 SPI Interface The embedded processing option of TX62/TX82 provides an SPI interface where four GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface allowing the module to control external sensors or components. The SPI interface supports only master mode. The transmission rates are up to 6.5Mbit/s.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 45 of 154 2.1 Application Interface 69 2.1.11 Control Signals 2.1.11.1 Status LED The STATUS line can be configured to drive a status LED that indicates different operating modes of the module. For details on how to configure status signaling please refer to [1]. To take advantage of this function connect an LED to the STATUS line as shown in Figure 20. The sample circuit is not optimized for low current consumption.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 46 of 154 2.1 Application Interface 69 10k External power supply Power indication 22k 100k V180 Figure 21: Power indication circuit 2.1.11.3 Fast Shutdown The FST_SHDN line is an active low control signal and must be applied for at least 15 milliseconds. It is recommended to keep the FST_SHDN line low until the module has shut down. If unused this line can be left open because of a configured internal pull-up resistor.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 47 of 154 2.1 Application Interface 69 BATT+ ON EMERG_RST < 15ms Fast Shut Down V180 Figure 22: Fast shutdown timing Please note that the normal software controlled shutdown via AT^SMSO can also be configured as a fast shutdown, i.e., without network deregistration. For details see [1]. 2.1.11.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 48 of 154 2.1 Application Interface 69 2.1.11.5 SUSPEND Mode Indicator When all conditions for entering into SUSPEND mode are fulfilled, the SUSPEND_MON signal changes from high to low, indicating that the module has entered its SUSPEND mode. When leaving the SUSPEND mode, the URC “^SYSRESUME” is triggered, and the SUSPEND_MON signal is set to high again.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 49 of 154 2.2 RF Antenna Interface 69 2.2 RF Antenna Interface The RF interface has an impedance of 50. TX62/TX82 is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 50 of 154 2.2 RF Antenna Interface 69 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Min.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 51 of 154 2.2 RF Antenna Interface 69 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Min.2 Conditions LTE Cat NB1/2: Power @ ARP with 50Ω Load, NTNV Configuration ID: 1, UL: Modulation: BPSK; Subcarrier: 1;Subcarrier space: 3.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 52 of 154 2.2 RF Antenna Interface 69 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min.2 Typical TX62-W GSM 850/900 RF Power @ ARP with 50 Load, (ROPR = 5) Unit TX82-W GPRS, 1 TX 32.5 dBm GPRS, 2 TX 23.5 dBm EDGE, 1 TX 27.0 dBm EDGE, 2TX 27.0 dBm GSM 1800/1900 GPRS, 1 TX 29.5 dBm GPRS, 2 TX 29.5 dBm EDGE, 1 TX 26.0 dBm EDGE, 2TX 26.0 dBm GPRS, 1 TX 32.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 53 of 154 2.2 RF Antenna Interface 69 Table 10: RF Antenna interface LTE of TX62-W-B Min.1 Parameter Conditions LTE connectivity (Cat M1) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 85 LTE Cat M1: Receiver Input Sensitivity @NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=6; DL: Modulation: QPSK; NRB=4; LTE 2100 Band 1 -103 -106.5 dBm LTE 1800 Band 2 -101 -106.3 dBm LTE 1900 Band 3 -100 -105.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 54 of 154 2.2 RF Antenna Interface 69 Table 10: RF Antenna interface LTE of TX62-W-B Min.1 Parameter Conditions LTE connectivity (Cat NB1/2) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 28, 66, 71, 85 LTE Cat NB1/2: Receiver Input Sensitivity @NTNV DL: Modulation: QPSK; Subcarriers: 12; UL: Modulation: BPSK; Subcarrier spacing: 15KHz; Ntones: 1@0 LTE 2100 Band 1 -108.2 -114 dBm LTE 1800 Band 2 -108.2 -114.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 55 of 154 2.2 RF Antenna Interface 69 Table 11: RF Antenna interface LTE of TX62-W-C Min.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 56 of 154 2.2 RF Antenna Interface 69 Table 11: RF Antenna interface LTE of TX62-W-C Parameter Conditions Min.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 57 of 154 2.2 RF Antenna Interface 69 Table 11: RF Antenna interface LTE of TX62-W-C Min.1 Parameter Conditions LTE connectivity (Cat NB1/2) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 28, 31, 66, 72, 85 LTE Cat NB1/2: Receiver Input Sensitivity @NTNV DL: Modulation: QPSK; Subcarriers: 12; UL: Modulation: BPSK; Subcarrier spacing: 15KHz; Ntones: 1@0 LTE 2100 Band 1 -108.2 dBm LTE 1800 Band 2 -108.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 58 of 154 2.2 RF Antenna Interface 69 2.2.2 Antenna Installation The antennas is connected by soldering the antenna pads (RF_OUT, ANT_GNSS) and its neighboring ground pads directly to the application’s PCB. Marking GND GND GND GND RF_OUT ANT_GNSS Figure 24: Antenna pads (top view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 59 of 154 2.2 RF Antenna Interface 69 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 60 of 154 2.2 RF Antenna Interface 69 Micro-Stripline This section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 26: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 1 t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 61 of 154 2.2 RF Antenna Interface 69 Application board Ground line Antenna line Ground line Figure 27: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 2 t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 62 of 154 2.2 RF Antenna Interface 69 • Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 28: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 1 t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 63 of 154 2.2 RF Antenna Interface 69 Application board Ground line Antenna line Ground line Figure 29: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 2 t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 64 of 154 2.2 RF Antenna Interface 69 2.2.3.2 Routing Example Interface to RF Connector Figure 30 shows the connection of the module‘s antenna pad with an application PCB‘s coaxial antenna connector. Please note that the TX62/TX82 bottom plane appears mirrored, since it is viewed from TX62/TX82 top side. By definition the top of customer's board shall mate with the bottom of the TX62/TX82 module.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 65 of 154 2.3 GNSS Interface 69 2.3 GNSS Interface 2.3.1 GNSS Receiver TX62/TX82 integrates a GNSS receiver that offers the full performance of GPS/GLONASS/BeiDou/Galileo technology. The GNSS receiver is able to continuously track all satellites in view, thus providing accurate satellite position data. The integrated GNSS receiver supports the NMEA protocol via ASC0 interface.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 66 of 154 2.3 GNSS Interface 69 2.3.3 GNSS Antenna Interface Characteristics (TBD.) Table 12: GNSS properties Parameter Conditions Horizontal accuracy 50% CEP, open sky Maximal update rate Frequency Tracking Sensitivity Acquisition Sensitivity Time-to-First-Fix (TTFF)1 Min. Typical Max. Unit 3 m 1 Hz GPS 1573.397 1575.420 1576.443 MHz GLONASS 1598.563 1602.563 1606.563 Beidou 1559.052 1561.098 1563.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 67 of 154 2.4 Sample Application 69 2.4 Sample Application Figure 32 shows a typical example of how to integrate a TX62/TX82 module with an application. Usage of the various host interfaces depends on the desired features of the application. Note that the sample application is not optimized for low current consumption.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 68 of 154 2.4 Sample Application 69 For switch on circuit see Section 3.2.1 BATT+BB EXSx2-W 150K Main antenna GND RF_OUT 22K ESD ** GND ON GND 10K ANT_GNSS GNSS antenna ESD ** GND RF * EMERG_RST 100K BATT+RF RF * BATT+BB V180 Power indication 33pF 150µF, Low ESR! 0K 22K 100K 47µF, Low ESR! 33pF Power supply Low ESR!, e.g., X7 R MLCC VCORE Blocking**** Blocking**** Blocking**** 5 4 8 3 GPIO20...
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 69 of 154 2.4 Sample Application 69 2.4.1 Sample Level Conversion Circuit Depending on the micro controller used by an external application TX62/TX82‘s digital input and output lines (i.e., ASC0, ASC1) may require level conversion. The following Figure 33 shows a sample circuit with recommended level shifters for an external application‘s micro controller (with VLOGIC between 3.0V...3.6V).
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 70 of 154 3 Operating Characteristics 110 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 13: Overview of operating modes Mode Function Normal operation Data transfer GSM/(E)GPRS/LTE M1 NB1/2 data transfer in progress.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 71 of 154 3.2 Power Up/Power Down Scenarios 110 3.2 Power Up/Power Down Scenarios Do not turn on TX62/TX82 while it is beyond the safety limits of voltage stated in Section 2.1.2.1. TX62/TX82 immediately switches off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 72 of 154 3.2 Power Up/Power Down Scenarios 110 ~52ms ~51ms >1ms BATT+ >30ms ON Only rising edge starts up the module VCORE V180 EMERG_RST Figure 35: ON startup timing t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 73 of 154 3.2 Power Up/Power Down Scenarios 110 3.2.1.2 Automatic Power On When an automatic power on circuit is required for the module application, the ON pulse must be generated after BATT+ is applied. To achieve this, it is recommend to add a monoflop circuit. With the initial switch on after BATT+ was applied, the pulse of the ON signal must be longer than 1ms.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 74 of 154 3.2 Power Up/Power Down Scenarios 110 3.2.2 Restart TX62/TX82 After startup TX62/TX82 can be re-started as described in the following sections: • Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.2.2.1). • Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.2.2.2) 3.2.2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 75 of 154 3.2 Power Up/Power Down Scenarios 110 3.2.3 Signal States after Startup Table 14 describes various states interface signals pass through after startup until the system is active. Signals are in an initial state while the module is initializing. Once the startup initialization has completed, i.e. when the software is running, all signals are in a defined state, the module is ready to receive and transmit data.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 76 of 154 3.2 Power Up/Power Down Scenarios 110 3.2.4 Turn off TX62/TX82 To switch the module off the following procedures may be used: • Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1. • Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN line to low. See Section 2.1.11.3.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 77 of 154 3.2 Power Up/Power Down Scenarios 110 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs: • The TX62/TX82 board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.2.5.1) • Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT command, i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 78 of 154 3.2 Power Up/Power Down Scenarios 110 3.2.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 3. When the average supply voltage measured by TX62/TX82 approaches the undervoltage shutdown threshold (i.e., 0.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 79 of 154 3.3 Power Saving 110 3.3 Power Saving TX62/TX82 can control its power consumption through specific features as summarized in Table 16, and further detailed in the following sections. The mentioned operating modes are detailed in Section 3.1. For typical power supply ratings during power saving please refer to Section 3.4.1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 80 of 154 3.3 Power Saving 110 3.3.1 Low Power Modes There are two specific low power modes available that can be configured to allow TX62/TX82 to save power - SLEEP mode (Section 3.3.1.1) and SUSPEND mode (Section 3.3.1.2). Figure 39 illustrates how the module transits between its operating modes including SLEEP and SUSPEND modes.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 81 of 154 3.3 Power Saving 110 3.3.1.1 SLEEP Mode SLEEP mode is a module’s low power mode when no call is in progress and there is no active communication on any serial interface (ASC0, ASC1). During SLEEP mode, the serial interfaces are shut down except for RTS0 that may be used to wake up TX62/TX82 from SLEEP mode (see below).
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 82 of 154 3.3 Power Saving 110 3.3.1.2 SUSPEND Mode In contrast to SLEEP mode, SUSPEND mode is a module’s low power mode with almost all components switched off - except for the internal RTC and interrupt triggered wake up mechanisms. The module stays registered to the network, and the RRC connection is released. The module is in its lowest power consumption state.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 83 of 154 3.3 Power Saving 110 From SUSPEND mode the module can only be woken up by the ON or EMERG_RST signals, or it may wake up and be reachable again after expiration of a negotiated 3GPP PSM periodic TAU cycle (i.e., network timer) that may include DRX as well as eDRX paging cycles for an inactivity period (see Section 3.3.3.3 for details).
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 84 of 154 3.3 Power Saving 110 3.3.2 Power Saving while Attached to GSM Networks (TX82-W only) Power saving while attached to GSM networks is based on standard DRX values defined for the network (see Section 3.3.2.1). Apart from network based power saving it is possible to use the AT command AT^SCFG="Radio/OutputPowerReduction" for the module in (E)GPRS multislot scenarios to reduce its output power according to 3GPP 45.005.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 85 of 154 3.3 Power Saving 110 3.3.3 Power Saving while Attached to LTE M1 NB1/2 Networks This section describes the power saving possibilities in LTE Cat M1 and LTE Cat NB1/2 networks through DRX (see Section 3.3.3.1) values, as well as configurable eDRX (see Section 3.3.3.2), and 3GPP PSM (see Section 3.3.3.3) timers. 3.3.3.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 86 of 154 3.3 Power Saving 110 3.3.3.2 eDRX (Extended DRX Configuration) TX62/TX82 and the network may negotiate the use of eDRX (extended DRX) to reduce power consumption, while being available for mobile terminating data and/or network originated procedures within a certain delay dependent on the network negotiated eDRX cycle value (see also Section 3.3.1.2).
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 87 of 154 3.3 Power Saving 110 3.3.3.3 3GPP PSM Configuration TX62/TX82 can be configured to use 3GPP PSM to reduce power consumption. PSM is similar to power off, while TX62/TX82 remains registered with the network. There is no need to reattach or re-establish PDN connections. TX62/TX82 in PSM is not immediately reachable for mobile terminating services (see also SUSPEND mode in Section 3.3.1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 88 of 154 3.4 Power Supply 110 3.4 Power Supply TX62/TX82 needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+BB with a line mainly for the baseband power supply. • BATT+RF with a line for the GSM/LTE power amplifier supply. Please note that this line does not have to be connected with TX62-W.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 89 of 154 3.4 Power Supply 110 Table 18: General current consumption ratings (TX62/TX82) Description Conditions Typical rating IBATT+1 OFF state State after initially connecting VBATT+ and/or supply cur- after a fast shutdown triggered via FST_SHDN (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 90 of 154 3.4 Power Supply 110 Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 91 of 154 3.4 Power Supply 110 Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 92 of 154 3.4 Power Supply 110 Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 93 of 154 3.4 Power Supply 110 Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description IBATT+1 (i.e., only BATT+BB ) Conditions Peak Current @ RRC connected Active Transmission3 VBATT = 2.55V (TX62W) VBATT = 2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 94 of 154 3.4 Power Supply 110 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+1 (i.e., only BATT+BB ) Conditions Typical rating TX62-W TX62-WB TX62-WC TX82W 3.8 4.5 4.5 4.5 µA 0.77 0.79 0.88 mA 1.08 1.09 1.17 mA DRX=256 0.85 0.86 0.94 mA DRX=128 1.23 1.26 1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 95 of 154 3.4 Power Supply 110 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 96 of 154 3.4 Power Supply 110 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 97 of 154 3.4 Power Supply 110 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 98 of 154 3.4 Power Supply 110 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 99 of 154 3.4 Power Supply 110 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+1 (i.e., only BATT+BB ) Conditions Average LTE NB1/2 supply current RRC connected Active Transmission UL RMC, multitone mode (12 subcarrier),15kHz spacing3 Peak Current @ RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing3 VBATT=3.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 100 of 154 3.4 Power Supply 110 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+1 (i.e., only BATT+BB ) Conditions Peak Current @ RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing3 VBATT=3.8V Peak Current @ RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing3 VBATT =2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 101 of 154 3.4 Power Supply 110 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 102 of 154 3.4 Power Supply 110 Table 21: Current consumption ratings General and GSM (TX82-W only) Description IBATT+1 (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 103 of 154 3.4 Power Supply 110 Table 21: Current consumption ratings General and GSM (TX82-W only) Description IBATT+1 (i.e., sum of BATT+BB and BATT+RF) Conditions Average GSM EDGE Data transfer GSM900; supply current PCL=5; 2Tx/3Rx (GNSS off) mA ROPR=4 (no reduction) 256 mA ROPR=8 182 (max. reduction) mA ROPR=4 (no reduction) 183 mA ROPR=8 248 (max. reduction) mA ROPR=4 (no reduction) 310 mA ROPR=8 147 (max.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 104 of 154 3.4 Power Supply 110 Table 21: Current consumption ratings General and GSM (TX82-W only) Description IBATT+1 (i.e., sum of BATT+BB and BATT+RF) Peak current during GSM transmit burst @ 3.0V Conditions Typical rating Unit GPRS Data transfer GSM850; PCL=5; 2Tx/3Rx 1.76 A GPRS Data transfer GSM900; PCL=5; 2Tx/3Rx 1.76 A GPRS Data transfer GSM1800; PCL=0; 2Tx/3Rx 1.23 A GPRS Data transfer GSM1900; PCL=0; 2Tx/3Rx 1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 105 of 154 3.4 Power Supply 110 3.4.2 Minimizing Power Losses For TX82-W only: When designing the power supply for your application (and with GSM enabled) please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.1V on the TX82-W board, not even in a GSM transmit burst where current consumption can rise (for peak values see the power supply ratings listed in Section 3.4.1).
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 106 of 154 3.5 Operating Temperatures 110 3.4.4 Monitoring Power Supply by AT Command To monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND. The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 107 of 154 3.6 Electrostatic Discharge 110 3.6 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a TX62/TX82 module.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 108 of 154 3.7 Blocking against RF on Interface Lines 110 3.7 Blocking against RF on Interface Lines To reduce EMI issues there are serial resistors, or capacitors to GND, implemented on the module for the ignition, emergency restart, and SIM interface lines (cp. Section 2.4). However, all other signal lines have no EMI measures on the module and there are no blocking measures at the module’s interface to an external application.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 109 of 154 3.7 Blocking against RF on Interface Lines 110 The following table lists for each signal line at the module‘s SMT application interface the EMI measures that may be implemented. Table 25: EMI measures on the application interface Signal name EMI measures A B C CCIN Remark D E x CCRST x The external capacitor should be not higher than 1nF.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 110 of 154 3.8 Reliability Characteristics 110 3.8 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 111 of 154 4 Mechanical Dimensions, Mounting and Packaging 131 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of TX62-W Figure 52 shows the top and bottom view of TX62-W and provides an overview of the board's mechanical dimensions. For further details see Figure 53. Figure 54 shows the area at the module’s bottom side where possible markings might be printed.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 112 of 154 4.1 Mechanical Dimensions of TX62-W 131 Figure 53: Dimensions of TX62-W (all dimensions in mm) Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.42mm clearance from specified marks to LGA pads Figure 54: Dimensions of area for possible markings TX62-W (bottom view) t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 113 of 154 4.2 Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C 131 4.2 Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C Figure 55 shows the top and bottom view of TX82-W, and TX62-W-B, and provides an overview of the board's mechanical dimensions. For further details see Figure 56. Figure 57 shows the area at the module’s bottom side where possible markings might be printed. Note: With TX62-W-C the module height is TBD.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 114 of 154 4.2 Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C 131 Figure 56: Dimensions of TX82-W, TX62-W-B and TX62-W-C (all dimensions in mm) Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 115 of 154 4.3 Mounting TX62/TX82 onto the Application Platform 131 4.3 Mounting TX62/TX82 onto the Application Platform This section describes how to mount TX62/TX82 onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [5].
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 116 of 154 4.3 Mounting TX62/TX82 onto the Application Platform 131 . Figure 59: Land pattern TX82-W, TX62-W-B and TX62-W-C (top view) The stencil design illustrated in Figure 60 and Figure 61 is recommended by Thales as a result of extensive tests with Thales Daisy Chain modules.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 117 of 154 4.3 Mounting TX62/TX82 onto the Application Platform 131 Figure 60: Recommended design for 110µm thick stencil for TX62-W (top view) Figure 61: Recommended design for 110µm thick stencil for TX82-W, TX62-W-B and TX62-W-C (top view) 4.3.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT process.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 118 of 154 4.3 Mounting TX62/TX82 onto the Application Platform 131 It is recommended to characterize land patterns before an actual PCB production, taking individual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 4.3.1.1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 119 of 154 4.3 Mounting TX62/TX82 onto the Application Platform 131 4.3.3 Soldering Conditions and Temperature 4.3.3.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 120 of 154 4.3 Mounting TX62/TX82 onto the Application Platform 131 4.3.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module: • A maximum module temperature of 240°C. This specifies the temperature as measured at the module’s top side. • A maximum duration of 15 seconds at this temperature.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 121 of 154 4.3 Mounting TX62/TX82 onto the Application Platform 131 4.3.4 Durability and Mechanical Handling 4.3.4.1 Storage Conditions TX62/TX82 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 122 of 154 4.3 Mounting TX62/TX82 onto the Application Platform 131 4.3.4.2 Processing Life TX62/TX82 must be soldered to an application within 72 hours after opening the moisture barrier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%. 4.3.4.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 123 of 154 4.4 Packaging 131 4.4 Packaging 4.4.1 Tape and Reel The single-feed tape carrier for TX62/TX82 is illustrated in Figure 63. The figure also shows the proper part orientation. The tape width is 24mm and the TX62/TX82 modules are placed on the tape with a 22mm pitch. The reels are 330mm in diameter with a core diameter of 99.50mm. Each reel contains 500 modules. 4.4.1.1 Orientation A0: 15.80mm F: 11.50mm T: 0.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 124 of 154 4.4 Packaging 131 Figure 64: Reel direction (TX62-W only) 4.4.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 65: Barcode label on tape reel t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 125 of 154 4.4 Packaging 131 Figure 66: Barcode label on tape reel - layout Variables on the label are explained in Table 29. t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 126 of 154 4.4 Packaging 131 4.4.2 Shipping Materials TX62/TX82 is distributed in tape and reel carriers. The tape and reel carriers used to distribute TX62/TX82 are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card • Transportation box 4.4.2.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 127 of 154 4.4 Packaging 131 Figure 68: Moisture Sensitivity Label t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 128 of 154 4.4 Packaging 131 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 129 of 154 4.4 Packaging 131 4.4.2.2 Transportation Box Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 500 modules each. 1 2 3 4 5 8 6 9 7 10 11 12 14 13 Figure 70: Sample of VP box label Table 29: VP Box label information No.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 130 of 154 4.4 Packaging 131 4.4.3 Trays (TBD) If small module quantities are required, e.g., for test and evaluation purposes, TX62/TX82 may be distributed in trays (for dimensions see Figure 74). The small quantity trays are an alternative to the single-feed tape carriers normally used. However, the trays are not designed for machine processing.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 131 of 154 4.4 Packaging 131 T.B.D. Figure 74: Tray dimensions (TBD.) t TX62-W_TX62-W-x_TX82-W_HID_v01.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 132 of 154 5 Regulatory and Type Approval Information 141 5 Regulatory and Type Approval Information 5.1 Directives and Standards TX62/TX82 is designed to comply with the directives and standards listed below.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 133 of 154 5.1 Directives and Standards 141 Table 32: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station (MS) conformance specification; GCF-CC V3.71 Global Certification Forum - Certification Criteria ETSI EN 301 511 V12.5.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 134 of 154 5.1 Directives and Standards 141 Table 34: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 135 of 154 5.1 Directives and Standards 141 5.1.1 IEC 62368-1 Classification With respect to the safety requirements for audio/video, information and communication technology equipment defined by the hazard based product safety standard for ICT and AV equipment - i.e., IEC-62368-1 (EN 62368-1, UL 62368-1) - Cinterion® modules are classified as shown below: Standalone operation of the modules is not possible.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 136 of 154 5.1 Directives and Standards 141 Table 36: IEC 62368-1 Classification Source of Energy Class Limits Hazardous Substances, Chemical reaction -- Under regular conditions, the Cinterion® module does not contain any chemically reactive substances, and no chemical energy source, especially no battery. Module is compliant with RoHS and REACH (see above). In very rare cases however - under abnormal conditions (i.e.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 137 of 154 5.2 SAR requirements specific to portable mobiles 141 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a module must be in accordance with the guidelines for human exposure to radio frequency energy.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 138 of 154 5.3 Reference Equipment for Type Approval 141 5.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 139 of 154 5.4 Compliance with FCC and ISED Rules and Regulations 141 5.4 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 140 of 154 5.4 Compliance with FCC and ISED Rules and Regulations 141 Table 38: Antenna gain limits for FCC and ISED for TX62-W Maximum gain in operating band FCC limit ISED limit All limits Unit LTE Band 2 11.01 11.01 11.01 dBi LTE Band 4 8.00 8.00 8.00 dBi LTE Band 5 12.41 9.10 9.10 dBi LTE Band 12 11.70 8.61 8.61 dBi LTE Band 13 12.16 8.93 8.93 dBi LTE Band 25 11.01 11.01 11.01 dBi LTE Band 26 12.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 141 of 154 5.4 Compliance with FCC and ISED Rules and Regulations 141 sion reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 142 of 154 6 Document Information 149 6 Document Information 6.1 Revision History Preceding document: “Cinterion® TX62-W(-B)/TX82-W Hardware Interface Description" v00.026b New document: "Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description" v01.000 Chapter What is new --- Added new Variant: TX62-W-C. 2.1.2, 3.2.1.1 Revised high level pulse width for ON signal (1ms --> 30ms). 2.4 Revised Figure 32. 3.2.1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 143 of 154 6.1 Revision History 149 Preceding document: “Cinterion® TX62-W(-B)/TX82-W Hardware Interface Description" v00.022a New document: "Cinterion® TX62-W(-B)/TX82-W Hardware Interface Description" v00.026 Chapter What is new 1.1 Revised version of TX62-W-B 2.1.8 Revised Figure 17 5.1 Added REACH directive to Table 30 5.1 Change Safety Standard to IEC 62368-1 in Table 32 5.1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 144 of 154 6.1 Revision History 149 Chapter What is new 2.1.2 Revised Signal Properties regarding GPIO in Table 3 2.1.8 Added new chapter for GPIO 2.4 Revised Sample Application regarding GPIO and USB in Figure 32 3.2.3 Revised Table 14 regarding GPIO, corrected some signal states 3.7 Revised Table 25 regarding GPIO, removed USB signals 6.1 Revised changes for document version 00.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 145 of 154 6.2 Related Documents 149 Preceding document: "Cinterion® TXx2-W Hardware Interface Description" v00.038 New document: "Cinterion® TXx2-W Hardware Interface Description" v00.200 Chapter What is new - New document layout Throughout document Removed LTE Bd14. Renamed LTE Bd4 (AWS --> AWS-1), LTE Bd66 (1700MHz --> AWS-3). Throughout document Added support for optional eUICC interface. 1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 146 of 154 6.3 Terms and Abbreviations 149 6.3 Terms and Abbreviations Abbreviation Description ADC Analog-to-digital converter AGC Automatic Gain Control ANSI American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0/ASC1 Asynchronous Controller.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 147 of 154 6.3 Terms and Abbreviations 149 Abbreviation Description EMI Electromagnetic Interference ERP Effective Radiated Power ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 148 of 154 6.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 149 of 154 6.4 Safety Precaution Notes 149 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating TX62/TX82.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 150 of 154 7 Appendix 153 7 Appendix 7.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 151 of 154 7.1 List of Parts and Accessories 153 Table 40: List of parts and accessories Description Supplier Ordering information TX82-W Thales Standard module Thales IMEI: Packaging unit (ordering) number: L30960-N6600-A100 Module label number1: S30960-S6600-A100-1.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 152 of 154 7.1 List of Parts and Accessories 153 Table 41: Molex sales contacts (subject to change) Molex For further information please click: http://www.molex.com Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com American Headquarters Lisle, Illinois 60532 U.S.A.
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Cinterion® TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 153 of 154 7.2 Module Label Information 153 7.2 Module Label Information The label engraved on the top of TX62/TX82 comprises the following information1. 2 1 3 Made in Text S 4 Model: TX62-W 5 S30960-S6300-A100-1 not for sale 6 358009 09 000216 2 L7 8 7 Figure 76: TX62/TX82 label Table 42: TX62/TX82 label information No. 1 Cinterion logo 2 Manufacturing country (e.g.
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THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany © Thales 2021. All rights reserved. Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain countries.