Cinterion® TX62/TX82 Hardware Interface Description Version: DocId: 01.200d TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 2 of 170 2 Document Name: Cinterion® TX62-W/TX82-W Hardware Interface Description Version: 01.200d Date: 2022-09-08 DocId: TX62-W_TX62-W-x_TX82-W-x_HID_v01.200d Status Public / Preliminary GENERAL NOTE THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH (“THALES”) PRODUCTS. THALES RESERVES THE RIGHT TO MAKE CHANGES TO THE PRODUCTS DESCRIBED HEREIN.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 3 of 170 Contents 170 Contents 1 Introduction ............................................................................................................... 10 1.1 Product Variants .............................................................................................. 10 1.2 Key Features at a Glance ................................................................................ 11 1.3 TX62/TX82 System Overview.........................
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 4 of 170 Contents 170 3.3 3.4 3.5 3.6 3.7 3.8 4 3.2.1.1 Switch on TX62/TX82 Using ON Signal .............................. 75 3.2.1.2 Automatic Power On ........................................................... 78 3.2.2 Restart TX62/TX82 ............................................................................. 79 3.2.2.1 Restart TX62/TX82 via AT+CFUN Command ..................... 79 3.2.2.2 Restart TX62/TX82 Using EMERG_RST ...........
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 5 of 170 Contents 170 4.4 4.3.4.1 Storage Conditions............................................................ 132 4.3.4.2 Processing Life.................................................................. 133 4.3.4.3 Baking ............................................................................... 133 4.3.4.4 Electrostatic Discharge ..................................................... 133 Packaging .....................................
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 6 of 170 Tables 170 Tables Table 1: Differences between product variants............................................................ 10 Table 2: Overview: Pad assignments TX82-W, TX82-W-B, TX62-W-B and TX62-W-C additional pads 22 Table 3: Overview: Pad assignments common to TX62/TX82 .................................... 23 Table 4: Signal properties ............................................................................................
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 7 of 170 Tables 170 Table 47: Table 48: Table 49: Table 50: t List of parts and accessories........................................................................ Molex sales contacts (subject to change) .................................................... TX62/TX82 label information........................................................................ Date code table ........................................................................
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 8 of 170 Figures 170 Figures Figure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Figure 39:
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 9 of 170 Figures 170 Figure 49: eDRX/PSM based paging and power saving in LTE Cat M1 or Cat NB1/2 networks 97 Figure 50: Power supply limits during transmit burst..................................................... 115 Figure 51: Position of reference points BATT+ and GND ............................................. 115 Figure 52: ESD protection for RF antenna interface .....................................................
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 10 of 170 1 Introduction 21 1 Introduction This document1 describes the hardware of the Cinterion® TX62/TX82 module variants optimized for global coverage as they support a comprehensive set of bands required for global deployment. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. 1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 11 of 170 1.2 Key Features at a Glance 21 1.2 Key Features at a Glance Feature Implementation General Frequency bands (see Section 2.2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 12 of 170 1.2 Key Features at a Glance 21 Feature Implementation Power supply (see Section 2.1.2 and Section 3.4) TX82-W: - LTE and GSM: 3.1V to 4.6V - LTE with GSM deactivated: 2.8V to 4.6V TX82-W-B: - LTE and GSM: 3.1V to 4.5V - LTE with GSM deactivated: 2.9V to 4.5V TX62-W: - LTE: 2.55V to 4.8V TX62-W-B: - LTE: 2.5V to 4.5V TX62-W-C: - LTE: 3.2V to 4.2V Operating temperature (board temperature) (see Section 3.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 13 of 170 1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 14 of 170 1.2 Key Features at a Glance 21 Feature Implementation 2 serial interfaces (see Section 2.1.4 and Section 2.1.5) ASC0: • 8-wire modem interface with status and control lines, unbalanced, asynchronous • Adjustable baud rates: 300bps to 921,600bps • Supports RTS0/CTS0 hardware flow control (as configuration option).
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 15 of 170 1.2 Key Features at a Glance 21 Feature Implementation Special features Approval (see Section 5) RED, CE, FCC, ISED, UL, RoHS, and REACH compliant GCF, PTCRB Phonebook SIM and phone ® Cinterion IoT Suite services (Optionally) supports an IoT Suite client based on the LWM2M protocol.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 16 of 170 1.3 TX62/TX82 System Overview 21 1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 17 of 170 1.4 Circuit Concept 21 1.4 Circuit Concept Figure 2, Figure 3, Figure 4, Figure 5 and Figure 6 show block diagrams for the TX62/TX82 module variants, and illustrate the major functional components: LGA Pads Antenna LGA Pads BATT+_RF Power Supply GPIO HWID’s BATT+ EN IN RF Part USB_VDDA _3P3 GPIO’s REFE 2_CLK_DATA 2 GSMPA +ASM SDR_ TX_ MB_ GSM SDR_ ASM _AN T 8 4 3 Serial (ASC0) Serial (ASC1/GPIO) USB 2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 18 of 170 1.4 Circuit Concept 21 LGA Pads Antenna LGA Pads BATT+_RF Power Supply GP IO HWID’s BATT+ EN IN RF Part USB_VDDA _3P3 2 GSM PA S DR _A SM_A NT Serial (ASC0) Serial (ASC1/GPIO) USB 2.0 3 USIM CCIN REFE 1...
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 19 of 170 1.4 Circuit Concept 21 LGA Pads Power Supply GPIO HWID’s BATT+ Antenna LGA Pads EN IN RF Part Coupler USB_VDDA _3P3 8 4 3 GPIO’s 3 RF Transceiver LTE PA+ASM 4 GPDATA STMR_SYNC GSM/CatM1/CatNB Baseband controller with integrated memory 6 2 4 TX_PA1(LTE_LB) RF RF_CLK1 GNSS Power Supply USIM CCIN GPIO (not shared) I2 C SPI (GPIO) PS_HOLD 19.2MHz Interrupt Reset SDR_GNSS GNSS SAW filter 32.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 20 of 170 1.4 Circuit Concept 21 LGA Pads BATT+_RF Power Supply GPIO HWID’s BATT+ EN IN RF Part USB_VDDA _3P3 GPIO’s REFE 2_CLK_DATA Antenna LGA Pads OUT LDO 4 SDR_ TX_ MB_ L TE GPDATA STMR_SYNC SDR _RX_ L TE RF Transceiver USIM CCIN FST_SHDN STATUS (GPIO) SUSPEND_MON SIM_SWITCH (GPIO) GSM/CatM1/CatNB Baseband controller with integrated memory Power Supply GPIO (not shared) I2 C SPI (GPIO) 7 2 4 PS_HOLD 19.2MHz 32.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 21 of 170 1.4 Circuit Concept 21 LGA Pads Power Supply BATT_RF GPIO HWIDs BATT+ EN IN RF Part LDO GPIO s REFE 2_CLK_DATA ASC0 ASC1 USB 2.0 3 USIM CCIN FAST_SHDN STATUS (GPIO) SUSPEND_MON SIM_SWITCH (GPIO) REFE 1...
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 22 of 170 2 Interface Characteristics 73 2 Interface Characteristics TX62/TX82 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 23 of 170 2.1 Application Interface 73 Table 3: Overview: Pad assignments common to TX62/TX821 2 Pad no.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 24 of 170 2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 25 of 170 2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 26 of 170 2.1 Application Interface 73 2.1.2 Signal Properties Table 4: Signal properties Function Signal name IO Signal form and level Comment Power supply BATT+BB BATT+RF I Normal voltage range: Lines of BATT+ and GND must be connected in parallel for supply purposes because higher peak currents may occur. TX82-W (LTE and GSM): VImin = 3.1 V...VImax = 4.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 27 of 170 2.1 Application Interface 73 Table 4: Signal properties Function Signal name IO Signal form and level Comment External supply voltage V180 O Normal operation: VOnorm = 1.80V ±2% IOmax = 10mA V180 has to be used for the power indication circuit. SLEEP mode Operation: VOSleep = 1.80V ±3.7% IOmax = 10mA V180 can also be used to supply level shifters at the interfaces.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 28 of 170 2.1 Application Interface 73 Table 4: Signal properties Function Signal name IO Signal form and level Comment Emergency reset EMERG_RST I RI ≈ 1kΩ, CI ≈ 1nF (internal low pass filter) VIHmin = 1.3V VILmax = 0.5V at ~1µA This line must be driven low by an open drain or open collector driver connected to GND. ¯¯|___|¯¯ low impulse width > 800ms If unused keep lines open. Test point recommended.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 29 of 170 2.1 Application Interface 73 Table 4: Signal properties Function Signal name IO Signal form and level Comment SIM card detection CCIN I Internal pull down resistor: 100k RI ≈ 110kΩ CCIN = High, SIM card inserted. VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V If unused keep line open. 1.8V SIM Card Interface CCVCC O VOmin = 1.5V VOtyp = 1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 30 of 170 2.1 Application Interface 73 Table 4: Signal properties Function Signal name IO Signal form and level Comment 1.8V eUICC interface CC2_VPP -- Used for single wire protocol (SWP NFC) in MFF-XS eUICC. SWP NFC is currently not supported and deactivated for the eUICC.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 31 of 170 2.1 Application Interface 73 Table 4: Signal properties Function 2 IC Signal name IO Signal form and level I2CDAT I/O No internal pull up resistors I2CCLK O VOLmax = 0.45V at Imax = -4.5mA VOHmax = 1.95V VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V Comment If unused keep lines open. Compatible with I2C Bus Specification Version 5.0. Multimaster is not supported.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 32 of 170 2.1 Application Interface 73 2.1.2.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 5 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to TX62/TX82. Table 5: Absolute maximum ratings Parameter Min Max Unit Supply voltage BATT+BB (no service) -0.5 +6.0 V Supply voltage BATT+RF (not available with TX62-W) (TX82-W; no service) -0.5 +6.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 33 of 170 2.1 Application Interface 73 2.1.3 USB Interface TX62/TX82 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only. The USB part (driver and transceiver) is supplied by means of BATT+.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 34 of 170 2.1 Application Interface 73 2.1.4 Serial Interface ASC0 TX62/TX82 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 4.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 35 of 170 2.1 Application Interface 73 The following figure shows the startup behavior of the asynchronous serial interface ASC0.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 36 of 170 2.1 Application Interface 73 2.1.5 Serial Interface ASC1 TX62/TX82 provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 4.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 37 of 170 2.1 Application Interface 73 The following figure shows the startup behavior of the asynchronous serial interface ASC1. Power supply active Start up Reset state Firmware initialization Command interface initialization Interface active ON VCORE V180 EMERG_RST TXD1 PD RXD1 PD RTS1 PD CTS1 PD PD PD Dotted lines indicate possible alternative signal states - depending on externally provided signal states.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 38 of 170 2.1 Application Interface 73 2.1.6 UICC/SIM/USIM Interface TX62/TX82 has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 1.8V SIM cards.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 39 of 170 2.1 Application Interface 73 The figure below shows a circuit to connect an external SIM card holder.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 40 of 170 2.1 Application Interface 73 2.1.6.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes (e.g., NUP4114) to the SIM interface lines as shown in the example given in Figure 15. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: ± 4kV, air discharge: ± 8kV.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 41 of 170 2.1 Application Interface 73 2.1.7 eUICC Interface As an option TX62/TX82 supports an eUICC in MFF-XS format. This MFF-XS eUICC is located under the shielding, is only connected to specific module pads, and has no physical connections with other circuits inside the module.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 42 of 170 2.1 Application Interface 73 If using a SIM switch to change between usage of an external SIM and an eUICC as shown in Figure 16, the module needs to be prepared for this dual mode by AT command. By default, dual mode is disabled, and usage of the first SIM slot, i.e.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 43 of 170 2.1 Application Interface 73 In case the module is mounted onto the LGA DevKit, a direct connection to the eUICC can be achieved by bridging the following pads on the backside of the LGA DevKit: PAD 249 to 17, PAD 248 to 19, PAD 247 to 21, PAD 246 to 20, as also shown in Figure 18. Figure 18: Interface bridging t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 44 of 170 2.1 Application Interface 73 2.1.8 GPIO TX82-W, TX82-W-B, TX62-W-B and TX62-W-C have 7 GPIOs (GPIO6-7,20-23,25) and TX62W has 6 GPIOs (GPIO7,20-23,25) for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. The configuration is non-volatile and available after module restart. The IO port driver has to be opened before using and configuring GPIOs.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 45 of 170 2.1 Application Interface 73 2.1.8.1 GPIOs Available with Embedded Processing Option The embedded processing option of TX62/TX82 provides a GPIO interface with 13 configurable GPIO lines. Some GPIO lines are shared with other interfaces or functions, and are shown in the following table with their default assignments being marked green.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 46 of 170 2.1 Application Interface 73 2.1.9 I2C Interface The embedded processing option of TX62/TX82 provides an inter-integrated circuit interface. I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 47 of 170 2.1 Application Interface 73 2.1.10 SPI Interface The embedded processing option of TX62/TX82 provides an SPI interface where four GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface allowing the module to control external sensors or components. The SPI interface supports only master mode. The transmission rates are up to 6.5Mbit/s.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 48 of 170 2.1 Application Interface 73 2.1.11 Control Signals 2.1.11.1 Status LED The STATUS line can be configured to drive a status LED that indicates different operating modes of the module. For details on how to configure status signaling please refer to [1]. To take advantage of this function connect an LED to the STATUS line as shown in Figure 22. The sample circuit is not optimized for low current consumption.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 49 of 170 2.1 Application Interface 73 10k External power supply Power indication 22k 100k V180 Figure 23: Power indication circuit 2.1.11.3 Fast Shutdown The FST_SHDN line triggers the module’s fast shutdown procedure. The fast shutdown procedure ensures data integrity during shutdown, but will no longer deregister gracefully from the network thus saving the time normally required for network deregistration.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 50 of 170 2.1 Application Interface 73 T0 T1 T2 T3 For timing values see Table 9. BATT+BB High V180 High Low VCORE High Low FST_SHDN High Low Figure 24: Fast shutdown timing Table 9: Fast shutdown timing values Timing Description Typical value Unit T0 – T1 FST_SHDN - V180 7.38 ms T1 – T2 V180 - V180 (low) 1.09 T2 – T3 V180 (low) - VCORE 2.06 T0 – T1 FST_SHDN - V180 6.99 T1 – T2 V180 - V180 (low) 0.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 51 of 170 2.1 Application Interface 73 If the FST_SHDN functionality is not used, the FST_SHDN line can be left open because of a configured internal pull-up resistor. If there is a reasonable probability for sudden power losses, Thales recommends to implement a circuit using the FST_SHDN line with a capacitor to buffer sufficient energy to complete the fast shutdown - see below for sample capacity calculation.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 52 of 170 2.1 Application Interface 73 2.1.11.4 SIM Switch The UICC/USIM/SIM interface lines may be connected to an external SIM card multiplexer controlled by the SIM_SWITCH signal as shown in Figure 25. Thus, it becomes possible to switch between two networks/subscriptions each with their own UICC, and maybe different connection speeds. Please note that hot SIM insert/removal is only possible on the first SIM interface.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 53 of 170 2.2 RF Antenna Interface 73 2.2 RF Antenna Interface The RF interface has an impedance of 50Ω. TX62/TX82 is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, modulation accuracy and harmonic suppression.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 54 of 170 2.2 RF Antenna Interface 73 Table 11: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Min.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 55 of 170 2.2 RF Antenna Interface 73 Table 11: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Min.2 Conditions LTE Cat NB1/2: Power @ ARP with 50Ω Load, NTNV Configuration ID: 1, UL: Modulation: BPSK; Subcarrier: 1;Subcarrier space: 3.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 56 of 170 2.2 RF Antenna Interface 73 Table 11: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min.2 Typical TX62-W GSM 850/900 RF Power @ ARP with 50Ω Load, (ROPR = 5) Unit TX82-W GPRS, 1 TX 32.5 dBm GPRS, 2 TX 23.5 dBm EDGE, 1 TX 27.0 dBm EDGE, 2TX 27.0 dBm GSM 1800/1900 GPRS, 1 TX 29.5 dBm GPRS, 2 TX 29.5 dBm EDGE, 1 TX 26.0 dBm EDGE, 2TX 26.0 dBm GPRS, 1 TX 32.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 57 of 170 2.2 RF Antenna Interface 73 Table 12: RF Antenna interface GSM / LTE1 of TX62-W-B and TX82-W-B Parameter Conditions Min.2 Typical Unit TX62-W-B TX82-W-B LTE connectivity (Cat M1) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 85 LTE Cat M1: Receiver Input Sensitivity @NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=6; DL: Modulation: QPSK; NRB=4; LTE 2100 Band 1 -103 -106.5 dBm LTE 1800 Band 2 -101 -106.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 58 of 170 2.2 RF Antenna Interface 73 Table 12: RF Antenna interface GSM / LTE1 of TX62-W-B and TX82-W-B Parameter Min.2 Conditions Typical Unit TX62-W-B TX82-W-B LTE connectivity (Cat NB1/2) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 28, 66, 713, 85 LTE Cat NB1/2: Receiver Input Sensitivity @NTNV DL: Modulation: QPSK; Subcarriers: 12; UL: Modulation: BPSK; Subcarrier spacing: 15KHz; Ntones: 1@0 LTE 2100 Band 1 -108.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 59 of 170 2.2 RF Antenna Interface 73 Table 12: RF Antenna interface GSM / LTE1 of TX62-W-B and TX82-W-B Parameter Conditions Min.2 Typical Unit TX62-W-B TX82-W-B GPRS coding schemes Class 10, CS1 to CS4 EGPRS Class 10, MCS1 to MCS9 GSM Class Small MS GPRS Static Receiver input Sensitivity @ PDTCH/CS-1 GSM 850/900 TBD. TBD. dBm GSM 1800/1900 TBD. TBD. dBm RF Power @ GSM 850/900 ARP with 50Ω Load, GPRS, 1 TX TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 60 of 170 2.2 RF Antenna Interface 73 Table 12: RF Antenna interface GSM / LTE1 of TX62-W-B and TX82-W-B Parameter Conditions Min.2 Typical Unit TX62-W-B TX82-W-B GSM 850/900 RF Power @ ARP with 50Ω Load, (ROPR = 8, i.e. maximum reduction) GSM 1800/1900 GPRS, 1 TX TBD. dBm GPRS, 2 TX TBD. dBm EDGE, 1 TX TBD. dBm EDGE, 2TX TBD. dBm GPRS, 1 TX TBD. dBm GPRS, 2 TX TBD. dBm EDGE, 1 TX TBD. dBm EDGE, 2TX TBD. dBm 1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 61 of 170 2.2 RF Antenna Interface 73 Table 13: RF Antenna interface LTE of TX62-W-C Parameter Conditions LTE connectivity (Cat NB1/2) 2 LTE Cat NB1/2: Receiver Input Sensitivity @NTNV DL: Modulation: QPSK; Subcarriers: 12; UL: Modulation: BPSK; Subcarrier spacing: 15KHz; Ntones: 1@0 LTE Cat NB1/2: Power @ ARP with 50Ω Load, NTNV Configuration ID: 1, UL: Modulation: BPSK; Subcarrier: 1;Subcarrier space: 3.75 kHz; Ntones: 1@0 Min.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 62 of 170 2.2 RF Antenna Interface 73 2.2.2 Antenna Installation The antennas is connected by soldering the antenna pads (RF_OUT, ANT_GNSS) and its neighboring ground pads directly to the application’s PCB. Marking GND GND GND GND RF_OUT ANT_GNSS Figure 26: Antenna pads (top view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 63 of 170 2.2 RF Antenna Interface 73 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from https://www.awr.com/software/options/tx-line (free software).
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 64 of 170 2.2 RF Antenna Interface 73 Micro-Stripline This section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 28: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 1 t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 65 of 170 2.2 RF Antenna Interface 73 Application board Ground line Antenna line Ground line Figure 29: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 2 t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 66 of 170 2.2 RF Antenna Interface 73 • Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separation). Application board Ground line Antenna line Ground line Figure 30: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 1 t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 67 of 170 2.2 RF Antenna Interface 73 Application board Ground line Antenna line Ground line Figure 31: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 2 t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 68 of 170 2.2 RF Antenna Interface 73 2.2.3.2 Routing Example Interface to RF Connector Figure 32 shows the connection of the module‘s antenna pad with an application PCB‘s coaxial antenna connector. Please note that the TX62/TX82 bottom plane appears mirrored, since it is viewed from TX62/TX82 top side. By definition the top of customer's board shall mate with the bottom of the TX62/TX82 module.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 69 of 170 2.3 GNSS Interface 73 2.3 GNSS Interface 2.3.1 GNSS Receiver TX62/TX82 integrates a GNSS receiver that offers the full performance of GPS/GLONASS/BeiDou/Galileo technology. The GNSS receiver is able to continuously track all satellites in view, thus providing accurate satellite position data. The integrated GNSS receiver supports the NMEA protocol via ASC0 interface.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 70 of 170 2.3 GNSS Interface 73 2.3.3 GNSS Antenna Interface Characteristics Table 14: GNSS properties Parameter Conditions Horizontal accuracy 50% CEP, open sky Maximal update rate Frequency Tracking Sensitivity Acquisition Sensitivity Time-to-First-Fix (TTFF)1 Min. Typical Max. Unit 2 m 1 Hz GPS 1573.397 1575.420 1576.443 MHz GLONASS 1598.563 1602.563 1606.563 Beidou 1559.052 1561.098 1563.144 Galileo 1573.397 1575.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 71 of 170 2.4 Sample Application 73 2.4 Sample Application Figure 34 shows a typical example of how to integrate a TX62/TX82 module with an application. Usage of the various host interfaces depends on the desired features of the application. Note that the sample application is not optimized for low current consumption.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 72 of 170 2.4 Sample Application 73 For switch on circuit see Section 3.2.1 BATT+BB TXx2-W 150K Main antenna GND RF_OUT 22K ESD ** GND ON GND 10K ANT_GNSS GNSS antenna ESD ** GND RF * EMERG_RST 100K BATT+RF 150µF, Low ESR! RF * V180 Power indication BATT+BB 0K 33pF 47µF, Low ESR! 22K 100K 33pF Power supply Low ESR!, e.g., X7 R MLCC VCORE Blocking**** Blocking**** Blocking**** 5 4 8 3 GPIO20...
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 73 of 170 2.4 Sample Application 73 2.4.1 Sample Level Conversion Circuit Depending on the micro controller used by an external application TX62/TX82‘s digital input and output lines (i.e., ASC0, ASC1) may require level conversion. The following Figure 35 shows a sample circuit with recommended level shifters for an external application‘s micro controller (with VLOGIC between 3.0V...3.6V).
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 74 of 170 3 Operating Characteristics 120 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 15: Overview of operating modes Mode Function Normal operation Data transfer GSM/(E)GPRS/LTE M1 NB1/2 data transfer in progress.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 75 of 170 3.2 Power Up/Power Down Scenarios 120 3.2 Power Up/Power Down Scenarios Do not turn on TX62/TX82 while it is beyond the safety limits of voltage stated in Section 2.1.2.1. TX62/TX82 immediately switches off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 76 of 170 3.2 Power Up/Power Down Scenarios 120 T0 T1 T2 T3 T4 T5 For timing values see Table 16.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 77 of 170 3.2 Power Up/Power Down Scenarios 120 Table 16: ON startup timing values Timing Description Typical value Unit T0 - T1 Minimum startup time 50 ms T1 - T2 Recommended ON pulse 30 ms T2 - T3 ON – VCORE 23.85 ms T3 - T4 VCORE – V180 300.25 µs T4 - T5 V180 – FST_SHDN 2.78 s T5 - T6 FST_SHDN - ^SYSSTART 0.43 s T0 - T1 Minimum startup time 50 ms T1 - T2 Recommended ON pulse 30 ms T2 - T3 ON – VCORE 23.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 78 of 170 3.2 Power Up/Power Down Scenarios 120 3.2.1.2 Automatic Power On When an automatic power on circuit is required for the module application, the ON pulse must be generated after BATT+ is applied. To achieve this, it is recommend to add a monoflop circuit. With the initial switch on after BATT+ was applied, the pulse of the ON signal must be longer than 1ms.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 79 of 170 3.2 Power Up/Power Down Scenarios 120 3.2.2 Restart TX62/TX82 After startup TX62/TX82 can be re-started as described in the following sections: • Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.2.2.1). • Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.2.2.2) 3.2.2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 80 of 170 3.2 Power Up/Power Down Scenarios 120 Table 17: EMERG_RST restart timing values Timing Description Typical value Unit T0 - T1 EMERG_RST - V180 763.42 ms T1 - T2 V180 – V180 (low) 1.05 T2 - T3 V180 (low) – VCORE 3.96 T0 - T1 EMERG_RST - V180 771.22 T1 - T2 V180 – V180 (low) 0.94 T2 - T3 V180 (low) – VCORE 4.09 T0 - T1 EMERG_RST - V180 767.14 T1 - T2 V180 – V180 (low) 0.62 T2 - T3 V180 (low) – VCORE 2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 81 of 170 3.2 Power Up/Power Down Scenarios 120 3.2.3 Signal States after Startup Table 18 describes various states interface signals pass through after startup until the system is active. Signals are in an initial state while the module is initializing. Once the startup initialization has completed, i.e. when the software is running, all signals are in a defined state, the module is ready to receive and transmit data.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 82 of 170 3.2 Power Up/Power Down Scenarios 120 3.2.4 Turn off TX62/TX82 To switch the module off the following procedures may be used: • Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1. • Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN line to low. See Section 2.1.11.3.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 83 of 170 3.2 Power Up/Power Down Scenarios 120 t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 84 of 170 3.2 Power Up/Power Down Scenarios 120 Table 19: Switch off timing values (AT^SMSO) Timing Description Typical value Unit T0 - T1 AT^SMSO – URC 294.131 (depending on network) ms T1 - T2 URC – V180 13.68 T2 - T3 V180 – V180 (low) 0.83 T3 - T4 V180 (low) – VCORE 2.41 T0 - T1 AT^SMSO – URC 302.631 (depending on network) T1 - T2 URC – V180 13.70 T2 - T3 V180 – V180 (low) 0.70 T3 - T4 V180 (low) – VCORE 2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 85 of 170 3.2 Power Up/Power Down Scenarios 120 Table 20: Switch off timing values (AT^SMSO=”fast”) Timing Description Typical value Unit T0 - T1 AT^SMSO=”fast” – URC 3.34 ms T1 - T2 URC – V180 1.51 T2 - T3 V180 – V180 (low) 0.83 T3 - T4 V180 (low) – VCORE 2.39 T0 - T1 AT^SMSO=”fast” – URC 3.48 T1 - T2 URC – V180 8.87 T2 - T3 V180 – V180 (low) 0.67 T3 - T4 V180 (low) – VCORE 2.53 T0 - T1 AT^SMSO=”fast” – URC 4.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 86 of 170 3.2 Power Up/Power Down Scenarios 120 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs: • The TX62/TX82 board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.2.5.1) • Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT command, i.e.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 87 of 170 3.2 Power Up/Power Down Scenarios 120 3.2.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 4. When the average supply voltage measured by TX62/TX82 approaches the undervoltage shutdown threshold (i.e., 0.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 88 of 170 3.2 Power Up/Power Down Scenarios 120 TX82. Especially the power amplifier linked to BATT+RF is sensitive to high voltage and might even be destroyed. t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 89 of 170 3.3 Power Saving 120 3.3 Power Saving TX62/TX82 can control its power consumption through specific features as summarized in Table 22, and further detailed in the following sections. The mentioned operating modes are detailed in Section 3.1. For typical power supply ratings during power saving please refer to Section 3.4.1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 90 of 170 3.3 Power Saving 120 3.3.1 Low Power Modes There are two specific low power modes available that can be configured to allow TX62/TX82 to save power - SLEEP mode (Section 3.3.1.1) and SUSPEND mode (Section 3.3.1.2). Figure 41 illustrates how the module transits between its operating modes including SLEEP and SUSPEND modes.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 91 of 170 3.3 Power Saving 120 3.3.1.1 SLEEP Mode SLEEP mode is a module’s low power mode when no call is in progress and there is no active communication on any serial interface (ASC0, ASC1). During SLEEP mode, the serial interfaces are shut down except for RTS0 that may be used to wake up TX62/TX82 from SLEEP mode (see below).
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 92 of 170 3.3 Power Saving 120 3.3.1.2 SUSPEND Mode In contrast to SLEEP mode, SUSPEND mode is a module’s low power mode with almost all components switched off - except for the internal RTC and interrupt triggered wake up mechanisms. The module stays registered to the network, and the RRC connection is released. The module is in its lowest power consumption state.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 93 of 170 3.3 Power Saving 120 From SUSPEND mode the module can only be woken up by the ON or EMERG_RST signals, or it may wake up and be reachable again after expiration of a negotiated 3GPP PSM periodic TAU cycle (i.e., network timer) that may include DRX as well as eDRX paging cycles for an inactivity period (see Section 3.3.3.3 for details).
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 94 of 170 3.3 Power Saving 120 3.3.2 Power Saving while Attached to GSM Networks (TX82-W only) Power saving while attached to GSM networks is based on standard DRX values defined for the network (see Section 3.3.2.1). Apart from network based power saving it is possible to use the AT command AT^SCFG="Radio/OutputPowerReduction" for the module in (E)GPRS multislot scenarios to reduce its output power according to 3GPP 45.005.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 95 of 170 3.3 Power Saving 120 3.3.3 Power Saving while Attached to LTE M1 NB1/2 Networks This section describes the power saving possibilities in LTE Cat M1 and LTE Cat NB1/2 networks through DRX (see Section 3.3.3.1) values, as well as configurable eDRX (see Section 3.3.3.2), and 3GPP PSM (see Section 3.3.3.3) timers. 3.3.3.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 96 of 170 3.3 Power Saving 120 3.3.3.2 eDRX (Extended DRX Configuration) TX62/TX82 and the network may negotiate the use of eDRX (extended DRX) to reduce power consumption, while being available for mobile terminating data and/or network originated procedures within a certain delay dependent on the network negotiated eDRX cycle value (see also Section 3.3.1.2).
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 97 of 170 3.3 Power Saving 120 3.3.3.3 3GPP PSM Configuration TX62/TX82 can be configured to use 3GPP PSM to reduce power consumption. PSM is similar to power off, while TX62/TX82 remains registered with the network. There is no need to reattach or re-establish PDN connections. TX62/TX82 in PSM is not immediately reachable for mobile terminating services (see also SUSPEND mode in Section 3.3.1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 98 of 170 3.4 Power Supply 120 3.4 Power Supply TX62/TX82 needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+: • BATT+BB with a line mainly for the baseband power supply. • BATT+RF with a line for the GSM/LTE power amplifier supply. Please note that this line does not have to be connected with TX62-W.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 99 of 170 3.4 Power Supply 120 Table 24: General current consumption ratings (TX62/TX82) Description Conditions Typical rating TX62-W IBATT+1 OFF state State after initially connecting VBATT+ and/or 14 supply cur- after a fast shutdown triggered via FST_SHDN (i.e., sum of rent BATT+BB State after switching a running module off 4.5 and via AT^SMSO BATT+RF2 ) Airplane UART (RTS) active 12 mode 0.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 100 of 170 3.4 Power Supply 120 Table 25: Current consumption ratings Cat M1 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Average LTE CATM1 supply current Unit TX62-W TX62-W-B TX62-W-C TX82-W TX82-W-B RRC connected Active Transmission3 Band1, 23dBm - 226 242 - TBD. mA Band2, 23dBm - 224 - - TBD. mA Band3, 23dBm - 230 198 - TBD. mA Band4, 23dBm - 235 - - TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 101 of 170 3.4 Power Supply 120 Table 25: Current consumption ratings Cat M1 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Average LTE CATM1 supply current RRC connected Active Transmission3 Peak Current @ RRC connected Active Transmission3 VBATT = 3.8V TX62-W-B, TX82-W-B, and TX62-W-C4 only t Typical rating Unit TX62-W TX62-W-B TX62-W-C TX82-W TX82-W-B Band1, 0dBm 103 131 112 105 TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 102 of 170 3.4 Power Supply 120 Table 25: Current consumption ratings Cat M1 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Peak Current @ RRC connected Active Transmission3 VBATT = 3.8V Peak Current @ RRC connected Active Transmission3 VBATT= 2.5V (TX62-W-B) VBATT= 3.2V (TX62-W-C) VBATT= TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 103 of 170 3.4 Power Supply 120 Table 25: Current consumption ratings Cat M1 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Peak Current @ RRC connected Active Transmission3 VBATT = 2.55V (TX62W) VBATT = 2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 104 of 170 3.4 Power Supply 120 Table 26: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Average SUSPEND LTE NB1/2 RRC idle supply (SLEEP)2 current 2 RRC idle (SUSPEND)2 t Typical rating Unit TX62-W TX62-W-B TX62-W-C TX82-W TX82-W-B Power save mode 3.8 4.5 21.5 4.5 TBD. µA DRX=1024 0.77 0.79 0.79 0.88 TBD. mA DRX=512 1.08 1.09 1.17 1.17 TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 105 of 170 3.4 Power Supply 120 Table 26: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+ 1 (i.e.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 106 of 170 3.4 Power Supply 120 Table 26: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Average LTE NB1/2 supply current Unit TX62-W TX62-W-B TX62-W-C TX82-W TX82-W-B RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing3 Band1, 23dBm - 232 259 - TBD. mA Band2, 23dBm - 237 - - TBD. mA Band3, 23dBm - 228 213 - TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 107 of 170 3.4 Power Supply 120 Table 26: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Average LTE NB1/2 supply current t RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing3 Typical rating Unit TX62-W TX62-W-B TX62-W-C TX82-W TX82-W-B Band1, 0dBm 61 111 80 62 TBD. mA Band2, 0dBm 61 98 - 61 TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 108 of 170 3.4 Power Supply 120 Table 26: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+ 1 (i.e.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 109 of 170 3.4 Power Supply 120 Table 26: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Average LTE NB1/2 supply current RRC connected Active Transmission UL RMC, multitone mode (12 subcarrier),15kHz spacing3 Peak Current @ RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing3 VBATT=3.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 110 of 170 3.4 Power Supply 120 Table 26: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+ 1 (i.e., only BATT+BB ) Conditions Peak Current @ RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing3 VBATT=3.8V Peak Current @ RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing3 VBATT=2.5V (TX62-W-B) VBATT=3.2V (TX62-W-C) VBATT=TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 111 of 170 3.4 Power Supply 120 Table 26: Current consumption ratings Cat NB1/2 (TX62/TX82) Description IBATT+ 1 (i.e.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 112 of 170 3.4 Power Supply 120 Table 27: Current consumption ratings General and GSM (TX82-W and TX82-W-B) Description IBATT+1 (i.e., sum of BATT+BB and BATT+RF) Conditions Typical rating TX82-W TX82-W-B 0.78 TBD. mA 0.95 TBD. mA SLEEP2@DRX=2 (no communication via UART) 1.58 TBD. mA SLEEP3@DRX=2 (no communication via UART) 13 TBD. mA ROPR=8 230 (max. reduction) TBD. mA ROPR=4 (no reduction) 232 TBD. mA ROPR=8 323 (max.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 113 of 170 3.4 Power Supply 120 Table 27: Current consumption ratings General and GSM (TX82-W and TX82-W-B) Description Conditions Typical rating TX82-W 1 IBATT+ (i.e., sum of BATT+BB and BATT+RF) Average GSM EDGE Data transfer GSM900; ROPR=8 229 supply current PCL=5; 2Tx/3Rx (max. reduction) (GNSS off) ROPR=4 256 (no reduction) mA TBD. mA ROPR=8 182 (max. reduction) TBD. mA ROPR=4 (no reduction) 183 TBD. mA ROPR=8 248 (max.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 114 of 170 3.4 Power Supply 120 Table 27: Current consumption ratings General and GSM (TX82-W and TX82-W-B) Description 1 IBATT+ (i.e., sum of BATT+BB and BATT+RF) Conditions Peak current during GSM transmit burst @ 3.0V Typical rating Unit TX82-W TX82-W-B GPRS Data transfer GSM850; PCL=5; 2Tx/3Rx 1.76 TBD. A GPRS Data transfer GSM900; PCL=5; 2Tx/3Rx 1.76 TBD. A GPRS Data transfer GSM1800; PCL=0; 2Tx/3Rx 1.23 TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 115 of 170 3.4 Power Supply 120 3.4.2 Minimizing Power Losses For TX82-W only: When designing the power supply for your application (and with GSM enabled) please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.1V on the TX82-W board, not even in a GSM transmit burst where current consumption can rise (for peak values see the power supply ratings listed in Section 3.4.1).
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 116 of 170 3.5 Operating Temperatures 120 3.4.4 Monitoring Power Supply by AT Command To monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND. The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 117 of 170 3.6 Electrostatic Discharge 120 3.6 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a TX62/TX82 module.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 118 of 170 3.7 Blocking against RF on Interface Lines 120 3.7 Blocking against RF on Interface Lines To reduce EMI issues there are serial resistors, or capacitors to GND, implemented on the module for the ignition, emergency restart, and SIM interface lines (cp. Section 2.4). However, all other signal lines have no EMI measures on the module and there are no blocking measures at the module’s interface to an external application.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 119 of 170 3.7 Blocking against RF on Interface Lines 120 The following table lists for each signal line at the module‘s SMT application interface the EMI measures that may be implemented. Table 31: EMI measures on the application interface Signal name EMI measures A B C CCIN Remark D E x CCRST x The external capacitor should be not higher than 1nF.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 120 of 170 3.8 Reliability Characteristics 120 3.8 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 121 of 170 4 Mechanical Dimensions, Mounting and Packaging 142 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of TX62-W Figure 54 shows the top and bottom view of TX62-W and provides an overview of the board's mechanical dimensions. For further details see Figure 55. Figure 56 shows the area at the module’s bottom side where possible markings might be printed.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 122 of 170 4.1 Mechanical Dimensions of TX62-W 142 Figure 55: Dimensions of TX62-W (all dimensions in mm) Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.42mm clearance from specified marks to LGA pads Figure 56: Dimensions of area for possible markings TX62-W (bottom view) t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 123 of 170 4.2 Mechanical Dimensions of TX82-W, TX82-W-B, TX62-W-B and TX62-W-C 142 4.2 Mechanical Dimensions of TX82-W, TX82-W-B, TX62-W-B and TX62-W-C Figure 57 shows the top and bottom view of TX82-W, TX82-W-B, TX62-W-B, and TX62-W-C, and provides an overview of the board's mechanical dimensions. For further details see Figure 59. Figure 60 shows the area at the module’s bottom side where possible markings might be printed.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 124 of 170 4.2 Mechanical Dimensions of TX82-W, TX82-W-B, TX62-W-B and TX62-W-C 142 Figure 58: Dimensions of TX82-W and TX62-W-B (all dimensions in mm) Figure 59: Dimensions of TX82-W-B and TX62-W-C (all dimensions in mm) t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 125 of 170 4.2 Mechanical Dimensions of TX82-W, TX82-W-B, TX62-W-B and TX62-W-C 142 Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.42mm clearance from specified marks to LGA pads Figure 60: Dimensions of area for possible markings TX82-W, TX82-W-B, TX62-W-B and TX62-W-C (bottom view) t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 126 of 170 4.3 Mounting TX62/TX82 onto the Application Platform 142 4.3 Mounting TX62/TX82 onto the Application Platform This section describes how to mount TX62/TX82 onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [5].
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 127 of 170 4.3 Mounting TX62/TX82 onto the Application Platform 142 . Figure 62: Land pattern TX82-W, TX82-W-B, TX62-W-B and TX62-W-C (top view) The stencil design illustrated in Figure 63 and Figure 64 is recommended by Thales as a result of extensive tests with Thales Daisy Chain modules.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 128 of 170 4.3 Mounting TX62/TX82 onto the Application Platform 142 Figure 63: Recommended design for 110µm thick stencil for TX62-W (top view) Figure 64: Recommended design for 110µm thick stencil for TX82-W, TX82-W-B, TX62-W-B and TX62-W-C (top view) 4.3.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT process.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 129 of 170 4.3 Mounting TX62/TX82 onto the Application Platform 142 It is recommended to characterize land patterns before an actual PCB production, taking individual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 4.3.1.1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 130 of 170 4.3 Mounting TX62/TX82 onto the Application Platform 142 4.3.3 Soldering Conditions and Temperature 4.3.3.1 Reflow Profile tP TP TL tL TSmax Temperature TSmin tS Preheat t to maximum Time Figure 65: Reflow Profile t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 131 of 170 4.3 Mounting TX62/TX82 onto the Application Platform 142 Table 33: Reflow temperature ratings1 Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) 150°C 180°C 60-120 seconds Average ramp up rate (TSmax to TP) 3K/second max.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 132 of 170 4.3 Mounting TX62/TX82 onto the Application Platform 142 4.3.4 Durability and Mechanical Handling 4.3.4.1 Storage Conditions TX62/TX82 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 133 of 170 4.3 Mounting TX62/TX82 onto the Application Platform 142 4.3.4.2 Processing Life TX62/TX82 must be soldered to an application within 72 hours after opening the moisture barrier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30°C and a relative humidity below 60%. 4.3.4.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 134 of 170 4.4 Packaging 142 4.4 Packaging 4.4.1 Tape and Reel The single-feed tape carrier for TX62/TX82 is illustrated in Figure 66. The figure also shows the proper part orientation. The tape width is 24mm and the TX62/TX82 modules are placed on the tape with a 22mm pitch. The reels are 330mm in diameter with a core diameter of 99.50mm. Each reel contains 500 modules. 4.4.1.1 Orientation A0: 15.80mm F: 11.50mm T: 0.30mm B0: 15.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 135 of 170 4.4 Packaging 142 Figure 67: Reel direction (TX62-W only) 4.4.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 68: Barcode label on tape reel t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 136 of 170 4.4 Packaging 142 Figure 69: Barcode label on tape reel - layout Variables on the label are explained in Table 35. t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 137 of 170 4.4 Packaging 142 4.4.2 Shipping Materials TX62/TX82 is distributed in tape and reel carriers. The tape and reel carriers used to distribute TX62/TX82 are packed as described below, including the following required shipping materials: • Moisture barrier bag, including desiccant and humidity indicator card • Transportation box 4.4.2.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 138 of 170 4.4 Packaging 142 Figure 71: Moisture Sensitivity Label t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 139 of 170 4.4 Packaging 142 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 140 of 170 4.4 Packaging 142 4.4.2.2 Transportation Box Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 500 modules each. 1 2 3 4 5 8 6 9 7 10 11 12 14 13 Figure 73: Sample of VP box label Table 35: VP Box label information No.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 141 of 170 4.4 Packaging 142 4.4.3 Trays (TBD) If small module quantities are required, e.g., for test and evaluation purposes, TX62/TX82 may be distributed in trays (for dimensions see Figure 77). The small quantity trays are an alternative to the single-feed tape carriers normally used. However, the trays are not designed for machine processing.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 142 of 170 4.4 Packaging 142 T.B.D. Figure 77: Tray dimensions (TBD.) t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 143 of 170 5 Regulatory and Type Approval Information 154 5 Regulatory and Type Approval Information 5.1 Directives and Standards TX62/TX82 is designed to comply with the directives and standards listed below.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 144 of 170 5.1 Directives and Standards 154 Table 38: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station (MS) conformance specification; GCF-CC V3.71 Global Certification Forum - Certification Criteria ETSI EN 301 511 V12.5.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 145 of 170 5.1 Directives and Standards 154 Table 40: Standards of the Ministry of Information Industry of the People’s Republic of China SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 146 of 170 5.1 Directives and Standards 154 5.1.1 IEC 62368-1 Classification With respect to the safety requirements for audio/video, information and communication technology equipment defined by the hazard based product safety standard for ICT and AV equipment - i.e., IEC-62368-1 (EN 62368-1, UL 62368-1) - Cinterion® modules are classified as shown below: Standalone operation of the modules is not possible.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 147 of 170 5.1 Directives and Standards 154 Table 42: IEC 62368-1 Classification Source of Energy Class Limits Hazardous Substances, Chemical reaction -- Under regular conditions, the Cinterion® module does not contain any chemically reactive substances, and no chemical energy source, especially no battery. Module is compliant with RoHS and REACH (see above). In very rare cases however - under abnormal conditions (i.e.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 148 of 170 5.2 SAR requirements specific to portable mobiles 154 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a module must be in accordance with the guidelines for human exposure to radio frequency energy.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 149 of 170 5.3 Reference Equipment for Type Approval 154 5.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 151 of 170 5.4 Compliance with FCC and ISED Rules and Regulations 154 Table 43: Antenna gain limits for FCC and ISED for TX82-W Maximum gain in operating band FCC limit ISED limit All limits Unit PCS1900 10.20 10.20 10.20 dBi All limits Unit Table 44: Antenna gain limits for FCC and ISED for TX82-W-B - TBD.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 152 of 170 5.4 Compliance with FCC and ISED Rules and Regulations 154 Table 46: Antenna gain limits for FCC and ISED for TX62-W-B Maximum gain in operating band FCC limit ISED limit All limits Unit LTE Band 26 9.41 6.10 6.10 dBi LTE Band 66 5.00 5.00 5.00 dBi LTE Band 71 8.47 5.45 5.45 dBi LTE Band 85 8.60 5.61 5.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 153 of 170 5.4 Compliance with FCC and ISED Rules and Regulations 154 Notes (ISED): (EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 154 of 170 5.5 Compliance with Korean Rules and Regulations (TX62-W-B) 154 5.5 Compliance with Korean Rules and Regulations (TX62-W-B) The TX62-W-B reference application described in Section 5.3 complies with the requirements of the Korean Certification (KC). The certificate granted in accordance with KC has the identifier: R-C-QIP-TX62-W-B Identifier and the KC (certification) logo are part of the module’s label.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 155 of 170 6 Document Information 164 6 Document Information 6.1 Revision History Preceding document: “Cinterion® TX62-W/TX82-W Hardware Interface Description" v01.200c New document: "Cinterion® TX62-W/TX82-W Hardware Interface Description" v01.200d Chapter What is new 5.4 Table 43 band 85 information added. Preceding document: “Cinterion® TX62-W/TX82-W Hardware Interface Description" v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 156 of 170 6.1 Revision History 164 Chapter What is new 3.4.1 Updated power supply ratings for TX62-W-C. 4.2 Updated section showing mechanical dimensions. Preceding document: “Cinterion® TX62-W(-B)/TX82-W Hardware Interface Description" v00.026b New document: "Cinterion® TX62-W/TX82-W Hardware Interface Description" v01.000 Chapter What is new Throughout document Added new Variant: TX62-W-C. 2.1.2, 3.2.1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 157 of 170 6.1 Revision History 164 Chapter What is new 5.1 Replaced UL 60950 with UL 62368-1 in Table 37. 5.1.1 Completed Table 42 regarding hazardous substances, chemical reaction. 5.2 Added remark regarding responsibility of the end device manufacturer. Preceding document: “Cinterion® TX62-W(-B)/TX82-W Hardware Interface Description" v00.026 New document: "Cinterion® TX62-W(-B)/TX82-W Hardware Interface Description" v00.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 158 of 170 6.1 Revision History 164 4.3.1.1 Revised stencil shown in Figure 64. 7.1 Updated ordering information. Preceding document: “Cinterion® TXx2-W Hardware Interface Description" v00.002 New document: "Cinterion® TXx2-W Hardware Interface Description" v00.016 Chapter What is new Throughout document Added product TX82-W and TX62-W-B 1.2 Added GPIO to Key Feature at a Glance 2.1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 159 of 170 6.1 Revision History 164 Chapter What is new 4.3.1.1 Changed Stencil thickness to 110µm and Stencil pattern in Figure 63 4.4.1.1 Revised Figure 66 and Figure 67 Preceding document: "Cinterion® TXx2-W Hardware Interface Description" v00.200 New document: "Cinterion® TXx2-W Hardware Interface Description" v00.200a Chapter What is new 1.2 Removed extended voltage range and changed eUICC size MFF2 to MFF-XS 1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 160 of 170 6.2 Related Documents 164 Chapter What is new 3.4.1 Revised Table 23 related to power supply 4.2 New section Mechanical Dimensions of TX82-W, TX82-W-B, TX62-W-B and TX62-W-C 4.3.1.1 Added Land pattern and Stencil for TX82-W New document: "Cinterion® TX62-W/TX82-W Hardware Interface Description" v00.038 Chapter What is new -- Initial document setup. 6.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 161 of 170 6.3 Terms and Abbreviations 164 Abbreviation Description CTS Clear to Send DAC Digital-to-Analog Converter DAI Digital Audio Interface dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law DCE Data Communication Equipment (typically modems, e.g.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 162 of 170 6.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 163 of 170 6.3 Terms and Abbreviations 164 Abbreviation Description SIM Subscriber Identification Module SMD Surface Mount Device SMS Short Message Service SMT Surface Mount Technology SPI Serial Peripheral Interface SRAM Static Random Access Memory TA Terminal adapter (e.g.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 164 of 170 6.4 Safety Precaution Notes 164 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating TX62/TX82.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 165 of 170 7 Appendix 169 7 Appendix 7.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 166 of 170 7.1 List of Parts and Accessories 169 Table 47: List of parts and accessories Description Supplier Ordering information TX82-W Thales Standard module Thales IMEI: Packaging unit (ordering) number: L30960-N6600-A130 Module label number1: S30960-S6600-A130-1. Standard module with AT&T and Verizon approval Thales IMEI: Packaging unit (ordering) number: L30960-N6600-B130 Module label number1: S30960-S6600-B130-1.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 167 of 170 7.1 List of Parts and Accessories 169 Table 47: List of parts and accessories Description Supplier Ordering information LGA DevKit Thales LGA DevKit consists of Cinterion® LGA DevKit T Base PCB: Ordering number: L30960-N0113-A100 Cinterion® LGA DevKit Socket T: Ordering number: L30960-N0114-A100 Thales EVAL DSB Adapter for mounting TX62/TX82 evaluation modules onto DSB75 SIM card holder incl.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 168 of 170 7.2 Module Label Information 169 7.2 Module Label Information The label engraved on the top of TX62/TX82 comprises the following information. 2 1 3 5 14 4 13 12 6 11 10 9 7 8 2 1 3 5 13 4 12 6 11 14 7 8 10 9 2 1 3 5 13 4 12 6 10 11 14 7 8 16 9 15 Figure 80: TX62/TX82/TX62-W-B label t TX62-W_TX62-W-x_TX82-W-x_HID_v01.
Cinterion® TX62-W/TX82-W Hardware Interface Description Page 169 of 170 7.2 Module Label Information 169 2 1 3 5 13 4 TBD. 12 6 10 11 14 7 8 16 9 15 Figure 81: TX82-W-B label Table 49: TX62/TX82 label information No. 1 Cinterion logo 2 Manufacturing country (e.g., “Made in China”) 3 Factory code (e.g. “H”) 4 Product name/variant (e.g.
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