Product Info
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
TX62-W(-B/-C)/TX82-W Hardware Interface Description
1.2 Key Features at a Glance
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t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-05-19
Confidential / Preliminary
Page 12 of 154
GSM/GPRS/EGPRS features
Data transfer GPRS (TX82-W only):
• Multislot Class 10
• Full PBCCH support
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS (TX82-W only):
• Multislot Class 10
• EDGE E2 power class for 8 PSK
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
• SRB loopback and test mode B
• 8-bit, 11-bit RACH
• PBCCH support
• 1 phase/2 phase access procedures
• Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
SMS Point-to-point MT and MO
Text and PDU mode
Storage: SIM card plus SMS locations in mobile equipment
GNSS Features
Modes
(see Section 2.3)
Standalone GNSS (GPS, GLONASS, BeiDou, Galileo)
Protocol NMEA (for GNSS related sentences)
General Automatic power saving modes
Software
AT commands Hayes 3GPP TS 27.007, TS 27.005, Thales
AT commands for RIL compatibility
Embedded processing
platform (optional)
Embedded processing option with API.
Memory space available for embedded applications is 512KB for applica-
tion code, 512KB min for File System and 768KB min for RAM. Please take
into account that the application code is copied into RAM. For more details,
please consult software documentation.
SIM Application Toolkit SAT Release 99
Firmware update Firmware update from external application over ASC0 and ASC1 interface.
Interfaces
Module interface Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reli-
ability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This
application note comprises chapters on mounting and application layout
issues as well as on additional SMT application development equipment.
USB
(see Section 2.1.3)
USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant
Feature Implementation