Product Info

Cinterion
®
TX62-W(-B/-C)/TX82-W Hardware Interface Description
2.4 Sample Application
69
t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-05-19
Confidential / Preliminary
Page 68 of 154
Figure 32: Schematic diagram of TX62/TX82 sample application
RF* = Optional 47pF against self-interference. See also Section 3.7 for measures against RF interference
ESD** = ESD protection for RF antenna interface. For more details see Section 3.6.1
Enhanced ESD*** = Enhanced ESD protection for SIM interface. For more details see Section 2.1.6.1
Blocking**** = For more details see Section 3.7
VSIM
CCIO
CCCLK
CCIN
CCRST
SIM
V180
220nF
1nF
GND
GND
GND
RF_OUT
BATT+RF
Power supply
Main antenna
TXx2-W
All SIM components should be
close to card holder.
Keep SIM wires low capacitive.
10pF*****
10pF*****
150µF ,
Low ESR!
33pF
ON
22k
VCORE
V180
ASC1
Blocking****
ASC0
Blocking****
8
GND
GND
ANT_GNSS
GNSS antenna
BATT+BB
47µF,
Low ESR!
33pF
4
BATT+BB
100k
Power indication
EMERG_RST
100K
22K
150K
FST_SHDWN
STATUS
Blocki ng ****
LED
***** Add optional 10pF for SIM protection
against RF (internal Antenna)
ESD**
ESD**
RF*
RF*
RF*
RF*
Low ESR!, e.g., X7R MLCC
Enhanced ESD ***
eUICC
CC2_VPP
CC2_VCC
CC2_IO
CC2_RST
CC2_CLK
(optional)
SUSPEND_MON
GPIO6,7,20-23,25
3
USB
BEAD*: It is recommended toadd the
BEAD as shown to theBATT+BB
line. The purpose ofthis is to mitigate
noise frombaseband power supply.
No te 1: BL M15PD121SN1D
MURATA Ind Chip Bead(120Ohm
25% 100MHz Ferrite 1.3A) is recom-
mended in thiscase. For details
please visitwww.murata.com.
Note 2: The Bead should beplaced
as close as possible tothe module.
BEAD*