Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 4.1 Mechanical Dimensions of TX62-W
- 4.2 Mechanical Dimensions of TX82-W, TX82-W-B, TX62-W-B and TX62-W-C
- 4.3 Mounting TX62/TX82 onto the Application Platform
- 4.4 Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
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TX62-W/TX82-W Hardware Interface Description
4.3 Mounting TX62/TX82 onto the Application Platform
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4.3 Mounting TX62/TX82 onto the Application Platform
This section describes how to mount TX62/TX82 onto the PCBs, including land pattern and
stencil design, board-level characterization, soldering conditions, durability and mechanical
handling. For more information on issues related to SMT module integration see also [5].
Note: To avoid short circuits between signal tracks on an external application's PCB and vari-
ous markings at the bottom side of the module (see Figure 56 and Figure 60), it is recommend-
ed not to route the signal tracks on the top layer of an external PCB directly under the module,
or at least to ensure that signal track routes are sufficiently covered with solder resist.
Note: Do not place external components or devices that might cause any pressure on the mod-
ule’s shielding. See [4] and [5] for further details of thermal and integration guidance.
4.3.1 SMT PCB Assembly
4.3.1.1 Land Pattern and Stencil
The land pattern and stencil design as shown below is based on Thales characterizations for
lead-free solder paste on a four-layer test PCB and a 110 micron thick stencil.
The land pattern given in Figure 61 and Figure 62 reflects the module‘s pad layout, including
signal pads and ground pads (for pad assignment see Section 2.1.1).
Figure 61: Land pattern TX62-W (top view)