Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 4.1 Mechanical Dimensions of TX62-W
- 4.2 Mechanical Dimensions of TX82-W, TX82-W-B, TX62-W-B and TX62-W-C
- 4.3 Mounting TX62/TX82 onto the Application Platform
- 4.4 Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
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TX62-W/TX82-W Hardware Interface Description
4.3 Mounting TX62/TX82 onto the Application Platform
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Figure 63: Recommended design for 110µm thick stencil for TX62-W (top view)
Figure 64: Recommended design for 110µm thick stencil for TX82-W, TX82-W-B, TX62-W-B and TX62-W-C (top
view)
4.3.1.2 Board Level Characterization
Board level characterization issues should also be taken into account if devising an SMT pro-
cess.
Characterization tests should attempt to optimize the SMT process with regard to board level
reliability. This can be done by performing the following physical tests on sample boards: Peel
test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface
mount checks are described in [5].