Product Info
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
TX62-W(-B/-C)/TX82-W Hardware Interface Description
6.1 Revision History
148
t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-05-19
Confidential / Preliminary
Page 143 of 154
Preceding document: “Cinterion
®
TX62-W/TX82-W Hardware Interface Description" v00.200a
New document: "Cinterion
®
TX62-W Hardware Interface Description" v00.002
Preceding document: "Cinterion
®
TX62-W/TX82-W Hardware Interface Description" v00.200
New document: "Cinterion
®
TX62-W/TX82-W Hardware Interface Description" v00.200a
Preceding document: "Cinterion
®
TX62-W/TX82-W Hardware Interface Description" v00.038
New document: "Cinterion
®
TX62-W/TX82-W Hardware Interface Description" v00.200
Chapter What is new
Throughout
document
Removed product TX82-W, thus the document version number restarted to 00.002
1.2, 2.1.2,
3.4.1
Changed minimum BATT+
BB
from 2.5V to 2.55V in Table 3 and Table 17
1.2, 4.1 Changed hight of the module in Feature at a Glance and in Figure 51 and Figure 52
2.1.2 Revised ON signal description in Table 3
2.1.6 Added in Figure 13 hint where to place the capacitors
2.1.6.1 Added hint where to place the capacitors
2.1.7 Revised Figure 15 added reference to chapter 2.1.6.1
2.2.1 Updated Table 9
2.2.3 Revised Figure 26, Figure 27, Figure 28, Figure 29 and Figure 30 according to the foot-
print of TX62-W
3.4.3 Revised chapter and Figure 48 regarding GND reference point
3.7 Added placement of capacitors in Table 25 for SIM interface signals
4.1 Revised Figure 53
4.3.1.1 Changed Stencil thickness to 110µm and Stencil pattern in Figure 59
4.4.1.1 Revised Figure 62 and Figure 63
Chapter What is new
1.2 Removed extended voltage range and changed eUICC size MFF2 to MFF-XS
1.3 Revised Figure 1 regarding eUICC size
1.4 Removed in Figure 2 signal ADC2
2.1.2 Removed extended voltage range in Table 3
2.4 Removed in Figure 32 wrong PAD numbers
3.4.1 Removed extended voltage range in Table 17
4.2 Revised Figure 54
Chapter What is new
- New document layout
Throughout
document
Removed LTE Bd14.
Renamed LTE Bd4 (AWS --> AWS-1), LTE Bd66 (1700MHz --> AWS-3).